Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36384) > Сторінка 34 з 607
| Фото | Назва | Виробник | Інформація |
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MC68331CAG25 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68331CEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332ACAG16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332ACAG20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332AMAG20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332AMEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332AVAG25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332AVEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332AVEH25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 25MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GCAG20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Part Status: Not For New Designs Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GCAG25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GCEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 20MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
на замовлення 62 шт: термін постачання 21-31 дні (днів) |
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MC68332GCEH25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Package / Case: 132-BQFP Bumpered Packaging: Tray Number of I/O: 15 Part Status: Not For New Designs Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 25MHz Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GMEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Speed: 16MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray Number of I/O: 15 Part Status: Not For New Designs DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GMEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68332GVEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68336ACAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68336AMAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT DigiKey Programmable: Not Verified Number of I/O: 18 Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68336GCAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Packaging: Tray Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 160-BQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68336GMAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68336GVAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP RAM Size: 7.5K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68340AG16E | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 144LQFP Additional Interfaces: USART Graphics Acceleration: No RAM Controllers: DRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 144-LQFP (20x20) Voltage - I/O: 5.0V Core Processor: CPU32 Operating Temperature: 0°C ~ 70°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: -40°C ~ 85°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68360CVR25LR2 | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: -40°C ~ 85°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68360VR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BACAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BACAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BAVAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Part Status: Obsolete Number of I/O: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BAVAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Number of I/O: 18 Part Status: Obsolete Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 7.5K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BGCAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BGCAB25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BGMAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68376BGVAB20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68882CEI25A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC Supplier Device Package: 68-PLCC (24.21x24.21) Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube DigiKey Programmable: Not Verified Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68882CEI33A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC DigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 68-PLCC (24.21x24.21) Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
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В кошику од. на суму грн. | ||||||||
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MC68882EI25A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC DigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 68-PLCC (24.21x24.21) Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68882EI33A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC DigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 68-PLCC (24.21x24.21) Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
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MC68882EI40A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC DigiKey Programmable: Not Verified Supplier Device Package: 68-PLCC (24.21x24.21) Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68908GR16MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP DigiKey Programmable: Verified Number of I/O: 21 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68908GR16VFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68908GZ8MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68908GZ8VFAE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68EN360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||
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MC68EN360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68en360ai33l | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFP Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68EN360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68EN360VR25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11A0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11A1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11D0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E0CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC DigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Speed: 2MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E0CFNE2R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC DigiKey Programmable: Not Verified Number of I/O: 38 Part Status: Obsolete Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Speed: 2MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC DigiKey Programmable: Not Verified Number of I/O: 38 Part Status: Obsolete Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Speed: 3MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E1CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E1CFNE2R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC11E1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 EEPROM Size: 512 x 8 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Speed: 3MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC16Z1CAG25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC16Z1CEH16 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Number of I/O: 16 Part Status: Not For New Designs Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: CPU16 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Speed: 16MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
на замовлення 556 шт: термін постачання 21-31 дні (днів) |
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MC68HC16Z1CEH25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Speed: 25MHz Number of I/O: 16 Part Status: Not For New Designs Connectivity: EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: CPU16 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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MC68HC705C8ACFNE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44PLCC DigiKey Programmable: Verified Number of I/O: 24 Supplier Device Package: 44-PLCC (16.59x16.59) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Core Processor: HC05 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 304 x 8 Program Memory Size: 8KB (8K x 8) Speed: 2.1MHz Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. |
| MC68331CAG25 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
товару немає в наявності
В кошику
од. на суму грн.
| MC68331CEH20 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332ACAG16 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332ACAG20 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332AMAG20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332AMEH20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332AVAG25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68332AVEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MC68332AVEH25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MC68332GCAG20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68332GCAG25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68332GCEH20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
на замовлення 62 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4203.45 грн |
| 10+ | 3340.53 грн |
| 25+ | 3163.95 грн |
| MC68332GCEH25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
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| MC68332GMEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Number of I/O: 15
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Number of I/O: 15
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
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| MC68332GMEH20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT ROMLESS 132PQFP
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
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| MC68332GVEH20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Description: IC MCU 32BIT ROMLESS 132PQFP
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
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| MC68336ACAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| MC68336AMAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Number of I/O: 18
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 160QFP
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Number of I/O: 18
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| MC68336GCAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Packaging: Tray
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Packaging: Tray
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
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| MC68336GMAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| MC68336GVAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Description: IC MCU 32BIT ROMLESS 160QFP
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
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| MC68340AG16E |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: USART
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5.0V
Core Processor: CPU32
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: USART
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5.0V
Core Processor: CPU32
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68360CVR25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC68360CVR25LR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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| MC68360VR25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
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| MC68376BACAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| MC68376BACAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| MC68376BAVAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
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| MC68376BAVAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 160QFP
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| MC68376BGCAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Description: IC MCU 32BIT ROMLESS 160QFP
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
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| MC68376BGCAB25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
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| MC68376BGMAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
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| MC68376BGVAB20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
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| MC68882CEI25A |
|
Виробник: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Part Status: Obsolete
Description: IC FLOATING-POINT CO-PROC 68PLCC
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Part Status: Obsolete
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| MC68882CEI33A |
|
Виробник: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
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| MC68882EI25A |
|
Виробник: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
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| MC68882EI33A |
|
Виробник: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
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| MC68882EI40A |
|
Виробник: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC FLOATING-POINT CO-PROC 68PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 68-PLCC (24.21x24.21)
Type: Floating-Point Co-Processor
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
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| MC68908GR16MFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Verified
Number of I/O: 21
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Verified
Number of I/O: 21
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MC68908GR16VFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
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| MC68908GZ8MFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Description: IC MCU 8BIT 8KB FLASH 32LQFP
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| MC68908GZ8VFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Description: IC MCU 8BIT 8KB FLASH 48LQFP
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| MC68EN360AI25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Description: IC MPU M683XX 25MHZ 240FQFP
на замовлення 32 шт:
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| MC68EN360AI25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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| MC68en360ai33l |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 33MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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| MC68EN360CVR25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
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| MC68EN360VR25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC68HC11A0CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| MC68HC11A1CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| MC68HC11D0CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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| MC68HC11E0CFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tray
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tray
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| MC68HC11E0CFNE2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
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| MC68HC11E0CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
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| MC68HC11E1CFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| MC68HC11E1CFNE2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| MC68HC11E1CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
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| MC68HC16Z1CAG25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Description: IC MCU 16BIT ROMLESS 144LQFP
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| MC68HC16Z1CEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Not For New Designs
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU16
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 16BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Not For New Designs
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU16
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
на замовлення 556 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3386.18 грн |
| 10+ | 2676.42 грн |
| 25+ | 2530.44 грн |
| 180+ | 2176.03 грн |
| MC68HC16Z1CEH25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Speed: 25MHz
Number of I/O: 16
Part Status: Not For New Designs
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU16
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 16BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Speed: 25MHz
Number of I/O: 16
Part Status: Not For New Designs
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU16
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
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| MC68HC705C8ACFNE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
DigiKey Programmable: Verified
Number of I/O: 24
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Description: IC MCU 8BIT 8KB OTP 44PLCC
DigiKey Programmable: Verified
Number of I/O: 24
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
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