Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35485) > Сторінка 147 з 592
Фото | Назва | Виробник | Інформація |
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MC33887AVW | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 20HSOP Packaging: Tube Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33887AVWR2 | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 20HSOP Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33911BAC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
на замовлення 2580 шт: термін постачання 21-31 дні (днів) |
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MC33911G5ACR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33912G5AC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
на замовлення 1238 шт: термін постачання 21-31 дні (днів) |
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MC33926PNB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-PowerQFN Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-PQFN (8x8) Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
на замовлення 2177 шт: термін постачання 21-31 дні (днів) |
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MC33926PNBR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-PowerQFN Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-PQFN (8x8) Motor Type - AC, DC: Brushed DC Part Status: Active Grade: Automotive |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MC33931VW | NXP USA Inc. |
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на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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MC33932VW | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (4) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 44-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active Grade: Automotive |
на замовлення 437 шт: термін постачання 21-31 дні (днів) |
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MC33932VWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (4) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 44-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active Grade: Automotive |
на замовлення 750 шт: термін постачання 21-31 дні (днів) |
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MC34674BEPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 850mA Programmable Features: Timer Fault Protection: Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34674CEPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 650mA Programmable Features: Timer Fault Protection: Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34674DEPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 450mA Programmable Features: Timer Fault Protection: Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34700EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 9V ~ 18V Frequency - Switching: 800kHz Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1) Supplier Device Package: 32-QFN-EP (5x5) Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34712EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 1.35V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 24-QFN-EP (4x4) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34713EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 24-QFN-EP (4x4) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34716EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34717EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34727CFCR2 | NXP USA Inc. |
Description: IC REG BUCK 3.3V 600MA 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Output Type: Fixed Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 600mA Operating Temperature: -25°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 8-USON (2x2) Synchronous Rectifier: Yes Voltage - Input (Min): 3.6V Voltage - Output (Min/Fixed): 3.3V Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34845EP | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34845EPR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34910BACR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34910G5ACR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34911BACR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34911G5ACR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34912BACR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34912G5AC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 18V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) Part Status: Active |
на замовлення 230 шт: термін постачання 21-31 дні (днів) |
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MC35XS3400CPNA | NXP USA Inc. |
![]() Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tray Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 35mOhm (Max) Voltage - Load: 6V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:4 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MC44BS373CADEVK | NXP USA Inc. |
![]() Packaging: Box For Use With/Related Products: MC44BS373CAD Type: Modulator Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MC44BS373CAFCEVK | NXP USA Inc. |
![]() Packaging: Box For Use With/Related Products: MC44BS373CAFC Type: Modulator Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC56F8006DEMO-T | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: DSP Contents: Board(s), Cable(s), Accessories Core Processor: 56800E Utilized IC / Part: MC56F8006 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC56F8014MFAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC56F8027VLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11A1CFNE3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11D0CFBE2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 2MHz RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-QFP (10x10) Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11D0CFNE2 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11D0CFNE3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11E0MFNE2 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11E1CFNE3R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11E1MFNE3 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11E1VFNE3 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K0CFNE3 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 84-PLCC (29.29x29.29) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K0CFUE4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 4MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K1CFNE3 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 84-PLCC (29.29x29.29) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K1CFNE4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 84-PLCC (29.29x29.29) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K1CFUE3 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 3MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K1CFUE4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 4MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC11K1VFNE4 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz RAM Size: 768 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 84-PLCC (29.29x29.29) Number of I/O: 37 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC908EY16MFA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68HC908QT2CFQ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-DFN-EP (4x4) Part Status: Obsolete Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MC7410TVU400LE | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC7448TVU1000ND | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610PX1066JB | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610PX1333JB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610TPX1066JB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.066GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610TPX800GB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610TVT1066JB | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610VT1066JB | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8610VT800GB | NXP USA Inc. |
![]() Packaging: Box Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC8640DHX1000HC | NXP USA Inc. | Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA |
товару немає в наявності |
В кошику од. на суму грн. |
MC33887AVW |
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
товару немає в наявності
В кошику
од. на суму грн.
MC33887AVWR2 |
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
товару немає в наявності
В кошику
од. на суму грн.
MC33911BAC |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
на замовлення 2580 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 355.66 грн |
10+ | 261.30 грн |
25+ | 241.00 грн |
100+ | 205.15 грн |
250+ | 195.14 грн |
500+ | 189.11 грн |
1250+ | 179.74 грн |
2500+ | 175.96 грн |
MC33911G5ACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Description: IC SYSTEM BASIS CHIP 32LQFP
товару немає в наявності
В кошику
од. на суму грн.
MC33912G5AC |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
на замовлення 1238 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 473.95 грн |
10+ | 409.92 грн |
25+ | 387.57 грн |
80+ | 315.22 грн |
230+ | 299.05 грн |
440+ | 268.34 грн |
MC33926PNB |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tray
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tray
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
на замовлення 2177 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 643.85 грн |
10+ | 481.09 грн |
25+ | 446.49 грн |
80+ | 388.17 грн |
230+ | 367.69 грн |
440+ | 357.81 грн |
1300+ | 339.18 грн |
MC33926PNBR2 |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2000+ | 374.10 грн |
MC33931VW |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Description: IC MOTOR DRIVER 5V-28V 44HSOP
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1868.82 грн |
10+ | 1660.09 грн |
25+ | 1585.49 грн |
MC33932VW |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
на замовлення 437 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1705.28 грн |
10+ | 1318.74 грн |
30+ | 1224.28 грн |
120+ | 1069.83 грн |
270+ | 1035.98 грн |
MC33932VWR2 |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
на замовлення 750 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
750+ | 1024.72 грн |
MC34674BEPR2 |
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Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 850mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 850mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
товару немає в наявності
В кошику
од. на суму грн.
MC34674CEPR2 |
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Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
MC34674DEPR2 |
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Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 450mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 450mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
товару немає в наявності
В кошику
од. на суму грн.
MC34700EPR2 |
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Виробник: NXP USA Inc.
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
товару немає в наявності
В кошику
од. на суму грн.
MC34712EPR2 |
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Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34713EPR2 |
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Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34716EPR2 |
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Виробник: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC34717EPR2 |
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Виробник: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
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MC34727CFCR2 |
Виробник: NXP USA Inc.
Description: IC REG BUCK 3.3V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 3.6V
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
Description: IC REG BUCK 3.3V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 3.6V
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
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MC34845EP |
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Виробник: NXP USA Inc.
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
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MC34845EPR2 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
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MC34910BACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
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MC34910G5ACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34911BACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34911G5ACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34912BACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
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MC34912G5AC |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
на замовлення 230 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 423.94 грн |
10+ | 366.65 грн |
25+ | 346.62 грн |
80+ | 281.91 грн |
MC35XS3400CPNA |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:4
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:4
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC44BS373CADEVK |
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Виробник: NXP USA Inc.
Description: KIT EVAL FOR BS373CA 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAD
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT EVAL FOR BS373CA 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAD
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
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MC44BS373CAFCEVK |
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Виробник: NXP USA Inc.
Description: KIT EVAL FOR BS373CAFC 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAFC
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT EVAL FOR BS373CAFC 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAFC
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
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MC56F8006DEMO-T |
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Виробник: NXP USA Inc.
Description: MC56F8006 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8006
Description: MC56F8006 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8006
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MC56F8014MFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
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MC56F8027VLH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC68HC11A1CFNE3R |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11D0CFBE2 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE2 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE3R |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11E0MFNE2 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1CFNE3R |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1MFNE3 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1VFNE3 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11K0CFNE3 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K0CFUE4 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE3 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE4R |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tape & Reel (TR)
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tape & Reel (TR)
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE3 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE4 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1VFNE4 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC908EY16MFA |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Verified
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MC68HC908QT2CFQ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC7410TVU400LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360FCCBGA
Description: IC MPU MPC74XX 400MHZ 360FCCBGA
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MC7448TVU1000ND |
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Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
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MC8610PX1066JB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610PX1333JB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Part Status: Obsolete
Description: IC MPU MPC86XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Part Status: Obsolete
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MC8610TPX1066JB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.066GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.066GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8610TPX800GB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Part Status: Obsolete
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MC8610TVT1066JB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT1066JB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT800GB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Box
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Box
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8640DHX1000HC |
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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