Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36384) > Сторінка 35 з 607
| Фото | Назва | Виробник | Інформація |
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MC68HC705C9AVFNE | NXP USA Inc. |
 Description: IC MCU 8BIT 16KB OTP 44PLCCPackaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 16KB (16K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Not Verified |
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MC68HC711D3CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
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MC68HC711D3CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
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MC68HC711E9CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC68HC711E9CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Connectivity: SCI, SPI Package / Case: 52-LCC (J-Lead) Number of I/O: 38 Part Status: Obsolete Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 EEPROM Size: 512 x 8 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 12KB (12K x 8) Speed: 3MHz Mounting Type: Surface Mount Packaging: Tube DigiKey Programmable: Not Verified |
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MC68HC711E9MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC DigiKey Programmable: Not Verified Oscillator Type: Internal Number of I/O: 38 Part Status: Obsolete Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 EEPROM Size: 512 x 8 Program Memory Type: OTP Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512 x 8 Program Memory Size: 12KB (12K x 8) Speed: 2MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tube |
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MC68HC711E9VFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Number of I/O: 38 Part Status: Obsolete Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 EEPROM Size: 512 x 8 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512 x 8 Program Memory Size: 12KB (12K x 8) Speed: 2MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tube DigiKey Programmable: Not Verified |
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MC68HSC705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
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MC68HSR705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-DIP Number of I/O: 14 DigiKey Programmable: Not Verified |
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MC68LC302CAF16CT | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 100LQFP Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 100-LQFP (14x14) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
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MC68LK332ACEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16.78MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
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MC68LK332GCEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 132-PQFP (24.13x24.13) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16.78MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
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MC68MH360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Additional Interfaces: SCC, SMC, SPI Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
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MC68MH360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
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MC68MH360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Package / Case: 357-BBGA Packaging: Tray Operating Temperature: -40°C ~ 85°C (TA) Speed: 25MHz Mounting Type: Surface Mount Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ |
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MC68MH360VR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
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MC68MH360VR25LR2 | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tape & Reel (TR) |
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MC68MH360VR33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
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MC68MH360VR33LR2 | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tape & Reel (TR) |
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MC68SEC000AA10R2 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64QFP |
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В кошику од. на суму грн. | ||||||||||||||
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MC68SEC000AA20B1 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 64-QFP (14x14) Voltage - I/O: 3.3V, 5.0V Core Processor: EC000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tray |
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MC68SEC000AE10 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64LQFP Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 64-LQFP (10x10) Voltage - I/O: 3.3V, 5.0V Core Processor: EC000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 10MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
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MC68SEC000CAA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 64QFP Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 64-QFP (14x14) Voltage - I/O: 3.3V, 5.0V Core Processor: EC000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tray Part Status: Obsolete |
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MC68SEC000CAA20 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP |
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В кошику од. на суму грн. | ||||||||||||||
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MC705J1ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20SOIC DigiKey Programmable: Not Verified Number of I/O: 14 Part Status: Obsolete Supplier Device Package: 20-SOIC Peripherals: POR, WDT Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Core Processor: HC05 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64 x 8 Program Memory Size: 1.2KB (1.2K x 8) Speed: 4MHz Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube |
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MC705JP7CPE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 28-PDIP Number of I/O: 22 DigiKey Programmable: Not Verified |
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MC705P6ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4.5KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 4.5KB (4.5K x 8) RAM Size: 176 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SIO Peripherals: POR, WDT Supplier Device Package: 28-SOIC Part Status: Not For New Designs Number of I/O: 21 DigiKey Programmable: Verified |
на замовлення 1823 шт: термін постачання 21-31 дні (днів) |
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MC711K4CFUE3 | NXP USA Inc. |
Description: IC MCU 8BIT 24KB OTP 80QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908AZ60AMFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP DigiKey Programmable: Not Verified Number of I/O: 52 Part Status: Obsolete Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 15x8b Core Processor: HC08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 8.4MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tape & Reel (TR) |
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MC908AZ60AVFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP DigiKey Programmable: Not Verified Number of I/O: 52 Part Status: Obsolete Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 15x8b Core Processor: HC08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 8.4MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tape & Reel (TR) |
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В кошику од. на суму грн. | ||||||||||||||
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MC908GR16AMFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GR16AVFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
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В кошику од. на суму грн. | ||||||||||||||
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MC908GR32AMFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP DigiKey Programmable: Not Verified Number of I/O: 53 Part Status: Not For New Designs Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 24x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1.5K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tray |
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В кошику од. на суму грн. | ||||||||||||||
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MC908GR60AMFAE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
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MC908GR60AMFJE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
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MC908GR60AMFUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 53 DigiKey Programmable: Not Verified |
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MC908GR60AVFAE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||||
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MC908GR60AVFJE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GR60AVFUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GZ32MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 24x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1.5K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GZ32MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GZ32VFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GZ60VFJE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908JK1MDWE | NXP USA Inc. | Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908JK3CDWE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 20SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908JL3CPE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 28DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908KX8CDWER2 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC912D60ACFUE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 8x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 48 DigiKey Programmable: Not Verified |
на замовлення 319 шт: термін постачання 21-31 дні (днів) |
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MC912D60ACPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 68 Supplier Device Package: 112-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: CANbus, MI Bus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x8/10b Core Processor: CPU12 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MC912D60AMPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC912D60AVPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC912D60CCPVE | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5272VM66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC11F1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC11F1CFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC11F1CFNE4R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC705B16NCFNE | NXP USA Inc. |
Description: IC MCU 8BIT 15KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 15KB (15K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 256 x 8 Core Processor: HC05 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC705KJ1CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC705KJ1CPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-PDIP Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCHC711KS2CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC DigiKey Programmable: Not Verified Number of I/O: 51 Supplier Device Package: 68-PLCC (24.21x24.21) Peripherals: POR, PWM, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC11 EEPROM Size: 640 x 8 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 3MHz Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. |
| MC68HC705C9AVFNE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711D3CFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711D3CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711E9CFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711E9CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Connectivity: SCI, SPI
Package / Case: 52-LCC (J-Lead)
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 3MHz
Mounting Type: Surface Mount
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Connectivity: SCI, SPI
Package / Case: 52-LCC (J-Lead)
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 3MHz
Mounting Type: Surface Mount
Packaging: Tube
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711E9MFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
Description: IC MCU 8BIT 12KB OTP 52PLCC
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| MC68HC711E9VFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HSC705J1ACPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC68HSR705J1ACPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC68LC302CAF16CT |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| MC68LK332ACEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
на замовлення 122 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4276.23 грн |
| 10+ | 3402.85 грн |
| 25+ | 3224.28 грн |
| MC68LK332GCEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 132PQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 132-PQFP (24.13x24.13)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
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| MC68MH360AI25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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| MC68MH360AI25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 25MHZ 240FQFP
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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| MC68MH360CVR25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Package / Case: 357-BBGA
Packaging: Tray
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Description: IC MPU M683XX 25MHZ 357BGA
Package / Case: 357-BBGA
Packaging: Tray
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
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| MC68MH360VR25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC68MH360VR25LR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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| MC68MH360VR33L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC68MH360VR33LR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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| MC68SEC000AA10R2 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64QFP
Description: IC MPU M680X0 10MHZ 64QFP
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| MC68SEC000AA20B1 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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| MC68SEC000AE10 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64LQFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MPU M680X0 10MHZ 64LQFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| MC68SEC000CAA16 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Part Status: Obsolete
Description: IC MPU M680X0 16MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Part Status: Obsolete
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| MC68SEC000CAA20 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Description: IC MPU M680X0 20MHZ 64QFP
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| MC705J1ACDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Obsolete
Supplier Device Package: 20-SOIC
Peripherals: POR, WDT
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64 x 8
Program Memory Size: 1.2KB (1.2K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Obsolete
Supplier Device Package: 20-SOIC
Peripherals: POR, WDT
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64 x 8
Program Memory Size: 1.2KB (1.2K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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| MC705JP7CPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 22
DigiKey Programmable: Not Verified
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| MC705P6ACDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
на замовлення 1823 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 956.52 грн |
| 10+ | 725.44 грн |
| 26+ | 674.83 грн |
| 104+ | 583.50 грн |
| 260+ | 559.76 грн |
| 520+ | 545.46 грн |
| 1014+ | 525.31 грн |
| MC711K4CFUE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
Description: IC MCU 8BIT 24KB OTP 80QFP
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| MC908AZ60AMFUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
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| MC908AZ60AVFUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
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| MC908GR16AMFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
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| MC908GR16AVFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
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| MC908GR32AMFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Not For New Designs
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Not For New Designs
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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| MC908GR60AMFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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| MC908GR60AMFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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| MC908GR60AMFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| MC908GR60AVFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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| MC908GR60AVFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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| MC908GR60AVFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| MC908GZ32MFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| MC908GZ32MFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Description: IC MCU 8BIT 32KB FLASH 32LQFP
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| MC908GZ32VFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Description: IC MCU 8BIT 32KB FLASH 64QFP
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| MC908GZ60VFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Description: IC MCU 8BIT 60KB FLASH 32LQFP
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| MC908JK1MDWE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
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| MC908JK3CDWE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Description: IC MCU 8BIT 4KB FLASH 20SOIC
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| MC908JL3CPE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Description: IC MCU 8BIT 4KB FLASH 28DIP
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| MC908KX8CDWER2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
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| MC912D60ACFUE8 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
на замовлення 319 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3156.74 грн |
| 10+ | 2487.70 грн |
| 25+ | 2349.82 грн |
| 100+ | 2063.03 грн |
| MC912D60ACPVE8 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 60KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3083.16 грн |
| MC912D60AMPVE8 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MC912D60AVPVE8 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MC912D60CCPVE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MCF5272VM66R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
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| MCHC11F1CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
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| MCHC11F1CFNE4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
товару немає в наявності
В кошику
од. на суму грн.
| MCHC11F1CFNE4R |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
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В кошику
од. на суму грн.
| MCHC705B16NCFNE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| MCHC705KJ1CDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHC705KJ1CPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHC711KS2CFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 68-PLCC (24.21x24.21)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 640 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC MCU 8BIT 32KB OTP 68PLCC
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 68-PLCC (24.21x24.21)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 640 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
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