Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35697) > Сторінка 199 з 595

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MC9S12P32MFT MC9S12P32MFT NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S12XD128CAA MC9S12XD128CAA NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
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MC9S12XEG128CALR MC9S12XEG128CALR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
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MC9S12XEP100CVL MC9S12XEP100CVL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
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MC9S12XS256CAE MC9S12XS256CAE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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MCF51JM128VLHR MCF51JM128VLHR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
1500+639.58 грн
Мінімальне замовлення: 1500
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MCIMX233CJM4CR2 MCIMX233CJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
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MCIMX280CVM4B MCIMX280CVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 585 шт:
термін постачання 21-31 дні (днів)
1+1467.91 грн
10+1128.23 грн
25+1056.95 грн
80+928.39 грн
230+886.18 грн
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MCZ33903BS3EKR2 MCZ33903BS3EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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MCZ33905BD3EKR2 MCZ33905BD3EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MCZ33905BD5EKR2 MCZ33905BD5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MD7IC2250NBR1 MD7IC2250NBR1 NXP USA Inc. FSCLS05772-1.pdf?t.download=true&u=5oefqw Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
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MD8IC970GNR1 NXP USA Inc. Description: IC AMP GPS 850MHZ-940MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 850MHz ~ 940MHz
RF Type: General Purpose
Voltage - Supply: 32V
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16 GULL
Part Status: Obsolete
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MD8IC970NR1 NXP USA Inc. Description: IC AMP GPS 850MHZ-940MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 850MHz ~ 940MHz
RF Type: General Purpose
Voltage - Supply: 32V
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16
Part Status: Active
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MK10DN512ZVLL10R MK10DN512ZVLL10R NXP USA Inc. K10P100M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
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MK10DX256ZVLQ10R MK10DX256ZVLQ10R NXP USA Inc. K10_Sub-Family_K10P144M100SF2.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
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MK30DN512ZVLQ10R MK30DN512ZVLQ10R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
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MM908E621ACPEK NXP USA Inc. Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
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MM908E621ACPEKR2 NXP USA Inc. MM908E621.pdf Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MM908E622ACPEKR2 MM908E622ACPEKR2 NXP USA Inc. MM908E622.pdf Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MMA2300KEG MMA2300KEG NXP USA Inc. Description: IC SENSOR ACCELEROMETER 16SOIC
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MMA2300KEGR2 MMA2300KEGR2 NXP USA Inc. Description: IC SENSOR ACCELEROMETER 16SOIC
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MMA2631NKWR2 NXP USA Inc. MMA26xxNKW.pdf Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Obsolete
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MMA5224KWR2 NXP USA Inc. MMA52xxKW.pdf Description: ACCELEROMETER 240G PCM/SPI 16QFN
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MMA621010AKEG MMA621010AKEG NXP USA Inc. Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±100g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MMA621010AKEGR2 MMA621010AKEGR2 NXP USA Inc. MMA6222AKEG.pdf Description: ACCELEROMETER 100G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±100g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 4.68mV/V/g
Grade: Automotive
Qualification: AEC-Q100
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MMA6519KW MMA6519KW NXP USA Inc. MMA65xx.pdf Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tube
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
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MMA6519KWR2 MMA6519KWR2 NXP USA Inc. MMA65xx.pdf Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
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MMA6525KW MMA6525KW NXP USA Inc. MMA65xx.pdf Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
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MMA6853KWR2 MMA6853KWR2 NXP USA Inc. Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
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MMA6900KQR2 MMA6900KQR2 NXP USA Inc. Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
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MMA6901KQR2 MMA6901KQR2 NXP USA Inc. MMA69XX.pdf Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
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MMA8210KEG MMA8210KEG NXP USA Inc. Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
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MMA8210KEGR2 MMA8210KEGR2 NXP USA Inc. Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
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MMG15241HT1 MMG15241HT1 NXP USA Inc. Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 500MHz ~ 2.8GHz
RF Type: W-CDMA
Voltage - Supply: 5V
Gain: 15.9dB
Current - Supply: 85mA
Noise Figure: 1.6dB
P1dB: 24dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+121.34 грн
Мінімальне замовлення: 1000
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MPC17531ATEVEL MPC17531ATEVEL NXP USA Inc. Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MPC5606S-DEMO-V2 NXP USA Inc. MPC5602,4,6S.pdf Description: MPC5606S EVAL BRD
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MPC8306CVMAFDCA MPC8306CVMAFDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
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MPC8306SCVMAFDCA MPC8306SCVMAFDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
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MPC8306SVMAFDCA MPC8306SVMAFDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 333MHZ 369BGA
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MPC8306VMAFDCA MPC8306VMAFDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
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MPC8308CVMAGD MPC8308CVMAGD NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
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MPC8309CVMAGDCA MPC8309CVMAGDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 400MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
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MPC8313CVRAFFC MPC8313CVRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAFFC MPC8313ECVRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+3127.14 грн
10+2794.05 грн
В кошику  од. на суму  грн.
MPC8313ECZQADDC MPC8313ECZQADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAGDC MPC8313ECZQAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAFFC MPC8313EVRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+4068.70 грн
10+3223.24 грн
В кошику  од. на суму  грн.
MPC8313EZQADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
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MPC8313EZQAGDC MPC8313EZQAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313VRAFFC MPC8313VRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
на замовлення 400 шт:
термін постачання 21-31 дні (днів)
1+3584.42 грн
10+2828.23 грн
25+2672.65 грн
200+2288.08 грн
В кошику  од. на суму  грн.
MPC8548CPXAUJC MPC8548CPXAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548CVTAUJC MPC8548CVTAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548VTATGC MPC8548VTATGC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548VTAUJC MPC8548VTAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8572ELPXAVNE MPC8572ELPXAVNE NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.5GHZ 1023FCBGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MPL3115A2 MPL3115A2 NXP USA Inc. MPL3115A2.pdf Description: SENSOR 15.95PSIA 24BIT 8LGA
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 24 b
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.058PSI (±0.4kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Board Mount
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Obsolete
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MRF6V13250HSR3 MRF6V13250HSR3 NXP USA Inc. Description: FET RF 120V 1.3GHZ NI780S
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MRF6V13250HSR5 MRF6V13250HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MC9S12P32MFT
MC9S12P32MFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S12XD128CAA
MC9S12XD128CAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
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MC9S12XEG128CALR
MC9S12XEG128CALR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
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MC9S12XEP100CVL MC9S12XEPB.pdf
MC9S12XEP100CVL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
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MC9S12XS256CAE
MC9S12XS256CAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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MCF51JM128VLHR MCF51JM128.pdf
MCF51JM128VLHR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1500+639.58 грн
Мінімальне замовлення: 1500
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MCIMX233CJM4CR2 IMX233FS.pdf
MCIMX233CJM4CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
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MCIMX280CVM4B IMX28CEC.pdf
MCIMX280CVM4B
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 585 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1467.91 грн
10+1128.23 грн
25+1056.95 грн
80+928.39 грн
230+886.18 грн
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MCZ33903BS3EKR2 MC33903,4,5.pdf
MCZ33903BS3EKR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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MCZ33905BD3EKR2 MC33903%2C4%2C5.pdf
MCZ33905BD3EKR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MCZ33905BD5EKR2 MC33903%2C4%2C5.pdf
MCZ33905BD5EKR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MD7IC2250NBR1 FSCLS05772-1.pdf?t.download=true&u=5oefqw
MD7IC2250NBR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
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MD8IC970GNR1
Виробник: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 850MHz ~ 940MHz
RF Type: General Purpose
Voltage - Supply: 32V
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16 GULL
Part Status: Obsolete
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MD8IC970NR1
Виробник: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 850MHz ~ 940MHz
RF Type: General Purpose
Voltage - Supply: 32V
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16
Part Status: Active
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MK10DN512ZVLL10R K10P100M100SF2.pdf
MK10DN512ZVLL10R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
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MK10DX256ZVLQ10R K10_Sub-Family_K10P144M100SF2.pdf
MK10DX256ZVLQ10R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
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MK30DN512ZVLQ10R
MK30DN512ZVLQ10R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
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MM908E621ACPEK
Виробник: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
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MM908E621ACPEKR2 MM908E621.pdf
Виробник: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MM908E622ACPEKR2 MM908E622.pdf
MM908E622ACPEKR2
Виробник: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MMA2300KEG
MMA2300KEG
Виробник: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16SOIC
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MMA2300KEGR2
MMA2300KEGR2
Виробник: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16SOIC
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MMA2631NKWR2 MMA26xxNKW.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Obsolete
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MMA5224KWR2 MMA52xxKW.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
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MMA621010AKEG
MMA621010AKEG
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±100g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MMA621010AKEGR2 MMA6222AKEG.pdf
MMA621010AKEGR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 100G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±100g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 4.68mV/V/g
Grade: Automotive
Qualification: AEC-Q100
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MMA6519KW MMA65xx.pdf
MMA6519KW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tube
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
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MMA6519KWR2 MMA65xx.pdf
MMA6519KWR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
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MMA6525KW MMA65xx.pdf
MMA6525KW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
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MMA6853KWR2
MMA6853KWR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
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MMA6900KQR2
MMA6900KQR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
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MMA6901KQR2 MMA69XX.pdf
MMA6901KQR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
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MMA8210KEG
MMA8210KEG
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
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MMA8210KEGR2
MMA8210KEGR2
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
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MMG15241HT1
MMG15241HT1
Виробник: NXP USA Inc.
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 500MHz ~ 2.8GHz
RF Type: W-CDMA
Voltage - Supply: 5V
Gain: 15.9dB
Current - Supply: 85mA
Noise Figure: 1.6dB
P1dB: 24dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+121.34 грн
Мінімальне замовлення: 1000
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MPC17531ATEVEL
MPC17531ATEVEL
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MPC5606S-DEMO-V2 MPC5602,4,6S.pdf
Виробник: NXP USA Inc.
Description: MPC5606S EVAL BRD
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MPC8306CVMAFDCA MPC8306EC.pdf
MPC8306CVMAFDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
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MPC8306SCVMAFDCA MPC8306SEC.pdf
MPC8306SCVMAFDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
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MPC8306SVMAFDCA MPC8306SEC.pdf
MPC8306SVMAFDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
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MPC8306VMAFDCA MPC8306EC.pdf
MPC8306VMAFDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
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MPC8308CVMAGD MPC8308EC.pdf
MPC8308CVMAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
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MPC8309CVMAGDCA MPC8309EC.pdf
MPC8309CVMAGDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
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MPC8313CVRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313CVRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3127.14 грн
10+2794.05 грн
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MPC8313ECZQADDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQAGDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4068.70 грн
10+3223.24 грн
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MPC8313EZQADDC MPC8313E_Hrdw_Spec.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
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MPC8313EZQAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAGDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313VRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313VRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
на замовлення 400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3584.42 грн
10+2828.23 грн
25+2672.65 грн
200+2288.08 грн
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MPC8548CPXAUJC MPC8548EEC.pdf
MPC8548CPXAUJC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548CVTAUJC MPC8548EEC.pdf
MPC8548CVTAUJC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548VTATGC MPC8548EEC.pdf
MPC8548VTATGC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548VTAUJC MPC8548EEC.pdf
MPC8548VTAUJC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8572ELPXAVNE MPC8572E.pdf
MPC8572ELPXAVNE
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 1023FCBGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MPL3115A2 MPL3115A2.pdf
MPL3115A2
Виробник: NXP USA Inc.
Description: SENSOR 15.95PSIA 24BIT 8LGA
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 24 b
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.058PSI (±0.4kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Board Mount
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Obsolete
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MRF6V13250HSR3
MRF6V13250HSR3
Виробник: NXP USA Inc.
Description: FET RF 120V 1.3GHZ NI780S
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MRF6V13250HSR5
MRF6V13250HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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