Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34145) > Сторінка 181 з 570
| Фото | Назва | Виробник | Інформація |
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LPC1788FBD208,551 | NXP USA Inc. |
 Description: IC MCU 32BIT 512KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 165 DigiKey Programmable: Not Verified |
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LPC1778FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 165 DigiKey Programmable: Not Verified |
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TFA9882UK/N1,023 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSP Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Packaging: Tape & Reel (TR) Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
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TFA9882UK/N1,023 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSP Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Packaging: Cut Tape (CT) Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
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CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Multiplexer Voltage - Supply: 3.0V ~ 3.6V Applications: Video Display Supplier Device Package: 32-HVQFN (3x6) Part Status: Obsolete Control Interface: I²C |
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PCA9621PW,118 | NXP USA Inc. |
Description: IC BUS PORT 8BIT 65MA 16TSSOP |
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CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Multiplexer Voltage - Supply: 3.0V ~ 3.6V Applications: Video Display Supplier Device Package: 32-HVQFN (3x6) Part Status: Obsolete Control Interface: I²C |
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TWR-K60N512-KEIL | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
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TWR-MCF51JF | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRD |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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LFSTBEB3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELER Packaging: Box Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Interface: I2C Sensor Type: Accelerometer, Magnetometer Utilized IC / Part: MAG3110, MMA8451Q Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, ±1000µT Part Status: Obsolete |
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RD4247MAG3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELER Packaging: Box Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Interface: I2C Sensor Type: Accelerometer, Magnetometer Utilized IC / Part: MAG3110, MMA8451Q Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, ±1000µT Part Status: Active |
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MCIMX-LVDS1 | NXP USA Inc. |
Description: DAUGHTER CARD LVDS FOR I.MX53 Packaging: Box For Use With/Related Products: i.MX53 Accessory Type: Display - LVDS Interface Add-On Board |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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FSLBOT | NXP USA Inc. |
Description: KIT TOWER MECH BOARD Packaging: Box Configuration: Servo Actuators Contents: Board(s), Components, Hardware, Servo(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
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TWR-AUDIO-SGTL | NXP USA Inc. |
Description: TOWER SYSTEM KIT AUDIO Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Module, Audio with CODEC |
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TWR-K53N512 | NXP USA Inc. |
Description: TOWER SYSTEM K53 EVAL BRD |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TWR-MCF51QM | NXP USA Inc. |
Description: TOWER SYSTEM MCF51QM EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: Coldfire V1 Board Type: Evaluation Platform Utilized IC / Part: MCF51QM Platform: Tower System Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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TWR-MECH | NXP USA Inc. |
Description: KIT TOWER ROBOT SENSOR MOTOR Packaging: Box Configuration: Robot Components Contents: Board(s), Cable(s), Components, Hardware, Wheel(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
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EVBUSB2SER | NXP USA Inc. |
Description: USB TO SERIAL BRIDGE Packaging: Box Accessory Type: USB to Serial TTL Adapter |
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U-MULTILINK | NXP USA Inc. |
Description: USB MULTILINK PROGRAMMER Packaging: Box For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Part Status: Active |
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MCZ33903BD5EK | NXP USA Inc. |
Description: IC SBC CAN HS 5.0V 32SOIC |
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MCZ33903BS3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Box Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
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MCZ33903BS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33905BD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Box Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
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TWR-MCF51JF-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRD |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFP Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 510 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DJM4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 880 шт: термін постачання 21-31 дні (днів) |
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MCZ33905BD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC |
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MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x3) Part Status: Obsolete |
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MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x4) Part Status: Obsolete |
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MCIMX233CAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFP Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 425 шт: термін постачання 21-31 дні (днів) |
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MPC8309CVMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGA Packaging: Tray Package / Case: 489-LFBGA Mounting Type: Surface Mount Speed: 417MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 489-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
на замовлення 410 шт: термін постачання 21-31 дні (днів) |
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MSC8156ETVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
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MSC8156ESVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
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MSC8154TVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
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MSC8154ETVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
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SSL4101/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 380kHz Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 150°C (TJ) Applications: Lighting Internal Switch(s): No Topology: Flyback Supplier Device Package: 16-SO Voltage - Supply (Min): 15V Voltage - Supply (Max): 38V |
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OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1788 Part Status: Active |
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TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
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TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08AC60 Platform: Tower System Part Status: Active |
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TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
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TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
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TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08QG8 Platform: Tower System Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SH8 Platform: Tower System Part Status: Active |
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| 1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
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TWR-S08UNIV | NXP USA Inc. |
Description: TOWER SYST TWR-RS08DC/TWR-S08DC |
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1323XDSK | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s) |
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1323XDSK-BDM | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s) |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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MCIMX50EVK | NXP USA Inc. |
Description: I.MX50 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A8 Board Type: Evaluation Platform Utilized IC / Part: i.MX50 Operating System: Linux Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC13850EPR2 | NXP USA Inc. |
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 3V Gain: 13dB Current - Supply: 9.9mA Noise Figure: 1.85dB P1dB: 2.2dBm Test Frequency: 2.4GHz Supplier Device Package: 8-MLPD (2x2) Part Status: Obsolete |
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MC13852EPR2 | NXP USA Inc. |
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 3V Gain: 18.3dB Current - Supply: 5.5mA Noise Figure: 1.2dB P1dB: 9.6dBm Test Frequency: 900MHz Supplier Device Package: 8-MLPD (2x2) Part Status: Obsolete |
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MRF8P20165WHSR5 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
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MC9S08GW32CLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
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| MMA6805AKW | NXP USA Inc. | Description: ACCELEROMETER 16QFN |
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MMA6823AKW | NXP USA Inc. | Description: ACCELEROMETER 50G SPI 16QFN |
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MCIMX534AVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
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MCIMX536AVV8CR2 | NXP USA Inc. |
Description: IC MPU 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19x19) Part Status: Obsolete |
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MCIMX537CVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
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MRF8P20165WHSR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
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| P3041DS-PA | NXP USA Inc. |
Description: P3041 EVAL BRD |
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DEMO9S12XHY256 | NXP USA Inc. |
Description: MC9S12XHY256 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), LCD Core Processor: HCS12X Utilized IC / Part: MC9S12XHY256 Part Status: Active |
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| LPC1788FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
товар відсутній
| LPC1778FBD208,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
товар відсутній
| TFA9882UK/N1,023 |
|
Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
товар відсутній
| TFA9882UK/N1,023 |
|
Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
товар відсутній
| CBTL04DP211BS,518 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
товар відсутній
| CBTL04DP211BS,518 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Description: IC VIDEO MULTIPLEXER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Multiplexer
Voltage - Supply: 3.0V ~ 3.6V
Applications: Video Display
Supplier Device Package: 32-HVQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
товар відсутній
| TWR-MCF51JF |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Description: TOWER SYSTEM MCF51JF EVAL BRD
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7151.7 грн |
| LFSTBEB3110 |
|
Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Obsolete
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Obsolete
товар відсутній
| RD4247MAG3110 |
|
Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Active
Description: KIT EVAL 3-AXIS DIG ACCELER
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: MAG3110, MMA8451Q
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1000µT
Part Status: Active
товар відсутній
| MCIMX-LVDS1 |
|
Виробник: NXP USA Inc.
Description: DAUGHTER CARD LVDS FOR I.MX53
Packaging: Box
For Use With/Related Products: i.MX53
Accessory Type: Display - LVDS Interface Add-On Board
Description: DAUGHTER CARD LVDS FOR I.MX53
Packaging: Box
For Use With/Related Products: i.MX53
Accessory Type: Display - LVDS Interface Add-On Board
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 38423.66 грн |
| FSLBOT |
|
Виробник: NXP USA Inc.
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
товар відсутній
| TWR-AUDIO-SGTL |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM KIT AUDIO
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Module, Audio with CODEC
Description: TOWER SYSTEM KIT AUDIO
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Module, Audio with CODEC
товар відсутній
| TWR-K53N512 |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K53 EVAL BRD
Description: TOWER SYSTEM K53 EVAL BRD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| TWR-MCF51QM |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Board Type: Evaluation Platform
Utilized IC / Part: MCF51QM
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MCF51QM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Board Type: Evaluation Platform
Utilized IC / Part: MCF51QM
Platform: Tower System
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5534.39 грн |
| TWR-MECH |
|
Виробник: NXP USA Inc.
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
товар відсутній
| EVBUSB2SER |
Виробник: NXP USA Inc.
Description: USB TO SERIAL BRIDGE
Packaging: Box
Accessory Type: USB to Serial TTL Adapter
Description: USB TO SERIAL BRIDGE
Packaging: Box
Accessory Type: USB to Serial TTL Adapter
товар відсутній
| U-MULTILINK |
|
Виробник: NXP USA Inc.
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
товар відсутній
| MCZ33903BS3EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Box
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Box
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
товар відсутній
| MCZ33905BD3EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Box
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Box
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
товар відсутній
| TWR-MCF51JF-KIT |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Description: TOWER SYSTEM MCF51JF EVAL BRD
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10773.04 грн |
| MCIMX233DAG4C |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 510 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1137.45 грн |
| 10+ | 875.57 грн |
| 80+ | 739.46 грн |
| 450+ | 689.7 грн |
| MCIMX233DJM4C |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 880 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1340.05 грн |
| 10+ | 1031.17 грн |
| 80+ | 870.85 грн |
| MC34827A1EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
товар відсутній
| MC34827A2EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
товар відсутній
| MCIMX233CAG4C |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 425 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1309.49 грн |
| 10+ | 1007.76 грн |
| 80+ | 851.09 грн |
| MPC8309CVMAHFCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
на замовлення 410 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2782.48 грн |
| 10+ | 2149.08 грн |
| 80+ | 1835.18 грн |
| SSL4101/1,518 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
товар відсутній
| OM13001,598 |
Виробник: NXP USA Inc.
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
товар відсутній
| TWR-RS08DC-KA8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
товар відсутній
| TWR-S08DC-AC60 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
товар відсутній
| TWR-S08DC-QG8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1293.85 грн |
| TWR-S08DC-SH8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
товар відсутній
| 1323XDSK |
|
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
товар відсутній
| 1323XDSK-BDM |
|
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24234.73 грн |
| MCIMX50EVK |
|
Виробник: NXP USA Inc.
Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 38423.66 грн |
| MC13850EPR2 |
|
Виробник: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
товар відсутній
| MC13852EPR2 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
товар відсутній
| MC9S08GW32CLK |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX534AVV8CR2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
товар відсутній
| MCIMX536AVV8CR2 |
Виробник: NXP USA Inc.
Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
товар відсутній
| MCIMX537CVV8CR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
товар відсутній
| DEMO9S12XHY256 |
Виробник: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
товар відсутній