Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35485) > Сторінка 155 з 592
| Фото | Назва | Виробник | Інформація |
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S9S12P128J0MFT | NXP USA Inc. |
 Description: IC MCU 16BIT 128KB FLASH 48QFNPackaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
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S9S12P128J0MLH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
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S9S12P128J0MQK | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 315 шт: термін постачання 21-31 дні (днів) |
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S9S12P32J0MFT | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN Packaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 34 DigiKey Programmable: Not Verified |
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S9S12P64J0MFT | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48QFN Packaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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S9S12P64J0MLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 49 DigiKey Programmable: Not Verified |
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S9S12P64J0MQK | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 64 DigiKey Programmable: Not Verified |
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S9S12P96J0MLH | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 64LQFP |
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S9S12P96J0MQK | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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S9S12XS256J0CAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S9S12XS256J0CAE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
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S9S12XS256J0CAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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| SA5213SLK | NXP USA Inc. |
Description: KIT STUDENT LEARNING M5213 Packaging: Box For Use With/Related Products: M5213 Frequency: 2.4GHz Type: Transceiver Contents: Board(s) Utilized IC / Part: M5213 Supplied Contents: Board(s) |
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SC5554MVR132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Obsolete Number of I/O: 256 DigiKey Programmable: Not Verified |
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SC68376BACAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
.jpg "SC68376BAVAB25") |
SC68376BAVAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Part Status: Obsolete Number of I/O: 18 |
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SC68376BGCAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
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SC68376BGMAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
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SC68376BGVAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP |
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SGTL5000XNAA3 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32-QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 32-QFN-EP (5x5) Part Status: Obsolete |
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SGTL5000XNAA3R2 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32-QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 32-QFN-EP (5x5) Part Status: Obsolete |
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SGTL5000XNLA3 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 20-QFN Packaging: Tray Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 20-QFN-EP (3x3) Part Status: Active |
на замовлення 26113 шт: термін постачання 21-31 дні (днів) |
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SGTL5000XNLA3R2 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 20-QFN-EP (3x3) Part Status: Active |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| SOUNDBITE | NXP USA Inc. |
Description: BOARD DEMO AUDIO DEVELOPMENT Packaging: Box Function: Audio Processing Type: Audio Utilized IC / Part: DSPB56371 Supplied Contents: Board(s), Cable(s) Primary Attributes: Up to 8 Channels of Digital Audio Part Status: Obsolete |
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SPC5514EBMLQ66 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 111 DigiKey Programmable: Not Verified |
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SPC5515SAMLU66 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 137 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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SPC5515SBMLQ66 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 111 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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SPC5516EBMLQ66 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 111 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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SPC5516SBMLQ66 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 111 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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SPC5517EAMLU66 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 137 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5517SBMLQ66 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 111 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||
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SPC5534MVZ80 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 220 DigiKey Programmable: Not Verified |
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SPC5553MVZ132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5KB FLASH 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 220 DigiKey Programmable: Not Verified |
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SPC5566MVR144 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 3MB (3M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 256 DigiKey Programmable: Not Verified |
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SPC5567MVZ132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 324-PBGA (23x23) Part Status: Active Number of I/O: 238 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| TH08EYFA32E | NXP USA Inc. | Description: TARGET HEAD ADAPTER 32-PIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QCDR28E | NXP USA Inc. |
Description: TARGET HEAD ADAPTER 28-TSSOP Packaging: Box For Use With/Related Products: Freescale EVAL Boards Accessory Type: Target Head Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QLP16E | NXP USA Inc. | Description: TARGET HEAD ADAPTER 16DIP/SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QTDFN8E | NXP USA Inc. |
Description: TARGET HEAD ADAPTER 8-DFN Packaging: Box For Use With/Related Products: Freescale EVAL Boards Accessory Type: Target Head Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QTP8E | NXP USA Inc. |
Description: TARGET HEAD ADAPTER 8DIP/SOIC Packaging: Box For Use With/Related Products: Freescale EVAL Boards Accessory Type: Target Head Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QYP16E | NXP USA Inc. | Description: TARGET HEAD ADAPTER 16DIP/SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TH08QYT16E | NXP USA Inc. |
Description: TARGET HEAD ADAPTER 16-TSSOP Packaging: Box For Use With/Related Products: Freescale EVAL Boards Accessory Type: Target Head Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
TSSEVB | NXP USA Inc. |
Description: BOARD EVALUATION TOUCH SENSING |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
USBMLCF | NXP USA Inc. |
Description: USB BDM INTERFACE MC P&E Packaging: Box For Use With/Related Products: ColdFire® V2, V3, V4 and V4e Type: Debugger Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
XC912BC32CFUE8 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
XPC8240LZU200E | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 352TBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
OM11055,598 | NXP USA Inc. |
Description: EVAL BOARD FOR PCF8883 Packaging: Box Interface: Mini USB Voltage - Supply: 3V ~ 9V Sensor Type: Capacitive Utilized IC / Part: PCF8883 Supplied Contents: Board(s), Cable(s) Embedded: No Part Status: Obsolete Contents: Board(s), Cable(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
OM11049,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC1114 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC1114 Platform: LPCXpresso™ Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
PCF2129AT/1,512 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C 20SO Packaging: Tube Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 4.2V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 20-SO Voltage - Supply, Battery: 1.8V ~ 4.2V Current - Timekeeping (Max): 1.5µA @ 3.3V DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
PCF2127AT/1,512 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C 20SO Packaging: Tube Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 512B Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 4.2V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 20-SO Voltage - Supply, Battery: 1.8V ~ 4.2V Current - Timekeeping (Max): 1.5µA @ 3.3V DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LPC3220FET296/01,5 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGA Packaging: Tray Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Number of I/O: 51 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
|
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 |
LPC3240FET296/01,5 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGA Packaging: Tray Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Number of I/O: 51 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
LPC3250FET296/01,5 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGA Packaging: Tray Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Number of I/O: 51 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
TEA1610P/N6,112 | NXP USA Inc. |
Description: IC RESONANT CONVERTR CTRLR 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -25°C ~ 70°C Voltage - Supply: 0V ~ 15V Applications: Resonant Converter Controller Supplier Device Package: 16-DIP Part Status: Obsolete Current - Supply: 2.4 mA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
TEA1610T/N6,518 | NXP USA Inc. |
Description: IC RESONANT CONVRTR CTRLR 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 600V Operating Temperature: -25°C ~ 70°C Voltage - Supply: 0V ~ 15V Applications: Resonant Converter Controller Supplier Device Package: 16-SO Part Status: Obsolete Current - Supply: 2.4 mA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LPC1759FBD80,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LPC1767FBD100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LPC1769FBD100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Discontinued at Digi-Key Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DEMO9S08MP16 | NXP USA Inc. |
Description: MC9S08MP16 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
BGU7005,115 | NXP USA Inc. |
Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 850MHz, 1.9GHz RF Type: GPS Voltage - Supply: 1.5V ~ 2.85V Gain: 16.5dB Current - Supply: 4.5mA Noise Figure: 0.9dB P1dB: -11dBm Test Frequency: 1.575GHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) |
на замовлення 60000 шт: термін постачання 21-31 дні (днів) |
|
| S9S12P128J0MFT |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P128J0MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P128J0MQK |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 315 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 465.22 грн |
| 10+ | 348.38 грн |
| S9S12P32J0MFT |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P64J0MFT |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 447.76 грн |
| 10+ | 338.74 грн |
| 80+ | 280.43 грн |
| 1300+ | 260.30 грн |
| S9S12P64J0MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P64J0MQK |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P96J0MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Description: IC MCU 16BIT 96KB FLASH 64LQFP
товару немає в наявності
В кошику
од. на суму грн.
| S9S12P96J0MQK |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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| S9S12XS256J0CAA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S9S12XS256J0CAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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| S9S12XS256J0CAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| SA5213SLK |
Виробник: NXP USA Inc.
Description: KIT STUDENT LEARNING M5213
Packaging: Box
For Use With/Related Products: M5213
Frequency: 2.4GHz
Type: Transceiver
Contents: Board(s)
Utilized IC / Part: M5213
Supplied Contents: Board(s)
Description: KIT STUDENT LEARNING M5213
Packaging: Box
For Use With/Related Products: M5213
Frequency: 2.4GHz
Type: Transceiver
Contents: Board(s)
Utilized IC / Part: M5213
Supplied Contents: Board(s)
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| SC5554MVR132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
DigiKey Programmable: Not Verified
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| SC68376BACAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| SC68376BAVAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
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| SC68376BGCAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| SC68376BGMAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| SC68376BGVAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Description: IC MCU 32BIT ROMLESS 160QFP
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| SGTL5000XNAA3 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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| SGTL5000XNAA3R2 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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| SGTL5000XNLA3 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 26113 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 283.42 грн |
| 10+ | 207.71 грн |
| 25+ | 191.40 грн |
| 100+ | 162.75 грн |
| 250+ | 154.72 грн |
| 500+ | 153.52 грн |
| SGTL5000XNLA3R2 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 187.11 грн |
| SOUNDBITE |
Виробник: NXP USA Inc.
Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
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| SPC5514EBMLQ66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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| SPC5515SAMLU66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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| SPC5515SBMLQ66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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| SPC5516EBMLQ66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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| SPC5516SBMLQ66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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| SPC5517EAMLU66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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| SPC5517SBMLQ66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
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| SPC5534MVZ80 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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| SPC5553MVZ132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5KB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5KB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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| SPC5566MVR144 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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| SPC5567MVZ132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
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| TH08EYFA32E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 32-PIN
Description: TARGET HEAD ADAPTER 32-PIN
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| TH08QCDR28E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 28-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Description: TARGET HEAD ADAPTER 28-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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| TH08QLP16E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
Description: TARGET HEAD ADAPTER 16DIP/SOIC
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| TH08QTDFN8E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8-DFN
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Description: TARGET HEAD ADAPTER 8-DFN
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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| TH08QTP8E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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| TH08QYP16E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
Description: TARGET HEAD ADAPTER 16DIP/SOIC
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| TH08QYT16E |
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Description: TARGET HEAD ADAPTER 16-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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| TSSEVB |
|
Виробник: NXP USA Inc.
Description: BOARD EVALUATION TOUCH SENSING
Description: BOARD EVALUATION TOUCH SENSING
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| USBMLCF |
Виробник: NXP USA Inc.
Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
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| XC912BC32CFUE8 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Description: IC MCU 16BIT 32KB FLASH 80QFP
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| XPC8240LZU200E |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 352TBGA
Description: IC MPU MPC82XX 200MHZ 352TBGA
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| OM11055,598 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s), Cable(s)
Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s), Cable(s)
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| OM11049,598 |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
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| PCF2129AT/1,512 |
|
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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| PCF2127AT/1,512 |
|
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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| LPC3220FET296/01,5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1087.63 грн |
| 10+ | 827.86 грн |
| 25+ | 773.05 грн |
| LPC3240FET296/01,5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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| LPC3250FET296/01,5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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| TEA1610P/N6,112 |
|
Виробник: NXP USA Inc.
Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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| TEA1610T/N6,518 |
|
Виробник: NXP USA Inc.
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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| LPC1759FBD80,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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| LPC1767FBD100,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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| LPC1769FBD100,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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| DEMO9S08MP16 |
|
Виробник: NXP USA Inc.
Description: MC9S08MP16 EVAL BRD
Description: MC9S08MP16 EVAL BRD
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| BGU7005,115 |
|
Виробник: NXP USA Inc.
Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 21.59 грн |
| 10000+ | 19.98 грн |
| 15000+ | 19.53 грн |
| 25000+ | 17.81 грн |
| 35000+ | 17.48 грн |