Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37086) > Сторінка 260 з 619
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MMRF1305HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 512MHz Configuration: Dual Power - Output: 100W Gain: 26dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
MMRF1308HR5 | NXP USA Inc. |
 Description: FET RF 2CH 133V 230MHZ NI1230Packaging: Cut Tape (CT) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
MMRF1310HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
MMRF1316NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-4 Packaging: Cut Tape (CT) Package / Case: TO-270-4 Mounting Type: Surface Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 27dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MKL33Z64VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||
 |
MKL33Z64VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80FQFP Packaging: Tube Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 480 шт В кошику од. на суму грн. | ||||||||||||||
 |
MKL17Z64VDA4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 36XFBGA Packaging: Tray Package / Case: 36-XFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 15x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 36-XFBGA (3.5x3.5) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
MKL17Z64VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 798 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MKL27Z64VDA4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 36XFBGA Packaging: Tray Package / Case: 36-XFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 36-XFBGA (3.5x3.5) Number of I/O: 30 DigiKey Programmable: Not Verified |
на замовлення 467 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MKL27Z64VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 17x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 51 DigiKey Programmable: Not Verified |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
LPC54102J512UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 49WLCSP Packaging: Tape & Reel (TR) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
LPC54102J512UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 49WLCSP Packaging: Cut Tape (CT) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 11429 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
MC32PF3000A0EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 495 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC32PF3000A1EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
на замовлення 588 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC34PF3000A0EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 1377 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC34PF3000A1EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 215 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC34PF3000A2EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC34PF3000A3EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
на замовлення 252 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
KITPF3000FRDMEVM | NXP USA Inc. |
Description: EVALUATION KIT PF3000 PMIC Packaging: Box Voltage - Input: 2.8V ~ 5.5V Current - Output: 1.75A, 1.5A, 1.25A, 1A, 600mA, 350mA, 350mA, 250mA, 100mA, 100mA, 100mA, 1mA Regulator Topology: Boost, Buck Board Type: Fully Populated Utilized IC / Part: PF3000 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Up or Down with LDO Outputs and Type: 12, Non-Isolated |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
KITPF3000FRDMPGM | NXP USA Inc. |
Description: EVAL KIT PROGRAM BOARD PF3000 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM11029,598 | NXP USA Inc. |
Description: LPC3152 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM9 Board Type: Evaluation Platform Utilized IC / Part: LPC3152 Part Status: Obsolete |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| OM11034,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC1768 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1768 Platform: IAR KickStart Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
OM11036,598 | NXP USA Inc. |
Description: LPC1758 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1758 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM11037,598 | NXP USA Inc. |
Description: LPC3141 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM9 Board Type: Evaluation Platform Utilized IC / Part: LPC3141 Part Status: Not For New Designs |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM11040,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC1343 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1343 Platform: IAR KickStart Part Status: Not For New Designs |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM11045,598 | NXP USA Inc. |
Description: LPC3250 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM9 Utilized IC / Part: LPC3250 |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM11084,598 | NXP USA Inc. |
Description: LPC1769 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1769 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM11085,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC1114 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0 Board Type: Evaluation Platform Utilized IC / Part: LPC1114 Platform: IAR KickStart Part Status: Not For New Designs |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM11086,598 | NXP USA Inc. |
Description: LPC1114 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC1114 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM13003,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11C14 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11C14 Platform: IAR KickStart |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM13004,598 | NXP USA Inc. | Description: LPC11C14 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM13011,598 | NXP USA Inc. |
Description: LPC1227 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC1227 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
OM13018,598 | NXP USA Inc. |
Description: LPC11U14 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U14 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| OM13019,598 | NXP USA Inc. |
Description: EA 7" WVGA LCD DISPLAY KIT Packaging: Box For Use With/Related Products: LPC1788 Accessory Type: LCD Display Part Status: Obsolete |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
 |
OM13025,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11A14 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11A14 Platform: IAR KickStart |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM13033,598 | NXP USA Inc. |
Description: BLUEBOARD LPC11U24 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM® Cortex®-M0 Board Type: Evaluation Platform Utilized IC / Part: LPC11U24 Platform: BlueBoard Part Status: Obsolete |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
OM13034,598 | NXP USA Inc. |
Description: IAR KICKSTART LPC1347 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1347 Platform: IAR KickStart Part Status: Not For New Designs |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| OM13041,598 | NXP USA Inc. | Description: BLUEBOARD LPC11U37 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
OM7925/BGU7051,598 | NXP USA Inc. |
Description: EVAL BOARD FOR BGU7051 Packaging: Box For Use With/Related Products: BGU7051 Frequency: 500MHz ~ 1.5GHz Type: Amplifier Contents: Board(s) Utilized IC / Part: BGU7051 Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| SSL2101DB07,598 | NXP USA Inc. |
Description: EVAL BOARD FOR SSL2101 Features: Dimmable Packaging: Box Voltage - Output: 15.6V Voltage - Input: 230VAC Contents: Board(s) Current - Output / Channel: 415mA Utilized IC / Part: SSL2101 Outputs and Type: 1 Non-Isolated Output |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
 |
MCR20AVHM | NXP USA Inc. |
Description: IC RF TXRX 802.15.4 41MAPLGA Packaging: Tray Package / Case: 41-VFLGA Sensitivity: -102dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 3.6V Power - Output: 8dBm Current - Receiving: 15mA ~ 19mA Data Rate (Max): 250kbps Current - Transmitting: 17mA Supplier Device Package: 41-MAPLGA (5x5) GPIO: 8 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: SPI Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
FRDM-CR20A | NXP USA Inc. |
Description: DEV BOARD FREEDOM MCR20A KINETIS Packaging: Box For Use With/Related Products: MCR20A Frequency: 2.4GHz Type: Transceiver; 802.15.4 Contents: Board(s) Utilized IC / Part: MCR20A Supplied Contents: Board(s) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PCT2202UKZ | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 6WLCSP Features: One-Shot, Output Switch, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: 6-XFBGA, WLCSP Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 1.65V ~ 1.95V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-WLCSP (0.69x1.09) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -40°C ~ 125°C Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
NCX2200GF3,132 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT891 (1x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
NCX2202GM,115 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
NCX2202GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOP Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Open-Drain Mounting Type: Surface Mount Number of Elements: 1 Type: Standard (General Purpose) Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Not For New Designs |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
NCX2222GTX | NXP USA Inc. |
Description: IC COMPARATOR 2CH Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Output Type: Open-Drain Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): 68mA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 9mV Part Status: Not For New Designs |
на замовлення 4610 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NCX8193GUX | NXP USA Inc. |
Description: IC DETECTION MONITOR 1-CH Packaging: Cut Tape (CT) Package / Case: 10-XFQFN Mounting Type: Surface Mount Function: Detection Monitor Interface: Analog Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.25V Applications: Communication Systems Supplier Device Package: 10-XQFN (1.4x1.8) Part Status: Obsolete Number of Channels: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
NTB0101GS,132 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 6-XSON/SOT1202 Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-XSON, SOT1202 (1x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
на замовлення 2005 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NTB0101GW,125 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 6-TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 1454 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NTB0102DP-Q100H | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
на замовлення 21658 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NTB0104BQ-Q100X | NXP USA Inc. |
Description: IC XLTR VL BIDIR 14-DHVQFN Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 14-VFQFN Exposed Pad Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 14-DHVQFN (2.5x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
на замовлення 8957 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
NTS0101GW,125 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
|
|
NTS0102DP-Q100H | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
на замовлення 3323 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
NTS0104BQ-Q100X | NXP USA Inc. |
Description: IC XLTR VL BIDIR 14-DHVQFN Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 14-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 14-DHVQFN (2.5x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
на замовлення 7726 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NTS0104PW-Q100J | NXP USA Inc. |
Description: IC XLTR VL BIDIR 14-TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NTS0104UK,012 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 12WLCSP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 12-UFBGA, WLCSP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Last Time Buy Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
NX3DV2567HR,115 | NXP USA Inc. |
Description: IC ANLG SWITCH 4PDT 16HXQFN Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Part Status: Active Number of Channels: 1 |
на замовлення 3963 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NX3DV42GU,115 | NXP USA Inc. |
Description: IC USB SWITCH DPDT XQFN10 Features: Break-Before-Make, USB 2.0 Packaging: Cut Tape (CT) Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: USB On-State Resistance (Max): 6.5Ohm -3db Bandwidth: 950MHz Supplier Device Package: 10-XQFN (1.4x1.8) Voltage - Supply, Single (V+): 3V ~ 4.3V Switch Circuit: DPDT Part Status: Active Number of Channels: 1 |
на замовлення 14065 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
NX3DV642GU,115 | NXP USA Inc. |
Description: IC SWITCH TPDT DIFF XQFN24 Features: Break-Before-Make Packaging: Cut Tape (CT) Package / Case: 24-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: MIPI On-State Resistance (Max): 14Ohm -3db Bandwidth: 950MHz Supplier Device Package: 24-XQFN (2.5x3.4) Voltage - Supply, Single (V+): 2.65V ~ 4.3V Switch Circuit: 3PDT Part Status: Active Number of Channels: 1 |
на замовлення 1716 шт: термін постачання 21-31 дні (днів) |
|
| MMRF1305HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 65 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7926.69 грн |
| 10+ | 6401.03 грн |
| 25+ | 6093.31 грн |
| MMRF1308HR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товару немає в наявності
В кошику
од. на суму грн.
| MMRF1310HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10607.71 грн |
| MMRF1316NR1 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товару немає в наявності
В кошику
од. на суму грн.
| MKL33Z64VLH4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| MKL33Z64VLK4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
Packaging: Tube
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 80FQFP
Packaging: Tube
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 480 шт
В кошику
од. на суму грн.
| MKL17Z64VDA4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 347.60 грн |
| 10+ | 254.67 грн |
| 25+ | 234.75 грн |
| 100+ | 199.70 грн |
| 490+ | 184.14 грн |
| MKL17Z64VLH4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 798 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 355.52 грн |
| 10+ | 260.92 грн |
| 50+ | 228.21 грн |
| 100+ | 204.68 грн |
| 160+ | 199.21 грн |
| 640+ | 186.72 грн |
| MKL27Z64VDA4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Number of I/O: 30
DigiKey Programmable: Not Verified
на замовлення 467 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 461.62 грн |
| 10+ | 341.43 грн |
| 25+ | 315.69 грн |
| 100+ | 269.71 грн |
| MKL27Z64VLH4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 370.56 грн |
| 10+ | 271.90 грн |
| 25+ | 250.67 грн |
| LPC54102J512UK49Z |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8000+ | 458.66 грн |
| LPC54102J512UK49Z |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 11429 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 767.25 грн |
| 10+ | 577.95 грн |
| 25+ | 537.60 грн |
| 100+ | 462.95 грн |
| 250+ | 452.98 грн |
| MC32PF3000A0EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 495 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 410.94 грн |
| 10+ | 306.06 грн |
| 25+ | 303.37 грн |
| MC32PF3000A1EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
на замовлення 588 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 536.84 грн |
| 10+ | 399.23 грн |
| 25+ | 369.83 грн |
| 100+ | 316.69 грн |
| 260+ | 301.66 грн |
| 520+ | 293.02 грн |
| MC34PF3000A0EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 1377 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 486.16 грн |
| 10+ | 363.01 грн |
| 25+ | 336.74 грн |
| 100+ | 288.90 грн |
| 260+ | 279.68 грн |
| MC34PF3000A1EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 215 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 576.43 грн |
| 10+ | 429.20 грн |
| 25+ | 397.89 грн |
| 100+ | 341.07 грн |
| MC34PF3000A2EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 488.54 грн |
| 10+ | 364.84 грн |
| 25+ | 338.45 грн |
| 100+ | 298.69 грн |
| MC34PF3000A3EP |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
на замовлення 252 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 547.92 грн |
| 10+ | 407.85 грн |
| 25+ | 378.06 грн |
| 100+ | 327.71 грн |
| KITPF3000FRDMEVM |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT PF3000 PMIC
Packaging: Box
Voltage - Input: 2.8V ~ 5.5V
Current - Output: 1.75A, 1.5A, 1.25A, 1A, 600mA, 350mA, 350mA, 250mA, 100mA, 100mA, 100mA, 1mA
Regulator Topology: Boost, Buck
Board Type: Fully Populated
Utilized IC / Part: PF3000
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Up or Down with LDO
Outputs and Type: 12, Non-Isolated
Description: EVALUATION KIT PF3000 PMIC
Packaging: Box
Voltage - Input: 2.8V ~ 5.5V
Current - Output: 1.75A, 1.5A, 1.25A, 1A, 600mA, 350mA, 350mA, 250mA, 100mA, 100mA, 100mA, 1mA
Regulator Topology: Boost, Buck
Board Type: Fully Populated
Utilized IC / Part: PF3000
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Up or Down with LDO
Outputs and Type: 12, Non-Isolated
товару немає в наявності
В кошику
од. на суму грн.
| KITPF3000FRDMPGM |
|
Виробник: NXP USA Inc.
Description: EVAL KIT PROGRAM BOARD PF3000
Description: EVAL KIT PROGRAM BOARD PF3000
товару немає в наявності
В кошику
од. на суму грн.
| OM11029,598 |
Виробник: NXP USA Inc.
Description: LPC3152 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3152
Part Status: Obsolete
Description: LPC3152 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3152
Part Status: Obsolete
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14821.66 грн |
| OM11034,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Platform: IAR KickStart
Part Status: Obsolete
Description: IAR KICKSTART LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Platform: IAR KickStart
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| OM11036,598 |
Виробник: NXP USA Inc.
Description: LPC1758 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1758
Part Status: Obsolete
Description: LPC1758 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1758
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| OM11037,598 |
|
Виробник: NXP USA Inc.
Description: LPC3141 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3141
Part Status: Not For New Designs
Description: LPC3141 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3141
Part Status: Not For New Designs
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 20376.12 грн |
| OM11040,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC1343 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1343
Platform: IAR KickStart
Part Status: Not For New Designs
Description: IAR KICKSTART LPC1343 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1343
Platform: IAR KickStart
Part Status: Not For New Designs
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11884.89 грн |
| OM11045,598 |
Виробник: NXP USA Inc.
Description: LPC3250 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM9
Utilized IC / Part: LPC3250
Description: LPC3250 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM9
Utilized IC / Part: LPC3250
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24454.67 грн |
| OM11084,598 |
Виробник: NXP USA Inc.
Description: LPC1769 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1769
Part Status: Active
Description: LPC1769 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1769
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| OM11085,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1114
Platform: IAR KickStart
Part Status: Not For New Designs
Description: IAR KICKSTART LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1114
Platform: IAR KickStart
Part Status: Not For New Designs
товару немає в наявності
В кошику
од. на суму грн.
| OM11086,598 |
Виробник: NXP USA Inc.
Description: LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Part Status: Obsolete
Description: LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| OM13003,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC11C14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11C14
Platform: IAR KickStart
Description: IAR KICKSTART LPC11C14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11C14
Platform: IAR KickStart
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10155.60 грн |
| OM13004,598 |
Виробник: NXP USA Inc.
Description: LPC11C14 EVAL BRD
Description: LPC11C14 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| OM13011,598 |
Виробник: NXP USA Inc.
Description: LPC1227 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1227
Description: LPC1227 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1227
товару немає в наявності
В кошику
од. на суму грн.
| OM13018,598 |
Виробник: NXP USA Inc.
Description: LPC11U14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U14
Part Status: Active
Description: LPC11U14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U14
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| OM13019,598 |
Виробник: NXP USA Inc.
Description: EA 7" WVGA LCD DISPLAY KIT
Packaging: Box
For Use With/Related Products: LPC1788
Accessory Type: LCD Display
Part Status: Obsolete
Description: EA 7" WVGA LCD DISPLAY KIT
Packaging: Box
For Use With/Related Products: LPC1788
Accessory Type: LCD Display
Part Status: Obsolete
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11223.73 грн |
| OM13025,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC11A14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11A14
Platform: IAR KickStart
Description: IAR KICKSTART LPC11A14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11A14
Platform: IAR KickStart
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19760.90 грн |
| OM13033,598 |
Виробник: NXP USA Inc.
Description: BLUEBOARD LPC11U24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U24
Platform: BlueBoard
Part Status: Obsolete
Description: BLUEBOARD LPC11U24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U24
Platform: BlueBoard
Part Status: Obsolete
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6047.75 грн |
| OM13034,598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC1347 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1347
Platform: IAR KickStart
Part Status: Not For New Designs
Description: IAR KICKSTART LPC1347 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1347
Platform: IAR KickStart
Part Status: Not For New Designs
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 17789.32 грн |
| OM13041,598 |
Виробник: NXP USA Inc.
Description: BLUEBOARD LPC11U37 EVAL BRD
Description: BLUEBOARD LPC11U37 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| OM7925/BGU7051,598 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGU7051
Packaging: Box
For Use With/Related Products: BGU7051
Frequency: 500MHz ~ 1.5GHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: BGU7051
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL BOARD FOR BGU7051
Packaging: Box
For Use With/Related Products: BGU7051
Frequency: 500MHz ~ 1.5GHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: BGU7051
Supplied Contents: Board(s)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SSL2101DB07,598 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SSL2101
Features: Dimmable
Packaging: Box
Voltage - Output: 15.6V
Voltage - Input: 230VAC
Contents: Board(s)
Current - Output / Channel: 415mA
Utilized IC / Part: SSL2101
Outputs and Type: 1 Non-Isolated Output
Description: EVAL BOARD FOR SSL2101
Features: Dimmable
Packaging: Box
Voltage - Output: 15.6V
Voltage - Input: 230VAC
Contents: Board(s)
Current - Output / Channel: 415mA
Utilized IC / Part: SSL2101
Outputs and Type: 1 Non-Isolated Output
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7590.17 грн |
| MCR20AVHM |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 41MAPLGA
Packaging: Tray
Package / Case: 41-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Current - Receiving: 15mA ~ 19mA
Data Rate (Max): 250kbps
Current - Transmitting: 17mA
Supplier Device Package: 41-MAPLGA (5x5)
GPIO: 8
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: SPI
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC RF TXRX 802.15.4 41MAPLGA
Packaging: Tray
Package / Case: 41-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Current - Receiving: 15mA ~ 19mA
Data Rate (Max): 250kbps
Current - Transmitting: 17mA
Supplier Device Package: 41-MAPLGA (5x5)
GPIO: 8
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: SPI
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 320.68 грн |
| FRDM-CR20A |
|
Виробник: NXP USA Inc.
Description: DEV BOARD FREEDOM MCR20A KINETIS
Packaging: Box
For Use With/Related Products: MCR20A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Contents: Board(s)
Utilized IC / Part: MCR20A
Supplied Contents: Board(s)
Part Status: Active
Description: DEV BOARD FREEDOM MCR20A KINETIS
Packaging: Box
For Use With/Related Products: MCR20A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Contents: Board(s)
Utilized IC / Part: MCR20A
Supplied Contents: Board(s)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| PCT2202UKZ |
|
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| NCX2200GF3,132 |
|
Виробник: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT891 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT891 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| NCX2202GM,115 |
|
Виробник: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| NCX2202GW,125 |
|
Виробник: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
товару немає в наявності
В кошику
од. на суму грн.
| NCX2222GTX |
|
Виробник: NXP USA Inc.
Description: IC COMPARATOR 2CH
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
Description: IC COMPARATOR 2CH
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
на замовлення 4610 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 66.51 грн |
| 10+ | 45.75 грн |
| 25+ | 41.20 грн |
| 100+ | 34.02 грн |
| 250+ | 31.80 грн |
| 500+ | 30.46 грн |
| 1000+ | 29.04 грн |
| NCX8193GUX |
|
Виробник: NXP USA Inc.
Description: IC DETECTION MONITOR 1-CH
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Function: Detection Monitor
Interface: Analog
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.25V
Applications: Communication Systems
Supplier Device Package: 10-XQFN (1.4x1.8)
Part Status: Obsolete
Number of Channels: 1
Description: IC DETECTION MONITOR 1-CH
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Function: Detection Monitor
Interface: Analog
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.25V
Applications: Communication Systems
Supplier Device Package: 10-XQFN (1.4x1.8)
Part Status: Obsolete
Number of Channels: 1
товару немає в наявності
В кошику
од. на суму грн.
| NTB0101GS,132 |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-XSON/SOT1202
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC XLTR VL BIDIR 6-XSON/SOT1202
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
на замовлення 2005 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 26.13 грн |
| 18+ | 17.31 грн |
| 25+ | 15.34 грн |
| 100+ | 12.46 грн |
| 250+ | 11.52 грн |
| 500+ | 10.96 грн |
| 1000+ | 10.32 грн |
| NTB0101GW,125 |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 1454 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 30.88 грн |
| 15+ | 20.82 грн |
| 25+ | 18.57 грн |
| 100+ | 15.12 грн |
| 250+ | 14.02 грн |
| 500+ | 13.35 грн |
| 1000+ | 12.60 грн |
| NTB0102DP-Q100H |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
на замовлення 21658 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 77.60 грн |
| 10+ | 53.53 грн |
| 25+ | 48.40 грн |
| 100+ | 40.08 грн |
| 250+ | 37.54 грн |
| 500+ | 36.01 грн |
| 1000+ | 34.59 грн |
| NTB0104BQ-Q100X |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
на замовлення 8957 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 86.31 грн |
| 10+ | 60.31 грн |
| 25+ | 54.56 грн |
| 100+ | 45.27 грн |
| 250+ | 42.44 грн |
| 500+ | 40.72 грн |
| 1000+ | 38.67 грн |
| NTS0101GW,125 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| NTS0102DP-Q100H |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
на замовлення 3323 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 68.09 грн |
| 10+ | 47.50 грн |
| 25+ | 42.85 грн |
| 100+ | 35.40 грн |
| 250+ | 33.11 грн |
| 500+ | 31.73 грн |
| 1000+ | 30.09 грн |
| NTS0104BQ-Q100X |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
на замовлення 7726 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 102.93 грн |
| 10+ | 72.36 грн |
| 25+ | 65.60 грн |
| 100+ | 54.59 грн |
| 250+ | 51.26 грн |
| 500+ | 49.26 грн |
| 1000+ | 46.92 грн |
| NTS0104PW-Q100J |
|
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 91.85 грн |
| 10+ | 63.90 грн |
| 25+ | 57.83 грн |
| NTS0104UK,012 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 12WLCSP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
товару немає в наявності
В кошику
од. на суму грн.
| NX3DV2567HR,115 |
|
Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Active
Number of Channels: 1
Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Active
Number of Channels: 1
на замовлення 3963 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 116.39 грн |
| 10+ | 81.89 грн |
| 25+ | 74.33 грн |
| 100+ | 61.97 грн |
| 250+ | 58.25 грн |
| 500+ | 56.01 грн |
| NX3DV42GU,115 |
|
Виробник: NXP USA Inc.
Description: IC USB SWITCH DPDT XQFN10
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
Description: IC USB SWITCH DPDT XQFN10
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
на замовлення 14065 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 79.18 грн |
| 10+ | 54.97 грн |
| 25+ | 49.68 грн |
| 100+ | 41.14 грн |
| 250+ | 38.53 грн |
| 500+ | 36.96 грн |
| 1000+ | 35.49 грн |
| NX3DV642GU,115 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH TPDT DIFF XQFN24
Features: Break-Before-Make
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
Description: IC SWITCH TPDT DIFF XQFN24
Features: Break-Before-Make
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
на замовлення 1716 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 70.47 грн |
| 10+ | 48.72 грн |
| 25+ | 44.01 грн |
| 100+ | 36.38 грн |
| 250+ | 34.03 грн |
| 500+ | 32.61 грн |
| 1000+ | 30.94 грн |