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SGTL5000XNAA3 SGTL5000XNAA3 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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SGTL5000XNAA3R2 SGTL5000XNAA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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SGTL5000XNLA3 SGTL5000XNLA3 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 23211 шт:
термін постачання 21-31 дні (днів)
1+338.70 грн
10+247.96 грн
25+228.47 грн
100+194.28 грн
250+184.69 грн
500+178.91 грн
2450+166.45 грн
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SGTL5000XNLA3R2 SGTL5000XNLA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+194.70 грн
Мінімальне замовлення: 5000
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SOUNDBITE NXP USA Inc. Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
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SPC5514EBMLQ66 SPC5514EBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5515SAMLU66 SPC5515SAMLU66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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SPC5515SBMLQ66 SPC5515SBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5516EBMLQ66 SPC5516EBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5516SBMLQ66 SPC5516SBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5517EAMLU66 SPC5517EAMLU66 NXP USA Inc. MPC5510.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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SPC5517SBMLQ66 SPC5517SBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5534MVZ80 SPC5534MVZ80 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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SPC5553MVZ132 SPC5553MVZ132 NXP USA Inc. MPC5553.pdf Description: IC MCU 32BIT 1.5KB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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SPC5566MVR144 SPC5566MVR144 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5567MVZ132 SPC5567MVZ132 NXP USA Inc. MPC5567.pdf Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
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TH08EYFA32E NXP USA Inc. Description: TARGET HEAD ADAPTER 32-PIN
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TH08QCDR28E NXP USA Inc. Description: TARGET HEAD ADAPTER 28-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TH08QLP16E NXP USA Inc. Description: TARGET HEAD ADAPTER 16DIP/SOIC
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TH08QTDFN8E NXP USA Inc. Description: TARGET HEAD ADAPTER 8-DFN
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TH08QTP8E NXP USA Inc. Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Utilized IC / Part: Freescale EVAL Boards
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TH08QYP16E NXP USA Inc. Description: TARGET HEAD ADAPTER 16DIP/SOIC
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TH08QYT16E NXP USA Inc. Description: TARGET HEAD ADAPTER 16-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TSSEVB TSSEVB NXP USA Inc. TSSEVBUG.pdf Description: BOARD EVALUATION TOUCH SENSING
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USBMLCF USBMLCF NXP USA Inc. Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
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XC912BC32CFUE8 XC912BC32CFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
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XPC8240LZU200E XPC8240LZU200E NXP USA Inc. MPC8240RXXPNS.pdf Description: IC MPU MPC82XX 200MHZ 352TBGA
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OM11055,598 OM11055,598 NXP USA Inc. PCF8883.pdf Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s), Cable(s)
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OM11049,598 OM11049,598 NXP USA Inc. Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
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PCF2129AT/1,512 PCF2129AT/1,512 NXP USA Inc. PCF2129.pdf Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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PCF2127AT/1,512 PCF2127AT/1,512 NXP USA Inc. PCF2127AT.pdf Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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LPC3220FET296/01,5 LPC3220FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
1+1052.44 грн
10+801.14 грн
25+748.08 грн
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LPC3240FET296/01,5 LPC3240FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296/01,5 LPC3250FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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TEA1610P/N6,112 TEA1610P/N6,112 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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TEA1610T/N6,518 TEA1610T/N6,518 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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LPC1759FBD80,551 LPC1759FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1767FBD100,551 LPC1767FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1769FBD100,551 LPC1769FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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DEMO9S08MP16 DEMO9S08MP16 NXP USA Inc. DEMO9S08MP16SH.pdf Description: MC9S08MP16 EVAL BRD
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BGU7005,115 BGU7005,115 NXP USA Inc. BGU7005.pdf Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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BGU7005,115 BGU7005,115 NXP USA Inc. BGU7005.pdf Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
на замовлення 2452 шт:
термін постачання 21-31 дні (днів)
9+37.17 грн
11+31.02 грн
25+29.24 грн
100+25.11 грн
250+23.70 грн
500+22.71 грн
1000+21.42 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
GTL2002D,118 GTL2002D,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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PMBF4393,215 PMBF4393,215 NXP USA Inc. PMBF4391-4393.pdf Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 500 mV @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 20 V
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MPL115A1T1 MPL115A1T1 NXP USA Inc. MPL115A1.pdf Description: SENSOR 16.68PSIA 10BIT 8LGA
Packaging: Cut Tape (CT)
Features: Shutdown Mode, Standby Mode
Package / Case: 8-TLGA
Output Type: SPI
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
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MPL115A2T1 MPL115A2T1 NXP USA Inc. MPL115A2.pdf Description: SENSOR 16.68PSIA 10BIT 8LGA
Packaging: Cut Tape (CT)
Features: Shutdown Mode, Standby Mode
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
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IP5311CX5/LF,135 NXP USA Inc. IP5311CX5.pdf Description: FILTER RC(PI) 15 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Size / Dimension: 0.046" L x 0.031" W (1.16mm x 0.80mm)
Mounting Type: Surface Mount
Type: Low Pass
Values: R = 15Ohms, C = 5000pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Audio
Technology: RC (Pi)
Resistance - Channel (Ohms): 15
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PH3430AL,115 PH3430AL,115 NXP USA Inc. Description: MOSFET N-CH 30V 100A LFPAK
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PH6530AL,115 PH6530AL,115 NXP USA Inc. Description: MOSFET N-CH 30V LFPAK56 PWR-SO8
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: LFPAK56, Power-SO8
Drain to Source Voltage (Vdss): 30 V
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PH9030AL,115 PH9030AL,115 NXP USA Inc. Description: MOSFET N-CH 30V 61A LFPAK56
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74ABT16374BDGG,112 74ABT16374BDGG,112 NXP USA Inc. 74ABT16374B_4.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
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74ABT16374BDGG,118 74ABT16374BDGG,118 NXP USA Inc. 74ABT16374B_4.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
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74ALVT162241DGG,11 74ALVT162241DGG,11 NXP USA Inc. 74ALVT162241.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162241DGG:11 74ALVT162241DGG:11 NXP USA Inc. 74ALVT162241.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162244DGG,11 74ALVT162244DGG,11 NXP USA Inc. 74ALVT162244.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162244DGG:11 74ALVT162244DGG:11 NXP USA Inc. 74ALVT162244.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT16240DGG,112 74ALVT16240DGG,112 NXP USA Inc. 74ALVT16240.pdf Description: IC BUFF INVERT 2.7V/3V 48-TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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74ALVT16240DGG,118 74ALVT16240DGG,118 NXP USA Inc. 74ALVT16240.pdf Description: IC BUFF INVERT 2.7V/3V 48-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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ADC0801S040TS/C1'1 ADC0801S040TS/C1'1 NXP USA Inc. DS_568_ADC0801S040.pdf Description: IC ADC 8BIT SAR 20SSOP
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 8
Configuration: ADC
Data Interface: Parallel
Reference Type: External, Supply
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 4.5V ~ 6.3V
Voltage - Supply, Digital: 4.5V ~ 6.3V
Sampling Rate (Per Second): 10k
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 20-SSOP
Architecture: SAR
Number of A/D Converters: 1
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ADC0804S030TS/C1'1 ADC0804S030TS/C1'1 NXP USA Inc. ADC0804S030_040_050.pdf Description: IC ADC 8BIT 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 8
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Active
Number of A/D Converters: 1
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SGTL5000XNAA3 SGTL5000.pdf
SGTL5000XNAA3
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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SGTL5000XNAA3R2 SGTL5000.pdf
SGTL5000XNAA3R2
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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SGTL5000XNLA3 SGTL5000.pdf
SGTL5000XNLA3
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 23211 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+338.70 грн
10+247.96 грн
25+228.47 грн
100+194.28 грн
250+184.69 грн
500+178.91 грн
2450+166.45 грн
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SGTL5000XNLA3R2 SGTL5000.pdf
SGTL5000XNLA3R2
Виробник: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+194.70 грн
Мінімальне замовлення: 5000
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SOUNDBITE
Виробник: NXP USA Inc.
Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
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SPC5514EBMLQ66 MPC5510PB.pdf
SPC5514EBMLQ66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5515SAMLU66 MPC5510PB.pdf
SPC5515SAMLU66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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SPC5515SBMLQ66 MPC5510PB.pdf
SPC5515SBMLQ66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5516EBMLQ66 MPC5510PB.pdf
SPC5516EBMLQ66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5516SBMLQ66 MPC5510PB.pdf
SPC5516SBMLQ66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5517EAMLU66 MPC5510.pdf
SPC5517EAMLU66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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SPC5517SBMLQ66 MPC5510PB.pdf
SPC5517SBMLQ66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
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SPC5534MVZ80
SPC5534MVZ80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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SPC5553MVZ132 MPC5553.pdf
SPC5553MVZ132
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5KB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
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SPC5566MVR144 MPC5566.pdf
SPC5566MVR144
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5567MVZ132 MPC5567.pdf
SPC5567MVZ132
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
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TH08EYFA32E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 32-PIN
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TH08QCDR28E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 28-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TH08QLP16E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
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TH08QTDFN8E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8-DFN
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TH08QTP8E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Utilized IC / Part: Freescale EVAL Boards
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TH08QYP16E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
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TH08QYT16E
Виробник: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16-TSSOP
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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TSSEVB TSSEVBUG.pdf
TSSEVB
Виробник: NXP USA Inc.
Description: BOARD EVALUATION TOUCH SENSING
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USBMLCF
USBMLCF
Виробник: NXP USA Inc.
Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
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XC912BC32CFUE8 M68HC12B.pdf
XC912BC32CFUE8
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
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XPC8240LZU200E MPC8240RXXPNS.pdf
XPC8240LZU200E
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 352TBGA
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OM11055,598 PCF8883.pdf
OM11055,598
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s), Cable(s)
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OM11049,598
OM11049,598
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
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PCF2129AT/1,512 PCF2129.pdf
PCF2129AT/1,512
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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PCF2127AT/1,512 PCF2127AT.pdf
PCF2127AT/1,512
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
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LPC3220FET296/01,5 LPC3220_30_40_50.pdf
LPC3220FET296/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1052.44 грн
10+801.14 грн
25+748.08 грн
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LPC3240FET296/01,5 LPC3220_30_40_50.pdf
LPC3240FET296/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296/01,5 LPC3220_30_40_50.pdf
LPC3250FET296/01,5
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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TEA1610P/N6,112 TEA1610T_P.pdf
TEA1610P/N6,112
Виробник: NXP USA Inc.
Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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TEA1610T/N6,518 TEA1610T_P.pdf
TEA1610T/N6,518
Виробник: NXP USA Inc.
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
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LPC1759FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1759FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1767FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1767FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1769FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1769FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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DEMO9S08MP16 DEMO9S08MP16SH.pdf
DEMO9S08MP16
Виробник: NXP USA Inc.
Description: MC9S08MP16 EVAL BRD
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BGU7005,115 BGU7005.pdf
BGU7005,115
Виробник: NXP USA Inc.
Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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BGU7005,115 BGU7005.pdf
BGU7005,115
Виробник: NXP USA Inc.
Description: IC AMP GPS 850MHZ/1.9GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 850MHz, 1.9GHz
RF Type: GPS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 16.5dB
Current - Supply: 4.5mA
Noise Figure: 0.9dB
P1dB: -11dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
на замовлення 2452 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+37.17 грн
11+31.02 грн
25+29.24 грн
100+25.11 грн
250+23.70 грн
500+22.71 грн
1000+21.42 грн
Мінімальне замовлення: 9
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GTL2002D,118 GTL2002.pdf
GTL2002D,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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PMBF4393,215 PMBF4391-4393.pdf
PMBF4393,215
Виробник: NXP USA Inc.
Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 500 mV @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 20 V
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MPL115A1T1 MPL115A1.pdf
MPL115A1T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 10BIT 8LGA
Packaging: Cut Tape (CT)
Features: Shutdown Mode, Standby Mode
Package / Case: 8-TLGA
Output Type: SPI
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
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MPL115A2T1 MPL115A2.pdf
MPL115A2T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 10BIT 8LGA
Packaging: Cut Tape (CT)
Features: Shutdown Mode, Standby Mode
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
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IP5311CX5/LF,135 IP5311CX5.pdf
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 15 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Size / Dimension: 0.046" L x 0.031" W (1.16mm x 0.80mm)
Mounting Type: Surface Mount
Type: Low Pass
Values: R = 15Ohms, C = 5000pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Audio
Technology: RC (Pi)
Resistance - Channel (Ohms): 15
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PH3430AL,115
PH3430AL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK
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PH6530AL,115
PH6530AL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V LFPAK56 PWR-SO8
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: LFPAK56, Power-SO8
Drain to Source Voltage (Vdss): 30 V
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PH9030AL,115
PH9030AL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 61A LFPAK56
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74ABT16374BDGG,112 74ABT16374B_4.pdf
74ABT16374BDGG,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
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74ABT16374BDGG,118 74ABT16374B_4.pdf
74ABT16374BDGG,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
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74ALVT162241DGG,11 74ALVT162241.pdf
74ALVT162241DGG,11
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162241DGG:11 74ALVT162241.pdf
74ALVT162241DGG:11
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162244DGG,11 74ALVT162244.pdf
74ALVT162244DGG,11
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT162244DGG:11 74ALVT162244.pdf
74ALVT162244DGG:11
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74ALVT16240DGG,112 74ALVT16240.pdf
74ALVT16240DGG,112
Виробник: NXP USA Inc.
Description: IC BUFF INVERT 2.7V/3V 48-TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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74ALVT16240DGG,118 74ALVT16240.pdf
74ALVT16240DGG,118
Виробник: NXP USA Inc.
Description: IC BUFF INVERT 2.7V/3V 48-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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ADC0801S040TS/C1'1 DS_568_ADC0801S040.pdf
ADC0801S040TS/C1'1
Виробник: NXP USA Inc.
Description: IC ADC 8BIT SAR 20SSOP
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 8
Configuration: ADC
Data Interface: Parallel
Reference Type: External, Supply
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 4.5V ~ 6.3V
Voltage - Supply, Digital: 4.5V ~ 6.3V
Sampling Rate (Per Second): 10k
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 20-SSOP
Architecture: SAR
Number of A/D Converters: 1
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ADC0804S030TS/C1'1 ADC0804S030_040_050.pdf
ADC0804S030TS/C1'1
Виробник: NXP USA Inc.
Description: IC ADC 8BIT 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 8
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Active
Number of A/D Converters: 1
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