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SPC5602PEF0MLL6R SPC5602PEF0MLL6R NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 20K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
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SPC561MVR56D SPC561MVR56D NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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SPC5632MF2MLQ60 SPC5632MF2MLQ60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5644BF0VLT1 SPC5644BF0VLT1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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SPC5644BF0VLU1 SPC5644BF0VLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
DigiKey Programmable: Not Verified
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+2432.03 грн
10+1912.19 грн
25+1804.97 грн
200+1628.72 грн
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SPC5644CF0VLU1 SPC5644CF0VLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+3152.78 грн
10+2320.93 грн
25+2137.93 грн
80+1841.17 грн
В кошику  од. на суму  грн.
SPC5645CF0MLU1 SPC5645CF0MLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5645SF1VLT SPC5645SF1VLT NXP USA Inc. MPC5645S.pdf Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 150
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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SPC5645SF1VLU SPC5645SF1VLU NXP USA Inc. MPC5645S.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
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SPC5645SF1VVU SPC5645SF1VVU NXP USA Inc. MPC5645S.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
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SPC5645SF1VVUR SPC5645SF1VVUR NXP USA Inc. MPC5645S.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
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SPC5646CCF0MLT1 SPC5646CCF0MLT1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
1+4250.92 грн
10+3378.85 грн
25+3200.45 грн
180+2760.75 грн
В кошику  од. на суму  грн.
SPC5646CCF0MLU1 SPC5646CCF0MLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5646CCF0MMJ1 SPC5646CCF0MMJ1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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SPC5673FF3MVY2 SPC5673FF3MVY2 NXP USA Inc. MPC5674F.pdf Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
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SVF311R3K1CKU2 SVF311R3K1CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+2534.09 грн
10+1985.71 грн
40+1824.45 грн
В кошику  од. на суму  грн.
SVF322R3K1CKU2 SVF322R3K1CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
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SVF512R3K1CMK4 SVF512R3K1CMK4 NXP USA Inc. Description: IC MPU VYBRID 400MHZ 364LFBGA
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
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SVF521R3K1CMK4 SVF521R3K1CMK4 NXP USA Inc. Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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SVF522R2K1CMK4 SVF522R2K1CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364MAPBGA
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SVF522R3K1CMK4 SVF522R3K1CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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SVF532R3K1CMK4 SVF532R3K1CMK4 NXP USA Inc. Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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TRACELINK NXP USA Inc. Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Coldfire®, Kinetis®
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MM912F634DV1AE MM912F634DV1AE NXP USA Inc. MM912F634.pdf Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
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MM912F634DV1AER2 MM912F634DV1AER2 NXP USA Inc. MM912F634.pdf Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
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MM912F634DV2AE MM912F634DV2AE NXP USA Inc. MM912F634.pdf Description: IC MCU DUAL LS/HS SWITCH 48LQFP
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MM912F634DV2AP MM912F634DV2AP NXP USA Inc. MM912F634.pdf Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912F634DV2APR2 MM912F634DV2APR2 NXP USA Inc. MM912F634.pdf Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DC1AE MM912G634DC1AE NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DC1AER2 MM912G634DC1AER2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DC2AP MM912G634DC2AP NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 9
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
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MM912G634DM1AE MM912G634DM1AE NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DM1AER2 MM912G634DM1AER2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DV1AER2 MM912G634DV1AER2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DV2AP MM912G634DV2AP NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DV2APR2 MM912G634DV2APR2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912H634DM1AER2 MM912H634DM1AER2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 9
Supplier Device Package: 48-HLQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (64kB)
Controller Series: HCS12
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RD4247FXOS8700 RD4247FXOS8700 NXP USA Inc. Description: KIT SENSOR TOOL BOX CONT
Part Status: Active
Sensing Range: ±2g, 4g, 8g, ±1200µT
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: FXOS8700CQ
Sensor Type: Accelerometer, Magnetometer
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C, Serial, SPI
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
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S912XEQ384F1VALR S912XEQ384F1VALR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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S9S08DN32F2CLF S9S08DN32F2CLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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SPC5646BF0MLU1 SPC5646BF0MLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
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MM912H634DV1AER2 MM912H634DV1AER2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 64KB LS/HS SWITCH 48LQFP
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MM912JS812AMAF MM912JS812AMAF NXP USA Inc. MM912_S812.pdf Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
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MM912JS812AMAFR2 MM912JS812AMAFR2 NXP USA Inc. MM912_S812.pdf Description: IC DRVR INJECTOR/IGN 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 8K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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MMA6853BKW MMA6853BKW NXP USA Inc. MMA685x_Rev4.pdf Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 16-QFN-EP (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tray
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MMDS20254HT1 MMDS20254HT1 NXP USA Inc. Description: IC MOD RF ALIGNMENT 2G 32QFN
Supplier Device Package: 32-QFN (6x6)
RF Type: Cellular
Frequency: 1.8GHz ~ 2.2GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MML09231HT1 MML09231HT1 NXP USA Inc. MML09231HT1.pdf Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Supplier Device Package: 8-DFN (2x2)
Test Frequency: 900MHz
P1dB: 24.5dBm
Noise Figure: 0.36dB
Current - Supply: 55mA
Gain: 17.2dB
Voltage - Supply: 5V
RF Type: GSM, LTE, W-CDMA
Frequency: 700MHz ~ 1.4GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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MPC8308CZQADDA MPC8308CZQADDA NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 266MHZ 473MAPBGA
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MPC8308CZQAFDA MPC8308CZQAFDA NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 333MHZ 473MAPBGA
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MPC8308ZQADDA MPC8308ZQADDA NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 266MHZ 473MAPBGA
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MM912G634DC2APR2 MM912G634DC2APR2 NXP USA Inc. MM912_634D1.pdf Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MVF61NS151CMK50 MVF61NS151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 655 шт:
термін постачання 21-31 дні (днів)
1+3231.11 грн
10+2547.66 грн
90+2261.86 грн
180+2067.08 грн
270+2039.25 грн
В кошику  од. на суму  грн.
P2020NXE2MHC P2020NXE2MHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
MVF30NS151CKU26 MVF30NS151CKU26 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Packaging: Tray
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MVF50NN151CMK40 MVF50NN151CMK40 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 400MHZ 364LFBGA
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF50NN151CMK50 MVF50NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF50NS151CMK50 MVF50NS151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF60NN151CMK40 MVF60NN151CMK40 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
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MVF60NN151CMK50 MVF60NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364MAPBGA
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MVF61NN151CMK50 MVF61NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 445 шт:
термін постачання 21-31 дні (днів)
1+2885.37 грн
10+2343.18 грн
90+2099.70 грн
180+1918.63 грн
270+1892.65 грн
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SPC5602PEF0MLL6R MPC5602P.pdf
SPC5602PEF0MLL6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 20K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
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SPC561MVR56D MPC561RM.pdf
SPC561MVR56D
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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SPC5632MF2MLQ60 MPC5634M.pdf
SPC5632MF2MLQ60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5644BF0VLT1 MPC5646C.pdf
SPC5644BF0VLT1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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SPC5644BF0VLU1 MPC5646C.pdf
SPC5644BF0VLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
DigiKey Programmable: Not Verified
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2432.03 грн
10+1912.19 грн
25+1804.97 грн
200+1628.72 грн
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SPC5644CF0VLU1 MPC5646C.pdf
SPC5644CF0VLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3152.78 грн
10+2320.93 грн
25+2137.93 грн
80+1841.17 грн
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SPC5645CF0MLU1 MPC5646C.pdf
SPC5645CF0MLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5645SF1VLT MPC5645S.pdf
SPC5645SF1VLT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 150
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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SPC5645SF1VLU MPC5645S.pdf
SPC5645SF1VLU
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
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SPC5645SF1VVU MPC5645S.pdf
SPC5645SF1VVU
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
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SPC5645SF1VVUR MPC5645S.pdf
SPC5645SF1VVUR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
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SPC5646CCF0MLT1 MPC5646C.pdf
SPC5646CCF0MLT1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4250.92 грн
10+3378.85 грн
25+3200.45 грн
180+2760.75 грн
В кошику  од. на суму  грн.
SPC5646CCF0MLU1 MPC5646C.pdf
SPC5646CCF0MLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5646CCF0MMJ1 MPC5646C.pdf
SPC5646CCF0MMJ1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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SPC5673FF3MVY2 MPC5674F.pdf
SPC5673FF3MVY2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
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SVF311R3K1CKU2 VYBRIDRSERIESEC.pdf
SVF311R3K1CKU2
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2534.09 грн
10+1985.71 грн
40+1824.45 грн
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SVF322R3K1CKU2 VYBRIDRSERIESEC.pdf
SVF322R3K1CKU2
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
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SVF512R3K1CMK4
SVF512R3K1CMK4
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
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SVF521R3K1CMK4
SVF521R3K1CMK4
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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SVF522R2K1CMK4 VYBRIDRSERIESEC.pdf
SVF522R2K1CMK4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
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SVF522R3K1CMK4 VYBRIDRSERIESEC.pdf
SVF522R3K1CMK4
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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SVF532R3K1CMK4
SVF532R3K1CMK4
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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TRACELINK
Виробник: NXP USA Inc.
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Coldfire®, Kinetis®
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MM912F634DV1AE MM912F634.pdf
MM912F634DV1AE
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
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MM912F634DV1AER2 MM912F634.pdf
MM912F634DV1AER2
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
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MM912F634DV2AE MM912F634.pdf
MM912F634DV2AE
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
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MM912F634DV2AP MM912F634.pdf
MM912F634DV2AP
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912F634DV2APR2 MM912F634.pdf
MM912F634DV2APR2
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DC1AE MM912_634D1.pdf
MM912G634DC1AE
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DC1AER2 MM912_634D1.pdf
MM912G634DC1AER2
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DC2AP MM912_634D1.pdf
MM912G634DC2AP
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 9
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
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MM912G634DM1AE MM912_634D1.pdf
MM912G634DM1AE
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DM1AER2 MM912_634D1.pdf
MM912G634DM1AER2
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
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MM912G634DV1AER2 MM912_634D1.pdf
MM912G634DV1AER2
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DV2AP MM912_634D1.pdf
MM912G634DV2AP
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912G634DV2APR2 MM912_634D1.pdf
MM912G634DV2APR2
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MM912H634DM1AER2 MM912_634D1.pdf
MM912H634DM1AER2
Виробник: NXP USA Inc.
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 9
Supplier Device Package: 48-HLQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (64kB)
Controller Series: HCS12
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RD4247FXOS8700
RD4247FXOS8700
Виробник: NXP USA Inc.
Description: KIT SENSOR TOOL BOX CONT
Part Status: Active
Sensing Range: ±2g, 4g, 8g, ±1200µT
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: FXOS8700CQ
Sensor Type: Accelerometer, Magnetometer
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C, Serial, SPI
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
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S912XEQ384F1VALR MC9S12XEP100RMV1.pdf
S912XEQ384F1VALR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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S9S08DN32F2CLF MC9S08DN60.pdf
S9S08DN32F2CLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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SPC5646BF0MLU1 MPC5646C.pdf
SPC5646BF0MLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
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MM912H634DV1AER2 MM912_634D1.pdf
MM912H634DV1AER2
Виробник: NXP USA Inc.
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
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MM912JS812AMAF MM912_S812.pdf
MM912JS812AMAF
Виробник: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
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MM912JS812AMAFR2 MM912_S812.pdf
MM912JS812AMAFR2
Виробник: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 8K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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MMA6853BKW MMA685x_Rev4.pdf
MMA6853BKW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 16-QFN-EP (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tray
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MMDS20254HT1
MMDS20254HT1
Виробник: NXP USA Inc.
Description: IC MOD RF ALIGNMENT 2G 32QFN
Supplier Device Package: 32-QFN (6x6)
RF Type: Cellular
Frequency: 1.8GHz ~ 2.2GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MML09231HT1 MML09231HT1.pdf
MML09231HT1
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Supplier Device Package: 8-DFN (2x2)
Test Frequency: 900MHz
P1dB: 24.5dBm
Noise Figure: 0.36dB
Current - Supply: 55mA
Gain: 17.2dB
Voltage - Supply: 5V
RF Type: GSM, LTE, W-CDMA
Frequency: 700MHz ~ 1.4GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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MPC8308CZQADDA MPC8308EC.pdf
MPC8308CZQADDA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
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MPC8308CZQAFDA MPC8308EC.pdf
MPC8308CZQAFDA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 473MAPBGA
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MPC8308ZQADDA MPC8308EC.pdf
MPC8308ZQADDA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
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MM912G634DC2APR2 MM912_634D1.pdf
MM912G634DC2APR2
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
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MVF61NS151CMK50 VYBRIDFSERIESEC.pdf
MVF61NS151CMK50
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 655 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3231.11 грн
10+2547.66 грн
90+2261.86 грн
180+2067.08 грн
270+2039.25 грн
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P2020NXE2MHC QP20XXFS.pdf
P2020NXE2MHC
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
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MVF30NS151CKU26 VYBRIDFSERIESEC.pdf
MVF30NS151CKU26
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Packaging: Tray
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MVF50NN151CMK40 VYBRIDFSERIESEC.pdf
MVF50NN151CMK40
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF50NN151CMK50 VYBRIDFSERIESEC.pdf
MVF50NN151CMK50
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF50NS151CMK50 VYBRIDFSERIESEC.pdf
MVF50NS151CMK50
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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MVF60NN151CMK40 VYBRIDFSERIESEC.pdf
MVF60NN151CMK40
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
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MVF60NN151CMK50 VYBRIDFSERIESEC.pdf
MVF60NN151CMK50
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
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MVF61NN151CMK50 VYBRIDFSERIESEC.pdf
MVF61NN151CMK50
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 445 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2885.37 грн
10+2343.18 грн
90+2099.70 грн
180+1918.63 грн
270+1892.65 грн
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