Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35490) > Сторінка 261 з 592
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SPC5604BK0MLL6 | NXP USA Inc. |
 Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
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SPC5604BK0MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
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SPC5604BK0MLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
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SPC5604BK0VLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
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SPC5604BK0VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
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SPC5604CAMLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
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SPC5604CAMLH6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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SPC5604CK0MLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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SPC5604CK0MLH6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
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SPC5605BK0CLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
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SPC5605BK0MLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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SPC5605BK0MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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SPC5605BK0VLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
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SPC5605BK0VLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
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SPC5606BK0MLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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SPC5606BK0MLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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SPC5607BK0MLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
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SPC5645BF0VLT1R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP Packaging: Tape & Reel (TR) Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Part Status: Active Number of I/O: 177 DigiKey Programmable: Not Verified |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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SPC5645SF1VLTR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP Packaging: Tape & Reel (TR) Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 20x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified |
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TRK-S12VR-WLFT | NXP USA Inc. |
Description: S12VR EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12 Utilized IC / Part: S12VR Part Status: Active |
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| TRK-S12ZVFP64 | NXP USA Inc. |
Description: S12ZVFP EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), Cable(s), LCD Core Processor: HCS12 Utilized IC / Part: S12ZVFP |
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74HC4520PW-Q100J | NXP USA Inc. |
Description: IC BIN COUNTER DL 4BIT 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-TSSOP Part Status: Obsolete Voltage - Supply: 2 V ~ 6 V Count Rate: 69 MHz Number of Bits per Element: 4 Grade: Automotive Qualification: AEC-Q100 |
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74LVC1G02GMH | NXP USA Inc. |
Description: IC GATE NOR 1CH 2-INP 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 200 µA |
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74LVC1G79GMH | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 500 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 500 MHz Input Capacitance: 5 pF Supplier Device Package: 6-XSON, SOT886 (1.45x1) Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 1 |
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BGU6009/N2X | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 17dB Current - Supply: 5.1mA Noise Figure: 0.9dB P1dB: -7dBm Test Frequency: 1.559GHz ~ 1.61GHz Supplier Device Package: 6-XSON, SOT1230 (1.1x0.9) |
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HT1MOA4S30/E/3J | NXP USA Inc. |
Description: IC RFID TRANSP 125KHZ PLLMC Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -25°C ~ 85°C Voltage - Supply: 6.5V Supplier Device Package: PLLMC Part Status: Active |
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HTSMOH4802EVJ | NXP USA Inc. |
Description: IC RFID TRANSP 100-150KHZ PLLMC Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 100kHz ~ 150kHz Type: RFID Transponder Operating Temperature: -25°C ~ 85°C Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2 Supplier Device Package: PLLMC |
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| HTSMOH5602EVJ | NXP USA Inc. |
Description: IC RFID TRANSP 100-150KHZ PLLMC Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 100kHz ~ 150kHz Type: RFID Transponder Operating Temperature: -25°C ~ 85°C Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2 Supplier Device Package: PLLMC |
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KMA221J | NXP USA Inc. |
Description: SENSOR ANGLE 180DEG PC PIN Packaging: Tape & Reel (TR) Package / Case: 4-SIP Module Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 160°C Termination Style: PC Pin Voltage - Supply: 4.5V ~ 5.5V Linearity: ±1.2° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 4-SIL Rotation Angle - Electrical, Mechanical: 0° ~ 180° Part Status: Obsolete |
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KMI16/1/V3PX | NXP USA Inc. |
Description: MAG SWITCH SPEC PURP SOT477B Packaging: Tape & Reel (TR) Features: Amplified Output, Temperature Compensated Package / Case: SOT-477B Output Type: Open Collector Mounting Type: Through Hole Function: Special Purpose Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 4.5V ~ 16V Technology: Magnetoresistive Current - Output (Max): 20mA Current - Supply (Max): 14mA Supplier Device Package: 3-SIP Part Status: Obsolete |
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LPC1114FBD48/303J | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
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LPC11E35FHI33/501E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 DigiKey Programmable: Not Verified |
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LPC1830FET100Y | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tape & Reel (TR) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 49 DigiKey Programmable: Not Verified |
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LPC4076FET180K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) DigiKey Programmable: Not Verified |
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LPC824M201JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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NTSX2102GDH | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8XSON Features: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT996-2 (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 5.5 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCA2117DUGR/DAZ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.5V ~ 5.5V Digits or Characters: 20 Characters, 40 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 200 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCA2117DUGS/DAZ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.5V ~ 5.5V Digits or Characters: 20 Characters, 40 Characters, 40 Elements Supplier Device Package: Die Grade: Automotive Current - Supply: 200 µA Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCA85133U/2DB/Q1Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 20 Characters, 40 Characters, 320 Elements Supplier Device Package: Die Current - Supply: 50 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PCA8561AHN/AY | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 4 Characters, 9 Characters, 72 Elements Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Part Status: Active Current - Supply: 1.8 µA Qualification: AEC-Q100 |
на замовлення 36000 шт: термін постачання 21-31 дні (днів) |
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| PCA8576FUG/2DA/QKP | NXP USA Inc. | Description: IC DRVR 7 SEGMENT DIE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PCA9641BSHP | NXP USA Inc. |
Description: IC DEMUX 2CHAN 16HVQFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, Multiplexer Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Applications: I2C Current - Supply: 100mA Supplier Device Package: 16-HVQFN (3x3) Part Status: Active Capacitance - Input: 6 pF |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PCA9848PWJ | NXP USA Inc. |
Description: IC BUS SWITCH 2 X 8:1 24-TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 8:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Dual Supply Supplier Device Package: 24-TSSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PCA9848PWZ | NXP USA Inc. |
Description: IC BUS SWITCH 2 X 8:1 24TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 8:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Dual Supply Supplier Device Package: 24-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCF2119AU/2DA/2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119DU/2/2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119FU/2/F2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Part Status: Obsolete Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119IU/2DA/2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119RU/2/F2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I2C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119RU/2DB/2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I2C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF2119SU/2/F2Z | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I²C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCF21219DUGR/DAZ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT DIE Packaging: Tray Package / Case: Die Display Type: LCD Mounting Type: Surface Mount Interface: I2C, Parallel Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Digits or Characters: 16 Characters, 32 Characters, 40 Elements Supplier Device Package: Die Current - Supply: 35 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PCF85063ATT/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 8TSSOP Features: Alarm, Leap Year, Square Wave Output Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-TSSOP Current - Timekeeping (Max): 0.6µA @ 3.3V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 27500 шт: термін постачання 21-31 дні (днів) |
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| PCF85133U/2DA/1Z | NXP USA Inc. | Description: IC DRVR 7 SEGMENT DIE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
 |
PCF85263AT/AJ | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C 8SO Features: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-SO Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 110000 шт: термін постачання 21-31 дні (днів) |
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PCF85263ATT/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 8TSSOP Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, Watchdog Timer Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V DigiKey Programmable: Not Verified |
на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
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PCF85263ATT1/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOP Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, Watchdog Timer Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I²C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PCF85363ATT/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 8TSSOP Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, Watchdog Timer Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Memory Size: 64B Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 87500 шт: термін постачання 21-31 дні (днів) |
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PCF85363ATT1/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOP Features: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Memory Size: 64B Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCF8538UG/2DA/1Z | NXP USA Inc. | Description: IC DRVR 7 SEGMENT DIE |
товару немає в наявності |
В кошику од. на суму грн. |
| SPC5604BK0MLL6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5604BK0MLL6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5604BK0MLQ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5604BK0VLL6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5604BK0VLL6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5604CAMLH6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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| SPC5604CAMLH6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
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| SPC5604CK0MLH6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
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| SPC5604CK0MLH6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
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| SPC5605BK0CLL6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
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| SPC5605BK0MLL6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1589.37 грн |
| 10+ | 1223.26 грн |
| 25+ | 1146.55 грн |
| 90+ | 1001.80 грн |
| SPC5605BK0MLL6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 951.88 грн |
| SPC5605BK0VLQ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
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| SPC5605BK0VLQ6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
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| SPC5606BK0MLQ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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| SPC5606BK0MLQ6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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| SPC5607BK0MLU6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
на замовлення 195 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1694.17 грн |
| 10+ | 1317.60 грн |
| 25+ | 1244.62 грн |
| SPC5645BF0VLT1R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 180+ | 2551.26 грн |
| SPC5645SF1VLTR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
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| TRK-S12VR-WLFT |
|
Виробник: NXP USA Inc.
Description: S12VR EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR
Part Status: Active
Description: S12VR EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR
Part Status: Active
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| TRK-S12ZVFP64 |
|
Виробник: NXP USA Inc.
Description: S12ZVFP EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: HCS12
Utilized IC / Part: S12ZVFP
Description: S12ZVFP EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: HCS12
Utilized IC / Part: S12ZVFP
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| 74HC4520PW-Q100J |
|
Виробник: NXP USA Inc.
Description: IC BIN COUNTER DL 4BIT 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 69 MHz
Number of Bits per Element: 4
Grade: Automotive
Qualification: AEC-Q100
Description: IC BIN COUNTER DL 4BIT 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 69 MHz
Number of Bits per Element: 4
Grade: Automotive
Qualification: AEC-Q100
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| 74LVC1G02GMH |
Виробник: NXP USA Inc.
Description: IC GATE NOR 1CH 2-INP 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Description: IC GATE NOR 1CH 2-INP 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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| 74LVC1G79GMH |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
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| BGU6009/N2X |
Виробник: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5.1mA
Noise Figure: 0.9dB
P1dB: -7dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT1230 (1.1x0.9)
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5.1mA
Noise Figure: 0.9dB
P1dB: -7dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT1230 (1.1x0.9)
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| HT1MOA4S30/E/3J |
|
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
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| HTSMOH4802EVJ |
|
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 100-150KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
Supplier Device Package: PLLMC
Description: IC RFID TRANSP 100-150KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
Supplier Device Package: PLLMC
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| HTSMOH5602EVJ |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 100-150KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
Supplier Device Package: PLLMC
Description: IC RFID TRANSP 100-150KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
Supplier Device Package: PLLMC
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| KMA221J |
|
Виробник: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Part Status: Obsolete
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Part Status: Obsolete
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| KMI16/1/V3PX |
|
Виробник: NXP USA Inc.
Description: MAG SWITCH SPEC PURP SOT477B
Packaging: Tape & Reel (TR)
Features: Amplified Output, Temperature Compensated
Package / Case: SOT-477B
Output Type: Open Collector
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 4.5V ~ 16V
Technology: Magnetoresistive
Current - Output (Max): 20mA
Current - Supply (Max): 14mA
Supplier Device Package: 3-SIP
Part Status: Obsolete
Description: MAG SWITCH SPEC PURP SOT477B
Packaging: Tape & Reel (TR)
Features: Amplified Output, Temperature Compensated
Package / Case: SOT-477B
Output Type: Open Collector
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 4.5V ~ 16V
Technology: Magnetoresistive
Current - Output (Max): 20mA
Current - Supply (Max): 14mA
Supplier Device Package: 3-SIP
Part Status: Obsolete
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| LPC1114FBD48/303J |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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| LPC11E35FHI33/501E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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| LPC1830FET100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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| LPC4076FET180K |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
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| LPC824M201JHI33Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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| NTSX2102GDH |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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| PCA2117DUGR/DAZ |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 200 µA
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| PCA2117DUGS/DAZ |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 40 Elements
Supplier Device Package: Die
Grade: Automotive
Current - Supply: 200 µA
Qualification: AEC-Q100
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 40 Elements
Supplier Device Package: Die
Grade: Automotive
Current - Supply: 200 µA
Qualification: AEC-Q100
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| PCA85133U/2DB/Q1Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: Die
Current - Supply: 50 mA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: Die
Current - Supply: 50 mA
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| PCA8561AHN/AY |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 4 Characters, 9 Characters, 72 Elements
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Part Status: Active
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Description: IC DRVR 7 SEGMENT 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 4 Characters, 9 Characters, 72 Elements
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Part Status: Active
Current - Supply: 1.8 µA
Qualification: AEC-Q100
на замовлення 36000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6000+ | 49.24 грн |
| PCA8576FUG/2DA/QKP |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Description: IC DRVR 7 SEGMENT DIE
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| PCA9641BSHP |
|
Виробник: NXP USA Inc.
Description: IC DEMUX 2CHAN 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Multiplexer
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 100mA
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Capacitance - Input: 6 pF
Description: IC DEMUX 2CHAN 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Multiplexer
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 100mA
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Capacitance - Input: 6 pF
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| PCA9848PWJ |
|
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 8:1 24-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-TSSOP
Part Status: Active
Description: IC BUS SWITCH 2 X 8:1 24-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-TSSOP
Part Status: Active
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| PCA9848PWZ |
|
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 8:1 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-TSSOP
Description: IC BUS SWITCH 2 X 8:1 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-TSSOP
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| PCF2119AU/2DA/2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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| PCF2119DU/2/2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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| PCF2119FU/2/F2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Part Status: Obsolete
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Part Status: Obsolete
Current - Supply: 35 µA
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| PCF2119IU/2DA/2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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| PCF2119RU/2/F2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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| PCF2119RU/2DB/2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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| PCF2119SU/2/F2Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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од. на суму грн.
| PCF21219DUGR/DAZ |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, Parallel
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 16 Characters, 32 Characters, 40 Elements
Supplier Device Package: Die
Current - Supply: 35 µA
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од. на суму грн.
| PCF85063ATT/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 27500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 30.30 грн |
| 5000+ | 28.46 грн |
| 7500+ | 28.09 грн |
| 12500+ | 25.99 грн |
| 17500+ | 25.77 грн |
| PCF85133U/2DA/1Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Description: IC DRVR 7 SEGMENT DIE
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| PCF85263AT/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 35.14 грн |
| PCF85263ATT/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 39.60 грн |
| 5000+ | 37.23 грн |
| 7500+ | 36.78 грн |
| 12500+ | 34.04 грн |
| 17500+ | 33.77 грн |
| PCF85263ATT1/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I²C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I²C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| PCF85363ATT/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 87500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 39.98 грн |
| PCF85363ATT1/AJ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| PCF8538UG/2DA/1Z |
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Description: IC DRVR 7 SEGMENT DIE
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од. на суму грн.