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MSC8156EADS NXP USA Inc. MSC8156EPB.pdf Description: MSC8156 EVAL BRD
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MW7IC915NT1 MW7IC915NT1 NXP USA Inc. MW7IC915N.pdf Description: IC AMP W-CDMA 728-960MHZ 24QFN
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
P1dB: 15.5W
Gain: 38dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1000+2497.95 грн
Мінімальне замовлення: 1000 шт
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S912XEQ512J3MAG S912XEQ512J3MAG NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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S912XEQ512J3MAL S912XEQ512J3MAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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S912XET256J2MAA S912XET256J2MAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
на замовлення 417 шт:
термін постачання 21-31 дні (днів)
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S912XET256J2MAG S912XET256J2MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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S9S12C128J2VFAER S9S12C128J2VFAER NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
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S9S12Q12J2VFAE1R S9S12Q12J2VFAE1R NXP USA Inc. MC9S12Q128V1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S9S12XS256J0VAE S9S12XS256J0VAE NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12XS256J0VAER S9S12XS256J0VAER NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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SC68376BGVAB25R SC68376BGVAB25R NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tape & Reel (TR)
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SGMII-PEX-RISER SGMII-PEX-RISER NXP USA Inc. Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+55701.82 грн
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MC8640DTHX1067NE MC8640DTHX1067NE NXP USA Inc. Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
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MC8640VU1000HE MC8640VU1000HE NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 994-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 994-BCBGA, FCCBGA
Packaging: Tray
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MC8641DTVU1333JE MC8641DTVU1333JE NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MC8641DVU1333JE MC8641DVU1333JE NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MPC8572ECLPXATLD NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
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MPC8572ECLPXAULD NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.333GHZ 1023BGA
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MPC8572ECLVTAULD MPC8572ECLVTAULD NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
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MRF8S7120NR3 MRF8S7120NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.2dB
Power - Output: 32W
Frequency: 768MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
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MRF8P20160HR3 MRF8P20160HR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Current - Test: 550 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16.5dB
Power - Output: 37W
Configuration: Dual
Frequency: 1.92GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
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MRF8P20160HSR3 MRF8P20160HSR3 NXP USA Inc. Description: FET RF 2CH 65V 1.92GHZ
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MRF8P20160HSR5 MRF8P20160HSR5 NXP USA Inc. Description: FET RF 2CH 65V 1.92GHZ
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MRF8S26060HR3 NXP USA Inc. Description: FET RF 65V 2.69GHZ
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MRF8S26060HSR3 NXP USA Inc. Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
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MRF8S26060HSR5 NXP USA Inc. Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
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TDA8954TH/N1,118 TDA8954TH/N1,118 NXP USA Inc. TDA8954.pdf Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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MPC5125YVN400 MPC5125YVN400 NXP USA Inc. MPC5125PB.pdf Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 257 шт:
термін постачання 21-31 дні (днів)
1+3874.32 грн
10+3071.36 грн
25+2906.68 грн
100+2557.92 грн
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DAC1408D750W1/DB,598 DAC1408D750W1/DB,598 NXP USA Inc. Description: BOARD DEMO DAC1408D750
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ADC1413D125WO/DB,598 ADC1413D125WO/DB,598 NXP USA Inc. Description: BOARD DEMO FOR ADC1413D125
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Input Range: 1 ~ 2Vpp
Number of A/D Converters: 2
Supplied Contents: Board(s)
Utilized IC / Part: ADC1413D125
Sampling Rate (Per Second): 125M
Data Interface: Serial JESD204A, SPI™
Number of Bits: 14
Packaging: Box
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ADC1415S125/DB,598 ADC1415S125/DB,598 NXP USA Inc. ADC1415S_Series.pdf Description: BOARD DEMO FOR ADC1415S125
Supplied Contents: Board(s)
Utilized IC / Part: ADC1415S125
Sampling Rate (Per Second): 125M
Data Interface: SPI
Number of Bits: 14
Packaging: Box
Power (Typ) @ Conditions: 840mW @ 125MSPS
Input Range: 1 ~ 2Vpp
Number of A/D Converters: 1
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ADC1613D125HN/C1,5 ADC1613D125HN/C1,5 NXP USA Inc. ADC1613D_Series_Rev3.pdf Description: IC ADC 16BIT PIPELINED 56HVQFN
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ADC1413D125HN/C1,5 ADC1413D125HN/C1,5 NXP USA Inc. ADC1413D_Series.pdf Description: IC ADC 14BIT PIPELINED 56HVQFN
Number of A/D Converters: 2
Ratio - S/H:ADC: 1:1
Architecture: Pipelined
Supplier Device Package: 56-HVQFN (8x8)
Number of Inputs: 2
Input Type: Differential, Single Ended
Sampling Rate (Per Second): 125M
Voltage - Supply, Digital: 1.65V ~ 1.95V
Voltage - Supply, Analog: 2.85V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Reference Type: External, Internal
Data Interface: JESD204A
Configuration: S/H-ADC
Number of Bits: 14
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Features: Simultaneous Sampling
Packaging: Tray
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MMA7331LCT MMA7331LCT NXP USA Inc. MMA7331LC.pdf Description: ACCELEROMETER 4-9G ANALOG 14LGA
Features: Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
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MMA7361LCT MMA7361LCT NXP USA Inc. MMA7361LC.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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BGD704/09,112 BGD704/09,112 NXP USA Inc. BGD704.pdf Description: IC AMP MODULE 750MHZ SOT115J
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ON4970,115 ON4970,115 NXP USA Inc. Description: MOSFET RF SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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BGD802/02,112 BGD802/02,112 NXP USA Inc. BGD802.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 395 mA
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BUK7524-55,127 BUK7524-55,127 NXP USA Inc. BUK7524-55.pdf Description: MOSFET N-CH 55V 45A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 103W (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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BUK9535-55,127 BUK9535-55,127 NXP USA Inc. BUK9535-55.pdf Description: MOSFET N-CH 55V 34A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 5V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 85W (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 17A, 5V
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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PHD18NQ10T,118 PHD18NQ10T,118 NXP USA Inc. PHB_PHD_PHP18NQ10T.pdf Description: MOSFET N-CH 100V 18A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 90mOhm @ 9A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 633 pF @ 25 V
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BUK217-50YT,118 BUK217-50YT,118 NXP USA Inc. BUK217-50YT.pdf Description: IC PWR DRIVER N-CHAN 1:1 SOT426
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 35V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 10A
Ratio - Input:Output: 1:1
Supplier Device Package: D2PAK
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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ON5204,127 ON5204,127 NXP USA Inc. Description: RF MOSFET SOT263B-01
Packaging: Tube
Package / Case: TO-220-5 Formed Leads
Mounting Type: Through Hole
Supplier Device Package: SOT263B-01
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ON5213,118 ON5213,118 NXP USA Inc. Description: MOSFET RF SOT426 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Part Status: Obsolete
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ON5224,118 ON5224,118 NXP USA Inc. Description: MOSFET RF SOT426 D2PAK
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ON5234,118 ON5234,118 NXP USA Inc. Description: MOSFET RF SOT404 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5238,118 NXP USA Inc. Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5239,135 NXP USA Inc. Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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ON5240,118 NXP USA Inc. Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5157,127 ON5157,127 NXP USA Inc. Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
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ON5154,127 ON5154,127 NXP USA Inc. Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
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ON5173,118 ON5173,118 NXP USA Inc. Description: MOSFET RF SOT404 D2PAK
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ON5250,135 ON5250,135 NXP USA Inc. Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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BUK1M200-50SGTD,51 BUK1M200-50SGTD,51 NXP USA Inc. Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.7A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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BUK1M200-50SDLD,51 BUK1M200-50SDLD,51 NXP USA Inc. BUK1M200-50SDLD.pdf Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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ON5252,118 ON5252,118 NXP USA Inc. Description: RF MOSFET DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
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IP4044CX8/LF,135 NXP USA Inc. Description: FILTER RC(PI) ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 35pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 3
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IP4065CX11/LF,135 IP4065CX11/LF,135 NXP USA Inc. Description: FILTER RC(PI) 33 OHM/27PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 11-WFBGA, WLCSP
Size / Dimension: 0.077" L x 0.058" W (1.97mm x 1.47mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 27pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 17k, 15k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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IP4035CX24/LF,135 NXP USA Inc. IP4035CX24.pdf Description: FILTER RC(PI) 1 KOHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-UFBGA, WLCSP
Size / Dimension: 0.096" L x 0.095" W (2.45mm x 2.41mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -45°C ~ 85°C
Values: R = 1kOhms (Total), C = 50pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 1k
ESD Protection: Yes
Number of Channels: 10
Current: 7 mA
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IP4057CX10/LF,135 NXP USA Inc. Description: FILTER RC(PI) 33 OHM/30PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 10-WFBGA, CSPBGA
Size / Dimension: 0.077" L x 0.061" W (1.96mm x 1.56mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 30pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 10k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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MSC8156EADS MSC8156EPB.pdf
Виробник: NXP USA Inc.
Description: MSC8156 EVAL BRD
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MW7IC915NT1 MW7IC915N.pdf
MW7IC915NT1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
P1dB: 15.5W
Gain: 38dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+2497.95 грн
Мінімальне замовлення: 1000 шт
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S912XEQ512J3MAG MC9S12XEPB.pdf
S912XEQ512J3MAG
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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S912XEQ512J3MAL MC9S12XEPB.pdf
S912XEQ512J3MAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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S912XET256J2MAA MC9S12XEP100RMV1.pdf
S912XET256J2MAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
на замовлення 417 шт:
термін постачання 21-31 дні (днів)
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S912XET256J2MAG MC9S12XEP100RMV1.pdf
S912XET256J2MAG
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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S9S12C128J2VFAER MC9S12C128V1.pdf
S9S12C128J2VFAER
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
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S9S12Q12J2VFAE1R MC9S12Q128V1.pdf
S9S12Q12J2VFAE1R
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S9S12XS256J0VAE MC9S12XS256RMV1.pdf
S9S12XS256J0VAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12XS256J0VAER MC9S12XS256RMV1.pdf
S9S12XS256J0VAER
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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SC68376BGVAB25R MC68376_336.pdf
SC68376BGVAB25R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tape & Reel (TR)
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SGMII-PEX-RISER
SGMII-PEX-RISER
Виробник: NXP USA Inc.
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+55701.82 грн
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MC8640DTHX1067NE
MC8640DTHX1067NE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
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MC8640VU1000HE
MC8640VU1000HE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 994-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 994-BCBGA, FCCBGA
Packaging: Tray
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MC8641DTVU1333JE MCP8641(D).pdf
MC8641DTVU1333JE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MC8641DVU1333JE MCP8641(D).pdf
MC8641DVU1333JE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MPC8572ECLPXATLD MPC8572E.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
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MPC8572ECLPXAULD MPC8572E.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
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MPC8572ECLVTAULD MPC8572E.pdf
MPC8572ECLVTAULD
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
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MRF8S7120NR3
MRF8S7120NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.2dB
Power - Output: 32W
Frequency: 768MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
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MRF8P20160HR3
MRF8P20160HR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 550 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16.5dB
Power - Output: 37W
Configuration: Dual
Frequency: 1.92GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
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MRF8P20160HSR3
MRF8P20160HSR3
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
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MRF8P20160HSR5
MRF8P20160HSR5
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
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MRF8S26060HR3
Виробник: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
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MRF8S26060HSR3
Виробник: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
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MRF8S26060HSR5
Виробник: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
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TDA8954TH/N1,118 TDA8954.pdf
TDA8954TH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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MPC5125YVN400 MPC5125PB.pdf
MPC5125YVN400
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 257 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3874.32 грн
10+3071.36 грн
25+2906.68 грн
100+2557.92 грн
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DAC1408D750W1/DB,598
DAC1408D750W1/DB,598
Виробник: NXP USA Inc.
Description: BOARD DEMO DAC1408D750
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ADC1413D125WO/DB,598
ADC1413D125WO/DB,598
Виробник: NXP USA Inc.
Description: BOARD DEMO FOR ADC1413D125
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Input Range: 1 ~ 2Vpp
Number of A/D Converters: 2
Supplied Contents: Board(s)
Utilized IC / Part: ADC1413D125
Sampling Rate (Per Second): 125M
Data Interface: Serial JESD204A, SPI™
Number of Bits: 14
Packaging: Box
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ADC1415S125/DB,598 ADC1415S_Series.pdf
ADC1415S125/DB,598
Виробник: NXP USA Inc.
Description: BOARD DEMO FOR ADC1415S125
Supplied Contents: Board(s)
Utilized IC / Part: ADC1415S125
Sampling Rate (Per Second): 125M
Data Interface: SPI
Number of Bits: 14
Packaging: Box
Power (Typ) @ Conditions: 840mW @ 125MSPS
Input Range: 1 ~ 2Vpp
Number of A/D Converters: 1
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ADC1613D125HN/C1,5 ADC1613D_Series_Rev3.pdf
ADC1613D125HN/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 16BIT PIPELINED 56HVQFN
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ADC1413D125HN/C1,5 ADC1413D_Series.pdf
ADC1413D125HN/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 56HVQFN
Number of A/D Converters: 2
Ratio - S/H:ADC: 1:1
Architecture: Pipelined
Supplier Device Package: 56-HVQFN (8x8)
Number of Inputs: 2
Input Type: Differential, Single Ended
Sampling Rate (Per Second): 125M
Voltage - Supply, Digital: 1.65V ~ 1.95V
Voltage - Supply, Analog: 2.85V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Reference Type: External, Internal
Data Interface: JESD204A
Configuration: S/H-ADC
Number of Bits: 14
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Features: Simultaneous Sampling
Packaging: Tray
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MMA7331LCT MMA7331LC.pdf
MMA7331LCT
Виробник: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Features: Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
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MMA7361LCT MMA7361LC.pdf
MMA7361LCT
Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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BGD704/09,112 BGD704.pdf
BGD704/09,112
Виробник: NXP USA Inc.
Description: IC AMP MODULE 750MHZ SOT115J
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ON4970,115
ON4970,115
Виробник: NXP USA Inc.
Description: MOSFET RF SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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BGD802/02,112 BGD802.pdf
BGD802/02,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 395 mA
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BUK7524-55,127 BUK7524-55.pdf
BUK7524-55,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 45A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 103W (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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BUK9535-55,127 BUK9535-55.pdf
BUK9535-55,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 34A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 5V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 85W (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 17A, 5V
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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PHD18NQ10T,118 PHB_PHD_PHP18NQ10T.pdf
PHD18NQ10T,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 18A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 90mOhm @ 9A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 633 pF @ 25 V
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BUK217-50YT,118 BUK217-50YT.pdf
BUK217-50YT,118
Виробник: NXP USA Inc.
Description: IC PWR DRIVER N-CHAN 1:1 SOT426
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 35V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 10A
Ratio - Input:Output: 1:1
Supplier Device Package: D2PAK
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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ON5204,127
ON5204,127
Виробник: NXP USA Inc.
Description: RF MOSFET SOT263B-01
Packaging: Tube
Package / Case: TO-220-5 Formed Leads
Mounting Type: Through Hole
Supplier Device Package: SOT263B-01
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ON5213,118
ON5213,118
Виробник: NXP USA Inc.
Description: MOSFET RF SOT426 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Part Status: Obsolete
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ON5224,118
ON5224,118
Виробник: NXP USA Inc.
Description: MOSFET RF SOT426 D2PAK
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ON5234,118
ON5234,118
Виробник: NXP USA Inc.
Description: MOSFET RF SOT404 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5238,118
Виробник: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5239,135
Виробник: NXP USA Inc.
Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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ON5240,118
Виробник: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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ON5157,127
ON5157,127
Виробник: NXP USA Inc.
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
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ON5154,127
ON5154,127
Виробник: NXP USA Inc.
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
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ON5173,118
ON5173,118
Виробник: NXP USA Inc.
Description: MOSFET RF SOT404 D2PAK
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ON5250,135
ON5250,135
Виробник: NXP USA Inc.
Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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BUK1M200-50SGTD,51
BUK1M200-50SGTD,51
Виробник: NXP USA Inc.
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.7A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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BUK1M200-50SDLD,51 BUK1M200-50SDLD.pdf
BUK1M200-50SDLD,51
Виробник: NXP USA Inc.
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
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ON5252,118
ON5252,118
Виробник: NXP USA Inc.
Description: RF MOSFET DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
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IP4044CX8/LF,135
Виробник: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 35pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 3
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IP4065CX11/LF,135
IP4065CX11/LF,135
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 33 OHM/27PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 11-WFBGA, WLCSP
Size / Dimension: 0.077" L x 0.058" W (1.97mm x 1.47mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 27pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 17k, 15k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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IP4035CX24/LF,135 IP4035CX24.pdf
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 1 KOHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-UFBGA, WLCSP
Size / Dimension: 0.096" L x 0.095" W (2.45mm x 2.41mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -45°C ~ 85°C
Values: R = 1kOhms (Total), C = 50pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 1k
ESD Protection: Yes
Number of Channels: 10
Current: 7 mA
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IP4057CX10/LF,135
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 33 OHM/30PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 10-WFBGA, CSPBGA
Size / Dimension: 0.077" L x 0.061" W (1.96mm x 1.56mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 30pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 10k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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