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S9S12G96F0MLL S9S12G96F0MLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 100LQFP
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
S9S12GN16F0CLF S9S12GN16F0CLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN16F0VLF S9S12GN16F0VLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN32F0MFT S9S12GN32F0MFT NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
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S9S12GN32F0MLF S9S12GN32F0MLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN32F0VLF S9S12GN32F0VLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
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S9S12XS128J1CALR S9S12XS128J1CALR NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
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SPC5534MVM80R SPC5534MVM80R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 192
DigiKey Programmable: Not Verified
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SPC5606SF2VLU6 SPC5606SF2VLU6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
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SPC5632MF1MLQ60 SPC5632MF1MLQ60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
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SPC5633MF1MLU60 SPC5633MF1MLU60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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SPC5634MF1MLQ60 SPC5634MF1MLQ60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5634MF1MLU60 SPC5634MF1MLU60 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
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SPC5634MF1MLU80 SPC5634MF1MLU80 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 520 шт:
термін постачання 21-31 дні (днів)
1+2429.53 грн
10+1876.25 грн
80+1602.18 грн
440+1483.79 грн
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BGA2817,115 BGA2817,115 NXP USA Inc. BGA2817.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)
3000+14.12 грн
6000+13.05 грн
9000+12.74 грн
15000+11.61 грн
Мінімальне замовлення: 3000
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BGA2817,115 BGA2817,115 NXP USA Inc. BGA2817.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 18683 шт:
термін постачання 21-31 дні (днів)
14+23.96 грн
17+19.49 грн
25+18.39 грн
100+15.77 грн
250+14.88 грн
500+14.24 грн
1000+13.42 грн
Мінімальне замовлення: 14
В кошику  од. на суму  грн.
LPC4330FBD144,551 LPC4330FBD144,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 193 шт:
термін постачання 21-31 дні (днів)
1+639.39 грн
10+454.55 грн
60+440.19 грн
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LPC4330FET100,551 LPC4330FET100,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
1+437.00 грн
10+420.18 грн
25+419.80 грн
100+393.67 грн
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PTN3460BS/F2,518 PTN3460BS/F2,518 NXP USA Inc. PTN3460.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
2000+158.69 грн
Мінімальне замовлення: 2000
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PTN3460BS/F2,518 PTN3460BS/F2,518 NXP USA Inc. PTN3460.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 5250 шт:
термін постачання 21-31 дні (днів)
2+313.91 грн
10+229.58 грн
25+211.35 грн
100+179.52 грн
250+170.54 грн
500+165.12 грн
1000+158.03 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TDF8530TH/N1,518 TDF8530TH/N1,518 NXP USA Inc. TDF8530TH.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541TH/N2,518 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8546TH/N1,518 TDF8546TH/N1,518 NXP USA Inc. 75017062.pdf Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8597TH/N1,118 TDF8597TH/N1,118 NXP USA Inc. Description: IC AMP D MONO/STEREO 150W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8599CTH/N1,118 TDF8599CTH/N1,118 NXP USA Inc. TDF8599B.pdf Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+2080.46 грн
Мінімальне замовлення: 500
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TDF8530TH/N1,512 TDF8530TH/N1,512 NXP USA Inc. TDF8530TH.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541J/N2,112 TDF8541J/N2,112 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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TDF8541SD/N2,112 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W 27RDBS
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
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TDF8599CTH/N1,112 TDF8599CTH/N1,112 NXP USA Inc. Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8530TH/N1,518 TDF8530TH/N1,518 NXP USA Inc. TDF8530TH.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541TH/N2,518 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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В кошику  од. на суму  грн.
TDF8546TH/N1,518 TDF8546TH/N1,518 NXP USA Inc. 75017062.pdf Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8599CTH/N1,118 TDF8599CTH/N1,118 NXP USA Inc. TDF8599B.pdf Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
1+3062.32 грн
10+2243.45 грн
25+2063.00 грн
100+1747.29 грн
250+1734.78 грн
В кошику  од. на суму  грн.
MMA3202KEGR2 MMA3202KEGR2 NXP USA Inc. MMA3202KEG.pdf Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
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MMA3202KEGR2 MMA3202KEGR2 NXP USA Inc. MMA3202KEG.pdf Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
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OM13035,598 OM13035,598 NXP USA Inc. 75016842.pdf Description: LPCXPRESSO LPC111X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC111x
Platform: LPCXpresso™
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OM7827/BFU6AND7XXK OM7827/BFU6AND7XXK NXP USA Inc. BFU690F.pdf Description: KIT STARTER FOR BFU6X0F/BFU7X0F
Packaging: Bulk
For Use With/Related Products: BFU690F
Type: Transistor
Supplied Contents: Board(s)
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OM6297,598 OM6297,598 NXP USA Inc. RTC-DEMO-PCF2123_Brochure.pdf Description: EVAL BOARD PCF2123 PCA2125 LM75B
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123, PCA2125, LM75B, P89LPC932A1
Supplied Contents: Board(s)
Primary Attributes: Resolution - Sec, Minutes, Hours, Weekday, Day, Month, Year
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
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LPC1114FHI33/302,5 LPC1114FHI33/302,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 1380 шт:
термін постачання 21-31 дні (днів)
2+280.04 грн
10+156.24 грн
25+151.46 грн
100+137.71 грн
490+132.94 грн
980+129.58 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PCF8885TS/1,118 PCF8885TS/1,118 NXP USA Inc. PCF8885.pdf Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9629PW,118 PCA9629PW,118 NXP USA Inc. Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
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PCA9509AGM,125 PCA9509AGM,125 NXP USA Inc. PCA9509A.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCA9509ADP,118 PCA9509ADP,118 NXP USA Inc. PCA9509A.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCF8885TS/1,118 PCF8885TS/1,118 NXP USA Inc. PCF8885.pdf Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
2+249.48 грн
5+208.42 грн
10+196.88 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PCA9629PW,118 PCA9629PW,118 NXP USA Inc. Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
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PCA9509ADP,118 PCA9509ADP,118 NXP USA Inc. PCA9509A.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
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BGA7204,115 BGA7204,115 NXP USA Inc. BGA7204.pdf Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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BGA7204,115 BGA7204,115 NXP USA Inc. BGA7204.pdf Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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BGA7210,515 BGA7210,515 NXP USA Inc. BGA7210_Rev5_DS.pdf Description: IC AMP GPS 700MHZ-3.8GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 28dB
Current - Supply: 195mA
Noise Figure: 6.5dB ~ 8dB
P1dB: 23dBm
Test Frequency: 2.5GHz
Supplier Device Package: 32-HVQFN (5x5)
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NX1117C33Z,115 NX1117C33Z,115 NXP USA Inc. NX1117C(E).pdf Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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NX1117C50Z,115 NX1117C50Z,115 NXP USA Inc. NX1117C%28E%29.pdf Description: IC REG LINEAR 5V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 59dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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TWR-P1025 TWR-P1025 NXP USA Inc. Description: TOWER SYSTEM P1025 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Utilized IC / Part: P1025
Platform: Tower System
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TWR-MPC8309 TWR-MPC8309 NXP USA Inc. TWRMPC8309SCH.pdf Description: TOWER SYSTEM MPC8309 EVAL BRD
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TWR-K60F120M TWR-K60F120M NXP USA Inc. TWRK60F120MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+12003.92 грн
В кошику  од. на суму  грн.
TWR-K60F120M-KIT TWR-K60F120M-KIT NXP USA Inc. TWRK60F120MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
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TWR-K70F120M TWR-K70F120M NXP USA Inc. TWRK70F120MQSG.pdf Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
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TWR-K70F120M-KIT TWR-K70F120M-KIT NXP USA Inc. TWRK70F120MQSG.pdf Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
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TWR-S08DC-PT60 TWR-S08DC-PT60 NXP USA Inc. TWR-S08DC-PT60_QSG.pdf Description: TOWER SYSTEM MC9S08P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08P
Platform: Tower System
Part Status: Active
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TWR-S12G240 TWR-S12G240 NXP USA Inc. MC9S12GRMV1.pdf?pspll=1 Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
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TWR-S12G64 TWR-S12G64 NXP USA Inc. MC9S12GRMV1.pdf?pspll=1 Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+25803.75 грн
В кошику  од. на суму  грн.
S9S12G96F0MLL MC9S12GRMV1.pdf
S9S12G96F0MLL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
S9S12GN16F0CLF MC9S12GRMV1.pdf
S9S12GN16F0CLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN16F0VLF MC9S12GRMV1.pdf
S9S12GN16F0VLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN32F0MFT MC9S12GRMV1.pdf
S9S12GN32F0MFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
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S9S12GN32F0MLF MC9S12GRMV1.pdf
S9S12GN32F0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN32F0VLF MC9S12GRMV1.pdf
S9S12GN32F0VLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
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S9S12XS128J1CALR S12XSFS.pdf
S9S12XS128J1CALR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
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SPC5534MVM80R
SPC5534MVM80R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 192
DigiKey Programmable: Not Verified
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SPC5606SF2VLU6 MPC5606S.pdf
SPC5606SF2VLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
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SPC5632MF1MLQ60 MPC5634M.pdf
SPC5632MF1MLQ60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
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SPC5633MF1MLU60 MPC5634M.pdf
SPC5633MF1MLU60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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SPC5634MF1MLQ60 MPC5634M.pdf
SPC5634MF1MLQ60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5634MF1MLU60
SPC5634MF1MLU60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
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SPC5634MF1MLU80
SPC5634MF1MLU80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 520 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2429.53 грн
10+1876.25 грн
80+1602.18 грн
440+1483.79 грн
В кошику  од. на суму  грн.
BGA2817,115 BGA2817.pdf
BGA2817,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+14.12 грн
6000+13.05 грн
9000+12.74 грн
15000+11.61 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
BGA2817,115 BGA2817.pdf
BGA2817,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 18683 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+23.96 грн
17+19.49 грн
25+18.39 грн
100+15.77 грн
250+14.88 грн
500+14.24 грн
1000+13.42 грн
Мінімальне замовлення: 14
В кошику  од. на суму  грн.
LPC4330FBD144,551 LPC4350_30_20_10.pdf
LPC4330FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 193 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+639.39 грн
10+454.55 грн
60+440.19 грн
В кошику  од. на суму  грн.
LPC4330FET100,551 LPC4350_30_20_10.pdf
LPC4330FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+437.00 грн
10+420.18 грн
25+419.80 грн
100+393.67 грн
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460.pdf
PTN3460BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+158.69 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460.pdf
PTN3460BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 5250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+313.91 грн
10+229.58 грн
25+211.35 грн
100+179.52 грн
250+170.54 грн
500+165.12 грн
1000+158.03 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
TDF8530TH/N1,518 TDF8530TH.pdf
TDF8530TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541.PDF
TDF8541TH/N2,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8546TH/N1,518 75017062.pdf
TDF8546TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8597TH/N1,118
TDF8597TH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8599CTH/N1,118 TDF8599B.pdf
TDF8599CTH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+2080.46 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
TDF8530TH/N1,512 TDF8530TH.pdf
TDF8530TH/N1,512
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541J/N2,112 TDF8541.PDF
TDF8541J/N2,112
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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TDF8541SD/N2,112 TDF8541.PDF
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 27RDBS
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
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TDF8599CTH/N1,112
TDF8599CTH/N1,112
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8530TH/N1,518 TDF8530TH.pdf
TDF8530TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541.PDF
TDF8541TH/N2,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8546TH/N1,518 75017062.pdf
TDF8546TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
товару немає в наявності
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TDF8599CTH/N1,118 TDF8599B.pdf
TDF8599CTH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3062.32 грн
10+2243.45 грн
25+2063.00 грн
100+1747.29 грн
250+1734.78 грн
В кошику  од. на суму  грн.
MMA3202KEGR2 MMA3202KEG.pdf
MMA3202KEGR2
Виробник: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
товару немає в наявності
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MMA3202KEGR2 MMA3202KEG.pdf
MMA3202KEGR2
Виробник: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
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OM13035,598 75016842.pdf
OM13035,598
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC111X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC111x
Platform: LPCXpresso™
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OM7827/BFU6AND7XXK BFU690F.pdf
OM7827/BFU6AND7XXK
Виробник: NXP USA Inc.
Description: KIT STARTER FOR BFU6X0F/BFU7X0F
Packaging: Bulk
For Use With/Related Products: BFU690F
Type: Transistor
Supplied Contents: Board(s)
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OM6297,598 RTC-DEMO-PCF2123_Brochure.pdf
OM6297,598
Виробник: NXP USA Inc.
Description: EVAL BOARD PCF2123 PCA2125 LM75B
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123, PCA2125, LM75B, P89LPC932A1
Supplied Contents: Board(s)
Primary Attributes: Resolution - Sec, Minutes, Hours, Weekday, Day, Month, Year
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
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LPC1114FHI33/302,5 LPC111X.pdf
LPC1114FHI33/302,5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 1380 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+280.04 грн
10+156.24 грн
25+151.46 грн
100+137.71 грн
490+132.94 грн
980+129.58 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PCF8885TS/1,118 PCF8885.pdf
PCF8885TS/1,118
Виробник: NXP USA Inc.
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9629PW,118
PCA9629PW,118
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
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PCA9509AGM,125 PCA9509A.pdf
PCA9509AGM,125
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCA9509ADP,118 PCA9509A.pdf
PCA9509ADP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
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PCF8885TS/1,118 PCF8885.pdf
PCF8885TS/1,118
Виробник: NXP USA Inc.
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+249.48 грн
5+208.42 грн
10+196.88 грн
Мінімальне замовлення: 2
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PCA9629PW,118
PCA9629PW,118
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
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PCA9509ADP,118 PCA9509A.pdf
PCA9509ADP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
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BGA7204,115 BGA7204.pdf
BGA7204,115
Виробник: NXP USA Inc.
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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BGA7204,115 BGA7204.pdf
BGA7204,115
Виробник: NXP USA Inc.
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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BGA7210,515 BGA7210_Rev5_DS.pdf
BGA7210,515
Виробник: NXP USA Inc.
Description: IC AMP GPS 700MHZ-3.8GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 28dB
Current - Supply: 195mA
Noise Figure: 6.5dB ~ 8dB
P1dB: 23dBm
Test Frequency: 2.5GHz
Supplier Device Package: 32-HVQFN (5x5)
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NX1117C33Z,115 NX1117C(E).pdf
NX1117C33Z,115
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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NX1117C50Z,115 NX1117C%28E%29.pdf
NX1117C50Z,115
Виробник: NXP USA Inc.
Description: IC REG LINEAR 5V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 59dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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TWR-P1025
TWR-P1025
Виробник: NXP USA Inc.
Description: TOWER SYSTEM P1025 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Utilized IC / Part: P1025
Platform: Tower System
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TWR-MPC8309 TWRMPC8309SCH.pdf
TWR-MPC8309
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MPC8309 EVAL BRD
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TWR-K60F120M TWRK60F120MQSG.pdf
TWR-K60F120M
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12003.92 грн
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TWR-K60F120M-KIT TWRK60F120MQSG.pdf
TWR-K60F120M-KIT
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
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TWR-K70F120M TWRK70F120MQSG.pdf
TWR-K70F120M
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
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TWR-K70F120M-KIT TWRK70F120MQSG.pdf
TWR-K70F120M-KIT
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
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TWR-S08DC-PT60 TWR-S08DC-PT60_QSG.pdf
TWR-S08DC-PT60
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08P
Platform: Tower System
Part Status: Active
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TWR-S12G240 MC9S12GRMV1.pdf?pspll=1
TWR-S12G240
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
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TWR-S12G64 MC9S12GRMV1.pdf?pspll=1
TWR-S12G64
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+25803.75 грн
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