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ICM7555CN/01,112 ICM7555CN/01,112 NXP USA Inc. ICM7555.pdf Description: IC OSC SINGLE TIMER 500KHZ 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-DIP
Part Status: Obsolete
Current - Supply: 180 µA
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ICM7555ID/01,118 ICM7555ID/01,118 NXP USA Inc. ICM7555.pdf Description: IC OSC SNGL TIMER 500KHZ 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-SO
Part Status: Obsolete
Current - Supply: 180 µA
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ICM7555IN/01,112 ICM7555IN/01,112 NXP USA Inc. ICM7555.pdf Description: IC OSC SINGLE TIMER 500KHZ 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-DIP
Part Status: Obsolete
Current - Supply: 180 µA
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BR100/03,113 BR100/03,113 NXP USA Inc. BR100-03_1.pdf Description: DIAC/SIDAC 28-36V 2A ALF2
Current - Peak Output: 2 A
Part Status: Obsolete
Supplier Device Package: ALF2
Current - Breakover: 50 µA
Voltage - Breakover: 28 ~ 36V
Operating Temperature: 100°C (TJ)
Package / Case: DO-204AH, DO-35, Axial
Packaging: Cut Tape (CT)
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BSH112,235 BSH112,235 NXP USA Inc. Description: MOSFET N-CH 60V 300MA TO236AB
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -65°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 830mW (Tc)
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M5282ZIGBEE M5282ZIGBEE NXP USA Inc. Description: BOARD EVAL ZIGBEE FOR MCF5282
Supplied Contents: Board(s)
Type: 802.15.4/Zigbee™
For Use With/Related Products: MCF5282
Packaging: Bulk
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DEMO908AP64 DEMO908AP64 NXP USA Inc. Description: MC68HC908AP EVAL BRD
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DEMO908GZ60 NXP USA Inc. DEMO908GZ60QSG.pdf Description: MC68HC908GZ60 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MC68HC908GZ60
Core Processor: HC08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Bulk
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DEMO9S08RG60 NXP USA Inc. DEMO9S08RG60UM.pdf Description: MC9S08RG60 EVAL BRD
Packaging: Bulk
Part Status: Obsolete
Utilized IC / Part: MC9S08RG60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
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M68EVB908GP32 M68EVB908GP32 NXP USA Inc. Description: MC68HC908GP32 EVAL BRD
Utilized IC / Part: MC68HC908GP32
Core Processor: HC08
Contents: Board(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Bulk
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M68KIT912D60A M68KIT912D60A NXP USA Inc. M68EVB912D60.pdf Description: MC68HC912D60A EVAL BRD
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M68KIT912DG128A NXP USA Inc. Description: MC68HC912DG128A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: MC68HC912DG128A
Part Status: Obsolete
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M68KIT912UF32 NXP USA Inc. Description: MC9S12UF32 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MC9S12UF32
Board Type: Evaluation Platform
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MC33493MOD315 NXP USA Inc. MC33493.pdf Description: BOARD EVALUATION FOR MC33493 TX
Packaging: Bulk
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transmitter
Frequency: 315MHz
For Use With/Related Products: MC33493
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MC33493MOD434 NXP USA Inc. MC33493.pdf Description: BOARD EVALUATION FOR MC33493 TX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transmitter
Frequency: 434MHz
For Use With/Related Products: MC33493
Packaging: Bulk
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MC33591MOD315 NXP USA Inc. MC33591.pdf Description: BOARD EVALUATION FOR MC33591 RX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Receiver
Frequency: 315MHz
For Use With/Related Products: MC33591
Packaging: Bulk
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MC33591MOD434 NXP USA Inc. MC33591.pdf Description: BOARD EVALUATION FOR MC33591 RX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Receiver
Frequency: 434MHz
For Use With/Related Products: MC33591
Packaging: Bulk
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MC68HC908AP16CFB MC68HC908AP16CFB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
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MC68HC908AP32CB MC68HC908AP32CB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 32KB FLASH 42DIP
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MC68HC908AP32CFB MC68HC908AP32CFB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
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MC68HC908AP8CFB MC68HC908AP8CFB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
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MC68HC908GZ60CFA MC68HC908GZ60CFA NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Obsolete
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Supplier Device Package: 48-LQFP (7x7)
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MC68HC908GZ60CFJ MC68HC908GZ60CFJ NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
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MC68HC908GZ60CFU MC68HC908GZ60CFU NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC68HC908GZ60MFA MC68HC908GZ60MFA NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC68HC908GZ60VFU MC68HC908GZ60VFU NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC9S08RG60CFG MC9S08RG60CFG NXP USA Inc. MC9S08RG60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
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MC9S12UF32PB MC9S12UF32PB NXP USA Inc. MC9S12UF32.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S12UF32PU MC9S12UF32PU NXP USA Inc. MC9S12UF32.pdf Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 73
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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CBT3125PW/G-T CBT3125PW/G-T NXP USA Inc. CBT3125.pdf Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002DP,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2005PW/G-T GTL2005PW/G-T NXP USA Inc. GTL2005.pdf Description: IC TRANSLATOR BIDIR 14TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 4
Translator Type: Mixed Signal
Output Signal: LVTTL, TTL
Channel Type: Bidirectional
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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GTL2006PW,118 GTL2006PW,118 NXP USA Inc. GTL2006.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 13
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
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GTL2007PW,118 GTL2007PW,118 NXP USA Inc. GTL2007.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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LPC2106FBD48,151 LPC2106FBD48,151 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Number of I/O: 32
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
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LPC2131FBD64,151 LPC2131FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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LPC2132FBD64,151 LPC2132FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
DigiKey Programmable: Not Verified
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LPC2134FBD64,151 LPC2134FBD64,151 NXP USA Inc. LPC213x.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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LPC2194JBD64,151 LPC2194JBD64,151 NXP USA Inc. LPC2194.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bag
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LPC2220FBD144,551 LPC2220FBD144,551 NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Number of I/O: 76
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+899.55 грн
10+681.48 грн
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LPC2290FBD144,551 LPC2290FBD144,551 NXP USA Inc. LPC2290.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bag
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LPC2294JBD144,551 LPC2294JBD144,551 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bag
Number of I/O: 112
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
DigiKey Programmable: Not Verified
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NE5234D,518 NE5234D,518 NXP USA Inc. ne5234_sa5234_3.pdf Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565TS/1,118 NXP USA Inc. PCA8565.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+72.90 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9510D,118 PCA9510D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Capacitance - Input: 10 pF
Part Status: Obsolete
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 2.8mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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PCA9511D,118 PCA9511D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512D,118 NXP USA Inc. PCA9512.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512DP,118 NXP USA Inc. PCA9512.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA9513D,118 NXP USA Inc. PCA95%2813%2C14%29.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 10 pF
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PCA9513DP,118 PCA9513DP,118 NXP USA Inc. PCA95(13,14).pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA9514D,118 NXP USA Inc. PCA95(13,14).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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CBT3125PW/G-T CBT3125PW/G-T NXP USA Inc. CBT3125.pdf Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002DP,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Number of Circuits: 1
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
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GTL2006PW,118 GTL2006PW,118 NXP USA Inc. GTL2006.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 13
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
на замовлення 1045 шт:
термін постачання 21-31 дні (днів)
3+143.20 грн
10+101.71 грн
25+92.58 грн
100+77.50 грн
250+73.02 грн
500+70.32 грн
1000+66.98 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
GTL2007PW,118 GTL2007PW,118 NXP USA Inc. GTL2007.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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PCA8565TS/1,118 PCA8565TS/1,118 NXP USA Inc. PCA8565.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2718 шт:
термін постачання 21-31 дні (днів)
3+143.20 грн
10+101.48 грн
25+92.49 грн
100+77.50 грн
250+73.07 грн
500+70.40 грн
1000+68.11 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PCA9510D,118 PCA9510D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Capacitance - Input: 10 pF
Part Status: Obsolete
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 2.8mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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PCA9511D,118 PCA9511D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
товару немає в наявності
В кошику  од. на суму  грн.
PCA9512D,118 PCA9512D,118 NXP USA Inc. PCA9512.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512DP,118 NXP USA Inc. PCA9512.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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ICM7555CN/01,112 ICM7555.pdf
ICM7555CN/01,112
Виробник: NXP USA Inc.
Description: IC OSC SINGLE TIMER 500KHZ 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-DIP
Part Status: Obsolete
Current - Supply: 180 µA
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ICM7555ID/01,118 ICM7555.pdf
ICM7555ID/01,118
Виробник: NXP USA Inc.
Description: IC OSC SNGL TIMER 500KHZ 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-SO
Part Status: Obsolete
Current - Supply: 180 µA
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ICM7555IN/01,112 ICM7555.pdf
ICM7555IN/01,112
Виробник: NXP USA Inc.
Description: IC OSC SINGLE TIMER 500KHZ 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 16V
Supplier Device Package: 8-DIP
Part Status: Obsolete
Current - Supply: 180 µA
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BR100/03,113 BR100-03_1.pdf
BR100/03,113
Виробник: NXP USA Inc.
Description: DIAC/SIDAC 28-36V 2A ALF2
Current - Peak Output: 2 A
Part Status: Obsolete
Supplier Device Package: ALF2
Current - Breakover: 50 µA
Voltage - Breakover: 28 ~ 36V
Operating Temperature: 100°C (TJ)
Package / Case: DO-204AH, DO-35, Axial
Packaging: Cut Tape (CT)
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BSH112,235
BSH112,235
Виробник: NXP USA Inc.
Description: MOSFET N-CH 60V 300MA TO236AB
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -65°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 830mW (Tc)
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M5282ZIGBEE
M5282ZIGBEE
Виробник: NXP USA Inc.
Description: BOARD EVAL ZIGBEE FOR MCF5282
Supplied Contents: Board(s)
Type: 802.15.4/Zigbee™
For Use With/Related Products: MCF5282
Packaging: Bulk
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DEMO908AP64
DEMO908AP64
Виробник: NXP USA Inc.
Description: MC68HC908AP EVAL BRD
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DEMO908GZ60 DEMO908GZ60QSG.pdf
Виробник: NXP USA Inc.
Description: MC68HC908GZ60 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MC68HC908GZ60
Core Processor: HC08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Bulk
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DEMO9S08RG60 DEMO9S08RG60UM.pdf
Виробник: NXP USA Inc.
Description: MC9S08RG60 EVAL BRD
Packaging: Bulk
Part Status: Obsolete
Utilized IC / Part: MC9S08RG60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
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M68EVB908GP32
M68EVB908GP32
Виробник: NXP USA Inc.
Description: MC68HC908GP32 EVAL BRD
Utilized IC / Part: MC68HC908GP32
Core Processor: HC08
Contents: Board(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Bulk
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M68KIT912D60A M68EVB912D60.pdf
M68KIT912D60A
Виробник: NXP USA Inc.
Description: MC68HC912D60A EVAL BRD
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M68KIT912DG128A
Виробник: NXP USA Inc.
Description: MC68HC912DG128A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: MC68HC912DG128A
Part Status: Obsolete
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M68KIT912UF32
Виробник: NXP USA Inc.
Description: MC9S12UF32 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MC9S12UF32
Board Type: Evaluation Platform
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MC33493MOD315 MC33493.pdf
Виробник: NXP USA Inc.
Description: BOARD EVALUATION FOR MC33493 TX
Packaging: Bulk
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transmitter
Frequency: 315MHz
For Use With/Related Products: MC33493
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MC33493MOD434 MC33493.pdf
Виробник: NXP USA Inc.
Description: BOARD EVALUATION FOR MC33493 TX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transmitter
Frequency: 434MHz
For Use With/Related Products: MC33493
Packaging: Bulk
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MC33591MOD315 MC33591.pdf
Виробник: NXP USA Inc.
Description: BOARD EVALUATION FOR MC33591 RX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Receiver
Frequency: 315MHz
For Use With/Related Products: MC33591
Packaging: Bulk
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MC33591MOD434 MC33591.pdf
Виробник: NXP USA Inc.
Description: BOARD EVALUATION FOR MC33591 RX
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Receiver
Frequency: 434MHz
For Use With/Related Products: MC33591
Packaging: Bulk
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MC68HC908AP16CFB MC68HC908AP64.pdf
MC68HC908AP16CFB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
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MC68HC908AP32CB MC68HC908AP64.pdf
MC68HC908AP32CB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 42DIP
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MC68HC908AP32CFB MC68HC908AP64.pdf
MC68HC908AP32CFB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
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MC68HC908AP8CFB MC68HC908AP64.pdf
MC68HC908AP8CFB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
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MC68HC908GZ60CFA MC68HC908GZ60.pdf
MC68HC908GZ60CFA
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Obsolete
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Supplier Device Package: 48-LQFP (7x7)
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MC68HC908GZ60CFJ MC68HC908GZ60.pdf
MC68HC908GZ60CFJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Obsolete
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
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MC68HC908GZ60CFU MC68HC908GZ60.pdf
MC68HC908GZ60CFU
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC68HC908GZ60MFA MC68HC908GZ60.pdf
MC68HC908GZ60MFA
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC68HC908GZ60VFU MC68HC908GZ60.pdf
MC68HC908GZ60VFU
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC9S08RG60CFG MC9S08RG60.pdf
MC9S08RG60CFG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
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MC9S12UF32PB MC9S12UF32.pdf
MC9S12UF32PB
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S12UF32PU MC9S12UF32.pdf
MC9S12UF32PU
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 73
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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CBT3125PW/G-T CBT3125.pdf
CBT3125PW/G-T
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002.pdf
GTL2002DP,118
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2005PW/G-T GTL2005.pdf
GTL2005PW/G-T
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 4
Translator Type: Mixed Signal
Output Signal: LVTTL, TTL
Channel Type: Bidirectional
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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GTL2006PW,118 GTL2006.pdf
GTL2006PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 13
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
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GTL2007PW,118 GTL2007.pdf
GTL2007PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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LPC2106FBD48,151 LPC2104_2105_2106.pdf
LPC2106FBD48,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Number of I/O: 32
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
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LPC2131FBD64,151 LPC2131_32_34_36_38.pdf
LPC2131FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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LPC2132FBD64,151 LPC2131_32_34_36_38.pdf
LPC2132FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
DigiKey Programmable: Not Verified
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LPC2134FBD64,151 LPC213x.pdf
LPC2134FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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LPC2194JBD64,151 LPC2194.pdf
LPC2194JBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bag
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LPC2220FBD144,551 LPC2210_2220.pdf
LPC2220FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Number of I/O: 76
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+899.55 грн
10+681.48 грн
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LPC2290FBD144,551 LPC2290.pdf
LPC2290FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bag
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LPC2294JBD144,551 LPC2292_2294.pdf
LPC2294JBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bag
Number of I/O: 112
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
DigiKey Programmable: Not Verified
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NE5234D,518 ne5234_sa5234_3.pdf
NE5234D,518
Виробник: NXP USA Inc.
Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565.pdf
PCA8565TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+72.90 грн
Мінімальне замовлення: 2500
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PCA9510D,118 PCA95(10,11).pdf
PCA9510D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Capacitance - Input: 10 pF
Part Status: Obsolete
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 2.8mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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PCA9511D,118 PCA95(10,11).pdf
PCA9511D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512.pdf
PCA9512D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512.pdf
PCA9512DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA95%2813%2C14%29.pdf
PCA9513D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 10 pF
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PCA9513DP,118 PCA95(13,14).pdf
PCA9513DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA95(13,14).pdf
PCA9514D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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CBT3125PW/G-T CBT3125.pdf
CBT3125PW/G-T
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002.pdf
GTL2002DP,118
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Number of Circuits: 1
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
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GTL2006PW,118 GTL2006.pdf
GTL2006PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 13
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
на замовлення 1045 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+143.20 грн
10+101.71 грн
25+92.58 грн
100+77.50 грн
250+73.02 грн
500+70.32 грн
1000+66.98 грн
Мінімальне замовлення: 3
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GTL2007PW,118 GTL2007.pdf
GTL2007PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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PCA8565TS/1,118 PCA8565.pdf
PCA8565TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2718 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+143.20 грн
10+101.48 грн
25+92.49 грн
100+77.50 грн
250+73.07 грн
500+70.40 грн
1000+68.11 грн
Мінімальне замовлення: 3
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PCA9510D,118 PCA95(10,11).pdf
PCA9510D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Capacitance - Input: 10 pF
Part Status: Obsolete
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 2.8mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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PCA9511D,118 PCA95(10,11).pdf
PCA9511D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512.pdf
PCA9512D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512.pdf
PCA9512DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
товару немає в наявності
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