Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36388) > Сторінка 182 з 607
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CBTL02043ABQ,115 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFNPackaging: Cut Tape (CT) Features: Bi-Directional, SATA Package / Case: 20-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: DisplayPort, PCIe, USB On-State Resistance (Max): 6Ohm (Typ) -3db Bandwidth: 10GHz Supplier Device Package: 20-DHVQFN (4.5x2.5) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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CBTL02043BBQ,115 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFNMounting Type: Surface Mount Package / Case: 20-VFQFN Exposed Pad Features: Bi-Directional, SATA Packaging: Cut Tape (CT) Voltage - Supply, Single (V+): 3V ~ 3.6V Supplier Device Package: 20-DHVQFN (4.5x2.5) -3db Bandwidth: 10GHz On-State Resistance (Max): 6Ohm (Typ) Applications: DisplayPort, PCIe, USB Operating Temperature: -40°C ~ 85°C (TA) Number of Channels: 2 Part Status: Obsolete Multiplexer/Demultiplexer Circuit: 2:1 |
товару немає в наявності |
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| PCF7931AS/3851,122 | NXP USA Inc. | Description: PROG ID TRANS LEADLESS STICK |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| PCF7936AS/3851/C,1 | NXP USA Inc. | Description: RFID TAG R/W 125KHZ ENCAP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PJF7992ATW/C1C,518 | NXP USA Inc. | Description: IMMOBIL BASESTATION IC 20HTSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13005,598 | NXP USA Inc. |
Description: BOARD EVAL EM773 METER US PLUG |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| MC33970DWR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Grade: Automotive Motor Type - Stepper: Bipolar Supplier Device Package: 24-SOIC Voltage - Load: 6.5V ~ 26V Voltage - Supply: 4.5V ~ 5.5V Output Configuration: Half Bridge (8) Operating Temperature: -40°C ~ 150°C (TJ) Interface: SPI Current - Output: 40mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MMA2260DR2 | NXP USA Inc. |
Description: ACCELEROMETER 1.5G ANALOG 16SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC1850FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 11813 шт: термін постачання 21-31 дні (днів) |
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LPC1830FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGADigiKey Programmable: Not Verified Number of I/O: 164 Supplier Device Package: 256-LBGA (17x17) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 200K x 8 Speed: 180MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13313,598 | NXP USA Inc. |
Description: EVAL BOARD FOR TDA5051APart Status: Obsolete Supplied Contents: Board(s) Utilized IC / Part: TDA5051A Type: Interface Function: Power Line Transceiver Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SSL2103T/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL TRIAC 14SOSupplier Device Package: 14-SO Topology: Flyback, Step-Down (Buck) Internal Switch(s): No Operating Temperature: -40°C ~ 100°C (TA) Type: AC DC Offline Switcher Frequency: 100kHz Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) Voltage - Supply (Max): 28V Voltage - Supply (Min): 12V Dimming: Triac |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| TFA9881UK/N1,118 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSPPackaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 9-WLCSP (1.3x1.3) Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 9-UFBGA, WLCSP Features: Depop, Overvoltage, Short Circuit, Thermal Protection |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| TFA9881UK/N1,118 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSPPart Status: Obsolete Supplier Device Package: 9-WLCSP (1.3x1.3) Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 9-UFBGA, WLCSP Features: Depop, Overvoltage, Short Circuit, Thermal Protection Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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LPC1788FET208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 208TFBGAPackaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
на замовлення 3597 шт: термін постачання 21-31 дні (днів) |
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LPC1778FET208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 208TFBGADigiKey Programmable: Not Verified Number of I/O: 165 Part Status: Active Supplier Device Package: 208-TFBGA (15x15) Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-TFBGA Packaging: Tray |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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LPC1788FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 165 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC1778FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFPDigiKey Programmable: Not Verified Number of I/O: 165 Supplier Device Package: 208-LQFP (28x28) Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TFA9882UK/N1,023 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSPPackaging: Tape & Reel (TR) Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFNControl Interface: I²C Part Status: Obsolete Supplier Device Package: 32-HVQFN (3x6) Applications: Video Display Voltage - Supply: 3.0V ~ 3.6V Function: Multiplexer Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA9621PW,118 | NXP USA Inc. |
Description: IC BUS PORT 8BIT 65MA 16TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFNControl Interface: I²C Part Status: Obsolete Supplier Device Package: 32-HVQFN (3x6) Applications: Video Display Voltage - Supply: 3.0V ~ 3.6V Function: Multiplexer Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-K60N512-KEIL | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51JF | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRDContents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box Platform: Tower System Utilized IC / Part: MCF51JF Core Processor: Coldfire V1 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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LFSTBEB3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELERContents: Board(s), Cable(s) Interface: I2C Part Status: Obsolete Sensing Range: ±2g, 4g, 8g, ±1000µT Embedded: No Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MAG3110, MMA8451Q Sensor Type: Accelerometer, Magnetometer Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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RD4247MAG3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELERContents: Board(s), Cable(s) Sensing Range: ±2g, 4g, 8g, ±1000µT Embedded: No Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MAG3110, MMA8451Q Sensor Type: Accelerometer, Magnetometer Interface: I2C Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Packaging: Box Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCIMX-LVDS1 | NXP USA Inc. |
Description: DAUGHTER CARD LVDS FOR I.MX53Accessory Type: Display - LVDS Interface Add-On Board For Use With/Related Products: i.MX53 Packaging: Box |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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FSLBOT | NXP USA Inc. |
Description: KIT TOWER MECH BOARDPackaging: Box Configuration: Servo Actuators Contents: Board(s), Components, Hardware, Servo(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-AUDIO-SGTL | NXP USA Inc. |
Description: TOWER SYSTEM KIT AUDIO Accessory Type: Module, Audio with CODEC For Use With/Related Products: Freescale Tower System Packaging: Box Utilized IC / Part: Freescale Tower System |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-K53N512 | NXP USA Inc. |
Description: TOWER SYSTEM K53 EVAL BRD |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51QM | NXP USA Inc. |
Description: TOWER SYSTEM MCF51QM EVAL BRDPart Status: Active Platform: Tower System Utilized IC / Part: MCF51QM Board Type: Evaluation Platform Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51QM-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51QM EVAL BRDUtilized IC / Part: MCF51QM Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box Platform: Tower System |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MECH | NXP USA Inc. |
Description: KIT TOWER ROBOT SENSOR MOTORPackaging: Box Configuration: Robot Components Contents: Board(s), Cable(s), Components, Hardware, Wheel(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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EVBUSB2SER | NXP USA Inc. |
Description: USB TO SERIAL BRIDGE Accessory Type: USB to Serial TTL Adapter Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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U-MULTILINK | NXP USA Inc. |
Description: USB MULTILINK PROGRAMMERPackaging: Box For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Part Status: Active Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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MCZ33903BD5EK | NXP USA Inc. |
Description: IC SBC CAN HS 5.0V 32SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33903BS3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICInterface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Box Supplier Device Package: 32-SSOP-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33903BS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCZ33905BD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOICSupplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-MCF51JF-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRDPlatform: Tower System Utilized IC / Part: MCF51JF Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 393 шт: термін постачання 21-31 дні (днів) |
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MCIMX233DJM4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGAPackaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 188 шт: термін постачання 21-31 дні (днів) |
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MCZ33905BD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x3) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x4) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCIMX233CAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 375 шт: термін постачання 21-31 дні (днів) |
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MPC8309CVMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGAAdditional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 417MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8156ETVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8156ESVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8154TVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MSC8154ETVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SSL4101/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SOVoltage - Supply (Max): 38V Voltage - Supply (Min): 15V Supplier Device Package: 16-SO Topology: Flyback Internal Switch(s): No Applications: Lighting Operating Temperature: -40°C ~ 150°C (TJ) Type: AC DC Offline Switcher Frequency: 380kHz Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Part Status: Active Utilized IC / Part: LPC1788 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M3 Contents: Board(s), Cable(s), Accessories Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08AC60 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08QG8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08SH8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
товару немає в наявності |
В кошику од. на суму грн. |
| CBTL02043ABQ,115 |
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Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFN
Packaging: Cut Tape (CT)
Features: Bi-Directional, SATA
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 10GHz
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFN
Packaging: Cut Tape (CT)
Features: Bi-Directional, SATA
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 10GHz
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 163.77 грн |
| 10+ | 117.17 грн |
| 25+ | 106.97 грн |
| 100+ | 89.81 грн |
| CBTL02043BBQ,115 |
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Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFN
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Supplier Device Package: 20-DHVQFN (4.5x2.5)
-3db Bandwidth: 10GHz
On-State Resistance (Max): 6Ohm (Typ)
Applications: DisplayPort, PCIe, USB
Operating Temperature: -40°C ~ 85°C (TA)
Number of Channels: 2
Part Status: Obsolete
Multiplexer/Demultiplexer Circuit: 2:1
Description: IC MUX/DEMUX 2:1 PCI 20DHVQFN
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Supplier Device Package: 20-DHVQFN (4.5x2.5)
-3db Bandwidth: 10GHz
On-State Resistance (Max): 6Ohm (Typ)
Applications: DisplayPort, PCIe, USB
Operating Temperature: -40°C ~ 85°C (TA)
Number of Channels: 2
Part Status: Obsolete
Multiplexer/Demultiplexer Circuit: 2:1
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В кошику
од. на суму грн.
| PCF7931AS/3851,122 |
Виробник: NXP USA Inc.
Description: PROG ID TRANS LEADLESS STICK
Description: PROG ID TRANS LEADLESS STICK
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В кошику
од. на суму грн.
| PCF7936AS/3851/C,1 |
Виробник: NXP USA Inc.
Description: RFID TAG R/W 125KHZ ENCAP
Description: RFID TAG R/W 125KHZ ENCAP
товару немає в наявності
В кошику
од. на суму грн.
| PJF7992ATW/C1C,518 |
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
Description: IMMOBIL BASESTATION IC 20HTSSOP
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В кошику
од. на суму грн.
| OM13005,598 |
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Виробник: NXP USA Inc.
Description: BOARD EVAL EM773 METER US PLUG
Description: BOARD EVAL EM773 METER US PLUG
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В кошику
од. на суму грн.
| MC33970DWR2 |
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Grade: Automotive
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-SOIC
Voltage - Load: 6.5V ~ 26V
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Half Bridge (8)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: SPI
Current - Output: 40mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Grade: Automotive
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-SOIC
Voltage - Load: 6.5V ~ 26V
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Half Bridge (8)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: SPI
Current - Output: 40mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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В кошику
од. на суму грн.
| MMA2260DR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
товару немає в наявності
В кошику
од. на суму грн.
| LPC1850FET256,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 11813 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1106.84 грн |
| 10+ | 843.91 грн |
| 90+ | 731.17 грн |
| 180+ | 664.25 грн |
| 270+ | 653.27 грн |
| 540+ | 637.17 грн |
| LPC1830FET256,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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В кошику
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| OM13313,598 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TDA5051A
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA5051A
Type: Interface
Function: Power Line Transceiver
Packaging: Box
Description: EVAL BOARD FOR TDA5051A
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA5051A
Type: Interface
Function: Power Line Transceiver
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| SSL2103T/1,518 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL TRIAC 14SO
Supplier Device Package: 14-SO
Topology: Flyback, Step-Down (Buck)
Internal Switch(s): No
Operating Temperature: -40°C ~ 100°C (TA)
Type: AC DC Offline Switcher
Frequency: 100kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 28V
Voltage - Supply (Min): 12V
Dimming: Triac
Description: IC LED DRIVER OFFL TRIAC 14SO
Supplier Device Package: 14-SO
Topology: Flyback, Step-Down (Buck)
Internal Switch(s): No
Operating Temperature: -40°C ~ 100°C (TA)
Type: AC DC Offline Switcher
Frequency: 100kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 28V
Voltage - Supply (Min): 12V
Dimming: Triac
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В кошику
од. на суму грн.
| TFA9881UK/N1,118 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
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В кошику
од. на суму грн.
| TFA9881UK/N1,118 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Packaging: Cut Tape (CT)
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Packaging: Cut Tape (CT)
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В кошику
од. на суму грн.
| LPC1788FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 3597 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1447.04 грн |
| 10+ | 1112.47 грн |
| 25+ | 1042.26 грн |
| 126+ | 896.19 грн |
| 252+ | 870.98 грн |
| 504+ | 850.23 грн |
| LPC1778FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1168.55 грн |
| 10+ | 890.31 грн |
| 25+ | 831.68 грн |
| LPC1788FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
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| LPC1778FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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| TFA9882UK/N1,023 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
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| CBTL04DP211BS,518 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| PCA9621PW,118 |
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Виробник: NXP USA Inc.
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Description: IC BUS PORT 8BIT 65MA 16TSSOP
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| CBTL04DP211BS,518 |
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Виробник: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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| TWR-K60N512-KEIL |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
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| TWR-MCF51JF |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Description: TOWER SYSTEM MCF51JF EVAL BRD
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5654.44 грн |
| LFSTBEB3110 |
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Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Interface: I2C
Part Status: Obsolete
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Interface: I2C
Part Status: Obsolete
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
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| RD4247MAG3110 |
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Виробник: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Part Status: Active
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Part Status: Active
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| MCIMX-LVDS1 |
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Виробник: NXP USA Inc.
Description: DAUGHTER CARD LVDS FOR I.MX53
Accessory Type: Display - LVDS Interface Add-On Board
For Use With/Related Products: i.MX53
Packaging: Box
Description: DAUGHTER CARD LVDS FOR I.MX53
Accessory Type: Display - LVDS Interface Add-On Board
For Use With/Related Products: i.MX53
Packaging: Box
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 42761.56 грн |
| FSLBOT |
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Виробник: NXP USA Inc.
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
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| TWR-AUDIO-SGTL |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM KIT AUDIO
Accessory Type: Module, Audio with CODEC
For Use With/Related Products: Freescale Tower System
Packaging: Box
Utilized IC / Part: Freescale Tower System
Description: TOWER SYSTEM KIT AUDIO
Accessory Type: Module, Audio with CODEC
For Use With/Related Products: Freescale Tower System
Packaging: Box
Utilized IC / Part: Freescale Tower System
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| TWR-K53N512 |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM K53 EVAL BRD
Description: TOWER SYSTEM K53 EVAL BRD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| TWR-MCF51QM |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MCF51QM
Board Type: Evaluation Platform
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51QM EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MCF51QM
Board Type: Evaluation Platform
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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| TWR-MCF51QM-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Utilized IC / Part: MCF51QM
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Description: TOWER SYSTEM MCF51QM EVAL BRD
Utilized IC / Part: MCF51QM
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
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| TWR-MECH |
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Виробник: NXP USA Inc.
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
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| EVBUSB2SER |
Виробник: NXP USA Inc.
Description: USB TO SERIAL BRIDGE
Accessory Type: USB to Serial TTL Adapter
Packaging: Box
Description: USB TO SERIAL BRIDGE
Accessory Type: USB to Serial TTL Adapter
Packaging: Box
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| U-MULTILINK |
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Виробник: NXP USA Inc.
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 24780.01 грн |
| MCZ33903BD5EK |
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Виробник: NXP USA Inc.
Description: IC SBC CAN HS 5.0V 32SOIC
Description: IC SBC CAN HS 5.0V 32SOIC
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| MCZ33903BS3EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Description: IC INTERFACE SPECIALIZED 32SOIC
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
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| MCZ33903BS5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MCZ33905BD3EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
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| TWR-MCF51JF-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8425.09 грн |
| MCIMX233DAG4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 393 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1131.36 грн |
| 10+ | 864.94 грн |
| 25+ | 808.79 грн |
| 100+ | 731.41 грн |
| MCIMX233DJM4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 188 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1314.12 грн |
| 10+ | 1009.24 грн |
| 25+ | 945.19 грн |
| 100+ | 861.40 грн |
| MCZ33905BD5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Description: IC INTERFACE SPECIALIZED 54SOIC
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| MC34827A1EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MC34827A2EPR2 |
Виробник: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MCIMX233CAG4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 375 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1287.22 грн |
| 10+ | 987.60 грн |
| 25+ | 924.72 грн |
| 100+ | 841.84 грн |
| MPC8309CVMAHFCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
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| MSC8156ETVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
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| MSC8156ESVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
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| MSC8154TVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
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| MSC8154ETVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
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| SSL4101/1,518 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| OM13001,598 |
Виробник: NXP USA Inc.
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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| TWR-RS08DC-KA8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
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| TWR-S08DC-AC60 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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| TWR-S08DC-QD4 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
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| TWR-S08DC-QE64 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
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| TWR-S08DC-QG8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1439.92 грн |
| TWR-S08DC-SH8 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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| 1323XUSB |
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Description: RF EVAL FOR MC1323X
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