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LD6805K/31H,115 LD6805K/31H,115 NXP USA Inc. LD6805.pdf Description: IC REG LINEAR 3.1V 150MA 4UDFN
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-UDFN (1.0x1.0)
Voltage - Output (Min/Fixed): 3.1V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6836TD/21HH LD6836TD/21HH NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.1V 300MA 5TSOP
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MFRC52201HN1,115 MFRC52201HN1,115 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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MFRC52202HN1,115 MFRC52202HN1,115 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
1500+379.44 грн
Мінімальне замовлення: 1500
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NCX2220GF,115 NCX2220GF,115 NXP USA Inc. NCX2220_Rev4.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NCX2220GT,115 NCX2220GT,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NCX2222GTX NCX2222GTX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
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NCX2222GUX NCX2222GUX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NT2H0301F0DTL,125 NT2H0301F0DTL,125 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Tape & Reel (TR)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
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NTB0101GN,132 NTB0101GN,132 NXP USA Inc. NTB0101.pdf Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTB0101GS,132 NTB0101GS,132 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTB0104UK,012 NTB0104UK,012 NXP USA Inc. NTB0104.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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NTB0104UK-Q100Z NTB0104UK-Q100Z NXP USA Inc. NTB0104_Q100.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NTS0101GN,132 NTS0101GN,132 NXP USA Inc. NTS0101.pdf Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0101GS,132 NTS0101GS,132 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0101GW,125 NTS0101GW,125 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102DP-Q100H NTS0102DP-Q100H NXP USA Inc. NTS0102_Q100.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
3000+35.80 грн
6000+33.67 грн
Мінімальне замовлення: 3000
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NTS0104UK,012 NTS0104UK,012 NXP USA Inc. NTS0104.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
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NTS0104UK-Q100Z NTS0104UK-Q100Z NXP USA Inc. NTS0104_Q100.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NX3DV42GU,115 NX3DV42GU,115 NXP USA Inc. NX3DV42.pdf Description: IC USB SWITCH DPDT XQFN10
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
4000+24.15 грн
8000+22.72 грн
12000+22.45 грн
Мінімальне замовлення: 4000
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NX3DV642GU,115 NX3DV642GU,115 NXP USA Inc. NX3DV642.pdf Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
5000+33.47 грн
10000+31.56 грн
Мінімальне замовлення: 5000
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NX3L2267GM-Q100X NX3L2267GM-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
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NX3L2267GU-Q100X NX3L2267GU-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
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NX3L4051HR-Q100X NX3L4051HR-Q100X NXP USA Inc. NX3L4051-Q100.pdf Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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PCA9617ATPZ PCA9617ATPZ NXP USA Inc. PCA9617A.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
4000+42.22 грн
8000+39.80 грн
Мінімальне замовлення: 4000
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PMDPB28UN,115 PMDPB28UN,115 NXP USA Inc. PMDPB28UN.pdf Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF87EN,115 PMF87EN,115 NXP USA Inc. PMF87EN.pdf Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
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PMN22XN,115 PMN22XN,115 NXP USA Inc. PMN22XN.pdf Description: MOSFET N-CH 30V 5.7A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 5.7A, 4.5V
Power Dissipation (Max): 545mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 585 pF @ 15 V
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PMPB20UN,115 PMPB20UN,115 NXP USA Inc. PMPB20UN.pdf Description: MOSFET N-CH 20V 6.6A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
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PMT200EN,115 PMT200EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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PMT760EN,115 PMT760EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 900MA SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
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PQJ7911AHN/C0C,515 NXP USA Inc. Description: IC TXRX ISM/SRD VAND 32HVQFN
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
SA58635UK,027 NXP USA Inc. SA58635.pdf Description: IC AMP CLASS G STER 25MW 16WLCSP
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 5.5V
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Supplier Device Package: 16-WLCSP (1.7x1.7)
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SL3S4011FHK,125 SL3S4011FHK,125 NXP USA Inc. SL3S4011_4021.pdf Description: IC RFID TRANSP 860-960MHZ 8XQFN
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В кошику  од. на суму  грн.
SL3S4021FHKH SL3S4021FHKH NXP USA Inc. Description: IC RFID TRANSP 860-960MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Standards: ISO 18000-6
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
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ASC3112HVK ASC3112HVK NXP USA Inc. ASC3101_3112_Br.pdf Description: IC RF TXRX+MCU AISG 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Memory Size: 256kB Flash, 16kB SRAM
Type: TxRx + MCU
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 10dBm
Data Rate (Max): 38.4kbps
Supplier Device Package: 144-HLQFP (20x20)
GPIO: 44
Modulation: OOK
RF Family/Standard: AISG
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
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ASC8848AETE ASC8848AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
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В кошику  од. на суму  грн.
ASC8848AETK ASC8848AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
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В кошику  од. на суму  грн.
ASC8850AETE ASC8850AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850AETK ASC8850AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8852AETE ASC8852AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
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В кошику  од. на суму  грн.
CLRC66302HN,151 CLRC66302HN,151 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 9528 шт:
термін постачання 21-31 дні (днів)
1+697.13 грн
10+583.64 грн
25+552.99 грн
100+479.50 грн
490+439.68 грн
980+423.95 грн
1470+412.11 грн
В кошику  од. на суму  грн.
CLRC66302HN,157 CLRC66302HN,157 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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LPC1113FHN33/302K LPC1113FHN33/302K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC11E36FHN33/501E LPC11E36FHN33/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 96KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 156 шт:
термін постачання 21-31 дні (днів)
1+387.56 грн
10+291.13 грн
80+238.54 грн
В кошику  од. на суму  грн.
LPC11E37FBD48/501E LPC11E37FBD48/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 5476 шт:
термін постачання 21-31 дні (днів)
1+360.50 грн
10+266.45 грн
25+246.24 грн
100+213.24 грн
В кошику  од. на суму  грн.
LPC11E37FBD64/501E LPC11E37FBD64/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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LPC11E37FHI33/501E LPC11E37FHI33/501E NXP USA Inc. LPC11E3x_Draft_Rev2.3.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1785FBD208K NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
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В кошику  од. на суму  грн.
LPC1812JBD144E LPC1812JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1812JET100E LPC1812JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
1+715.43 грн
10+558.81 грн
В кошику  од. на суму  грн.
LPC1813JBD144E LPC1813JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1813JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1815JBD144E LPC1815JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1815JET100E LPC1815JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
LPC1817JBD144E LPC1817JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
товару немає в наявності
В кошику  од. на суму  грн.
LPC1817JET100E LPC1817JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
товару немає в наявності
В кошику  од. на суму  грн.
LPC4312JBD144E LPC4312JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+1307.52 грн
В кошику  од. на суму  грн.
LPC4313JBD144E LPC4313JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
1+1242.26 грн
10+948.42 грн
В кошику  од. на суму  грн.
LPC4315JBD144E LPC4315JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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LD6805K/31H,115 LD6805.pdf
LD6805K/31H,115
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.1V 150MA 4UDFN
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-UDFN (1.0x1.0)
Voltage - Output (Min/Fixed): 3.1V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6836TD/21HH LD6836.pdf
LD6836TD/21HH
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.1V 300MA 5TSOP
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MFRC52201HN1,115 MFRC522.pdf
MFRC52201HN1,115
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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MFRC52202HN1,115 MFRC522.pdf
MFRC52202HN1,115
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1500+379.44 грн
Мінімальне замовлення: 1500
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NCX2220GF,115 NCX2220_Rev4.pdf
NCX2220GF,115
Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NCX2220GT,115 NCX2220.pdf
NCX2220GT,115
Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NCX2222GTX NCX2222.pdf
NCX2222GTX
Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
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NCX2222GUX NCX2222.pdf
NCX2222GUX
Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
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NT2H0301F0DTL,125
NT2H0301F0DTL,125
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Tape & Reel (TR)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
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NTB0101GN,132 NTB0101.pdf
NTB0101GN,132
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTB0101GS,132 NTB0101.pdf
NTB0101GS,132
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTB0104UK,012 NTB0104.pdf
NTB0104UK,012
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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NTB0104UK-Q100Z NTB0104_Q100.pdf
NTB0104UK-Q100Z
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NTS0101GN,132 NTS0101.pdf
NTS0101GN,132
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0101GS,132 NTS0101.pdf
NTS0101GS,132
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0101GW,125 NTS0101.pdf
NTS0101GW,125
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102DP-Q100H NTS0102_Q100.pdf
NTS0102DP-Q100H
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+35.80 грн
6000+33.67 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
NTS0104UK,012 NTS0104.pdf
NTS0104UK,012
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
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NTS0104UK-Q100Z NTS0104_Q100.pdf
NTS0104UK-Q100Z
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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NX3DV42GU,115 NX3DV42.pdf
NX3DV42GU,115
Виробник: NXP USA Inc.
Description: IC USB SWITCH DPDT XQFN10
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+24.15 грн
8000+22.72 грн
12000+22.45 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NX3DV642GU,115 NX3DV642.pdf
NX3DV642GU,115
Виробник: NXP USA Inc.
Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+33.47 грн
10000+31.56 грн
Мінімальне замовлення: 5000
В кошику  од. на суму  грн.
NX3L2267GM-Q100X NX3L2267-Q100.pdf
NX3L2267GM-Q100X
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
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NX3L2267GU-Q100X NX3L2267-Q100.pdf
NX3L2267GU-Q100X
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
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NX3L4051HR-Q100X NX3L4051-Q100.pdf
NX3L4051HR-Q100X
Виробник: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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PCA9617ATPZ PCA9617A.pdf
PCA9617ATPZ
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+42.22 грн
8000+39.80 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
PMDPB28UN,115 PMDPB28UN.pdf
PMDPB28UN,115
Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF87EN,115 PMF87EN.pdf
PMF87EN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
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PMN22XN,115 PMN22XN.pdf
PMN22XN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 5.7A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 5.7A, 4.5V
Power Dissipation (Max): 545mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 585 pF @ 15 V
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PMPB20UN,115 PMPB20UN.pdf
PMPB20UN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 6.6A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
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PMT200EN,115
PMT200EN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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PMT760EN,115
PMT760EN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 900MA SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
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PQJ7911AHN/C0C,515
Виробник: NXP USA Inc.
Description: IC TXRX ISM/SRD VAND 32HVQFN
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
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SA58635UK,027 SA58635.pdf
Виробник: NXP USA Inc.
Description: IC AMP CLASS G STER 25MW 16WLCSP
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 5.5V
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Supplier Device Package: 16-WLCSP (1.7x1.7)
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SL3S4011FHK,125 SL3S4011_4021.pdf
SL3S4011FHK,125
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
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SL3S4021FHKH
SL3S4021FHKH
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Standards: ISO 18000-6
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
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ASC3112HVK ASC3101_3112_Br.pdf
ASC3112HVK
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU AISG 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Memory Size: 256kB Flash, 16kB SRAM
Type: TxRx + MCU
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 10dBm
Data Rate (Max): 38.4kbps
Supplier Device Package: 144-HLQFP (20x20)
GPIO: 44
Modulation: OOK
RF Family/Standard: AISG
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
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ASC8848AETE 75017379.pdf
ASC8848AETE
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
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ASC8848AETK
ASC8848AETK
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
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ASC8850AETE 75017379.pdf
ASC8850AETE
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850AETK
ASC8850AETK
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8852AETE 75017379.pdf
ASC8852AETE
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
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CLRC66302HN,151 CLRC663.pdf
CLRC66302HN,151
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 9528 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+697.13 грн
10+583.64 грн
25+552.99 грн
100+479.50 грн
490+439.68 грн
980+423.95 грн
1470+412.11 грн
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CLRC66302HN,157 CLRC663.pdf
CLRC66302HN,157
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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LPC1113FHN33/302K LPC111X.pdf
LPC1113FHN33/302K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC11E36FHN33/501E LPC11E3X.pdf
LPC11E36FHN33/501E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 156 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+387.56 грн
10+291.13 грн
80+238.54 грн
В кошику  од. на суму  грн.
LPC11E37FBD48/501E LPC11E3X.pdf
LPC11E37FBD48/501E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 5476 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+360.50 грн
10+266.45 грн
25+246.24 грн
100+213.24 грн
В кошику  од. на суму  грн.
LPC11E37FBD64/501E LPC11E3X.pdf
LPC11E37FBD64/501E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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LPC11E37FHI33/501E LPC11E3x_Draft_Rev2.3.pdf
LPC11E37FHI33/501E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1785FBD208K LPC178X_7X.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
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LPC1812JBD144E LPC185X_3X_2X_1X.pdf
LPC1812JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC1812JET100E LPC185X_3X_2X_1X.pdf
LPC1812JET100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+715.43 грн
10+558.81 грн
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LPC1813JBD144E LPC185X_3X_2X_1X.pdf
LPC1813JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC1813JET100E LPC185X_3X_2X_1X.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC1815JBD144E LPC185X_3X_2X_1X.pdf
LPC1815JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC1815JET100E LPC185X_3X_2X_1X.pdf
LPC1815JET100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC1817JBD144E LPC185X_3X_2X_1X.pdf
LPC1817JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
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LPC1817JET100E LPC185X_3X_2X_1X.pdf
LPC1817JET100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4312JBD144E LPC435X_3X_2X_1X.pdf
LPC4312JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1307.52 грн
В кошику  од. на суму  грн.
LPC4313JBD144E LPC435X_3X_2X_1X.pdf
LPC4313JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1242.26 грн
10+948.42 грн
В кошику  од. на суму  грн.
LPC4315JBD144E LPC435X_3X_2X_1X.pdf
LPC4315JBD144E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
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