Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35296) > Сторінка 404 з 589
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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MC908AP32CFAE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
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PCA85276ATT/AJ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 56TSSOPPackaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Part Status: Obsolete Current - Supply: 6 µA |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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| PCA8561AHN/A518 | NXP USA Inc. |
Description: AUTOMOTIVE 18 X 4 LCD SEGMENT DR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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PCA8565TS/1 | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 8-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| CBT3306PW/S400118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
на замовлення 124665 шт: термін постачання 21-31 дні (днів) |
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CBT3306D-Q100J | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 8-SOIC |
на замовлення 2294 шт: термін постачання 21-31 дні (днів) |
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| SL2S6002FUD/BGZ | NXP USA Inc. | Description: IC RFID TRANSP 13.56MHZ WAFER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BAS116QA147 | NXP USA Inc. |
Description: NOW NEXPERIA BAS116QA - RECTIFIEPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 3 µs Technology: Standard Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 300mA Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: -55°C ~ 150°C Grade: Automotive Part Status: Active Voltage - DC Reverse (Vr) (Max): 75 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 5 nA @ 75 V Qualification: AEC-Q101 |
на замовлення 329700 шт: термін постачання 21-31 дні (днів) |
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NX3L4051HR-Q100115 | NXP USA Inc. |
Description: DIFFERENTIAL MULTIPLEXERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX3L4051HR-Q100X | NXP USA Inc. |
Description: IC MUX 8:1 750MOHM 16HXQFNPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 15MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Multiplexer/Demultiplexer Circuit: 8:1 Channel-to-Channel Matching (ΔRon): 70mOhm Switch Time (Ton, Toff) (Max): 45ns, 25ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Grade: Automotive Part Status: Obsolete Number of Circuits: 1 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX3L4051HRZ | NXP USA Inc. |
Description: IC MUX 8:1 900MOHM 16HXQFNPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 900mOhm -3db Bandwidth: 15MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Multiplexer/Demultiplexer Circuit: 8:1 Channel-to-Channel Matching (ΔRon): 70mOhm Switch Time (Ton, Toff) (Max): 45ns, 25ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PESD5V0G1BL315 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BUK7E2R7-30B,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 75A I2PAKPackaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V |
на замовлення 973 шт: термін постачання 21-31 дні (днів) |
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74ABT657D,623 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 24SOPackaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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MPC561MZP56R2518 | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32 BIT, POWPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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KMZ49/AJ | NXP USA Inc. |
Description: SENSOR ANGLE 45DEG 8SOIC SMDPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Wheatstone Bridge Operating Temperature: -40°C ~ 180°C Termination Style: Gull Wing Voltage - Supply: 9V Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 8-SO Rotation Angle - Electrical, Mechanical: 0° ~ 45° Resistance: 3.7 kOhms |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NCR401U115 | NXP USA Inc. |
Description: LED DRIVER, 1-SEGMENT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NCR401T215 | NXP USA Inc. |
Description: NCR401T LED DRIVER, TO-236AB |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMCM4401VPE084 | NXP USA Inc. |
Description: PMCM4401 SMALL SIGNAL FET |
на замовлення 279000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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BUK664R8-75C,118 | NXP USA Inc. |
Description: MOSFET N-CH 75V 120A D2PAK |
на замовлення 4672 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
| MF1SPLUS1031DA4/0J | NXP USA Inc. |
Description: MF1SPLUS1031DA4/0J Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MF1SPLUS1031DA8/0J | NXP USA Inc. |
Description: MF1SPLUS1031DA8/0J Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MF1SPLUS1031DUD/0V | NXP USA Inc. |
Description: MF1SPLUS1031DUD/0V Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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74AUP1G132GF132 | NXP USA Inc. |
Description: IC GATE NAND 1CH 2IN 6XSONFeatures: Schmitt Trigger Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 0.6V ~ 2.29V Input Logic Level - Low: 0.1V ~ 0.88V Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
на замовлення 139950 шт: термін постачання 21-31 дні (днів) |
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TDA8350Q/N6,112 | NXP USA Inc. |
Description: IC DC COUPLED V-DEFL 13PDBSPackaging: Tube Package / Case: 13-SIP Formed Leads Mounting Type: Through Hole Supplier Device Package: 13-PDBS Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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AFSC5G35D35T2 | NXP USA Inc. |
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFNPackaging: Cut Tape (CT) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz RF Type: 5G, LTE Voltage - Supply: 0V ~ 32V Gain: 26.1dB Supplier Device Package: 26-HLQFN (10x6) |
на замовлення 1451 шт: термін постачання 21-31 дні (днів) |
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NTS0302JKZ | NXP USA Inc. |
Description: IC VOLT TRANSLATOR X2SON8Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Mounting Type: Surface Mount Number of Bits: 2 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 8-X2SON (1.4x1) Part Status: Active |
на замовлення 5469 шт: термін постачання 21-31 дні (днів) |
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BC517,112 | NXP USA Inc. |
Description: TRANS NPN DARL 30V 0.5A TO-92-3Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: NPN - Darlington Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V Frequency - Transition: 220MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 625 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308TT/N2,118 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 80MW 8TSSOPFeatures: Depop, Short-Circuit Protection Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-TSSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308AUK,027 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 80MW 8WLCSPFeatures: Depop, Short-Circuit Protection Packaging: Tape & Reel (TR) Package / Case: 8-XFBGA, WLCSP Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-WLCSP (0.61x0.84) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308T/N2,115 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOFeatures: Depop, Short-Circuit Protection Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308T/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOFeatures: Depop, Short-Circuit Protection Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308AT/N2,115 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOFeatures: Depop, Short-Circuit Protection Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308T/N1,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOFeatures: Depop, Short-Circuit Protection Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308AT/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOFeatures: Depop, Short-Circuit Protection Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1308/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8DIP Features: Depop, Short-Circuit Protection Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-DIP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MIMXRT106FDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 235 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1061CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 614 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1061CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 179 шт: термін постачання 21-31 дні (днів) |
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MIMXRT106SDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 960 шт: термін постачання 21-31 дні (днів) |
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MIMXRT106FCVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 3856 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1064CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196LFBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 201 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1061DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 364 шт: термін постачання 21-31 дні (днів) |
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PCA9665APW118 | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCA9665APW | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PCA9665PW | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA8225KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±250g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA8205KEG | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA8205KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| A7001CMHN1/T1AGB39 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| A7002CMHN1/T1AGB39 | NXP USA Inc. | Description: SECURE AUTHENTICATION MICROCONTR |
на замовлення 1098 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
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BZX84-B22/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk |
на замовлення 114000 шт: термін постачання 21-31 дні (днів) |
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BFS540,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SC-70Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz Supplier Device Package: SC-70 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BFS540,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SC-70Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz Supplier Device Package: SC-70 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PMXB120EPE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
на замовлення 648598 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
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PMXB75UPE147 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
на замовлення 4088434 шт: термін постачання 21-31 дні (днів) |
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PMXB75UPE/M5147 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
на замовлення 45000 шт: термін постачання 21-31 дні (днів) |
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PMZB200UNE315 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFETPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Supplier Device Package: DFN1006B-3 |
на замовлення 156850 шт: термін постачання 21-31 дні (днів) |
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| PMXB56EN147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
| BF904215 | NXP USA Inc. |
Description: RF SMALL SIGNAL FIELD-EFFECT TRA Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| MC908AP32CFAE-NXP |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| PCA85276ATT/AJ |
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Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 6 µA
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 6 µA
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 137.96 грн |
| 10+ | 98.16 грн |
| 25+ | 89.41 грн |
| PCA8561AHN/A518 |
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Виробник: NXP USA Inc.
Description: AUTOMOTIVE 18 X 4 LCD SEGMENT DR
Description: AUTOMOTIVE 18 X 4 LCD SEGMENT DR
товару немає в наявності
В кошику
од. на суму грн.
| PCA8565TS/1 |
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Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8-TSSOP
Description: IC RTC CLK/CALENDAR I2C 8-TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| CBT3306PW/S400118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
на замовлення 124665 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2623+ | 8.48 грн |
| CBT3306D-Q100J |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SOIC
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SOIC
на замовлення 2294 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2294+ | 11.07 грн |
| SL2S6002FUD/BGZ |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Description: IC RFID TRANSP 13.56MHZ WAFER
товару немає в наявності
В кошику
од. на суму грн.
| BAS116QA147 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAS116QA - RECTIFIE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: -55°C ~ 150°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Qualification: AEC-Q101
Description: NOW NEXPERIA BAS116QA - RECTIFIE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: -55°C ~ 150°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Qualification: AEC-Q101
на замовлення 329700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9746+ | 2.26 грн |
| NX3L4051HR-Q100X |
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Виробник: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| NX3L4051HRZ |
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Виробник: NXP USA Inc.
Description: IC MUX 8:1 900MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC MUX 8:1 900MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| BUK7E2R7-30B,127 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
на замовлення 973 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 201+ | 115.55 грн |
| 74ABT657D,623 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 452+ | 52.19 грн |
| MPC561MZP56R2518 |
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Виробник: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, POW
Packaging: Bulk
Part Status: Active
Description: RISC MICROPROCESSOR, 32 BIT, POW
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| KMZ49/AJ |
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Виробник: NXP USA Inc.
Description: SENSOR ANGLE 45DEG 8SOIC SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 180°C
Termination Style: Gull Wing
Voltage - Supply: 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Resistance: 3.7 kOhms
Description: SENSOR ANGLE 45DEG 8SOIC SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 180°C
Termination Style: Gull Wing
Voltage - Supply: 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Resistance: 3.7 kOhms
товару немає в наявності
В кошику
од. на суму грн.
| NCR401U115 |
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Виробник: NXP USA Inc.
Description: LED DRIVER, 1-SEGMENT
Description: LED DRIVER, 1-SEGMENT
товару немає в наявності
В кошику
од. на суму грн.
| NCR401T215 |
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Виробник: NXP USA Inc.
Description: NCR401T LED DRIVER, TO-236AB
Description: NCR401T LED DRIVER, TO-236AB
товару немає в наявності
В кошику
од. на суму грн.
| PMCM4401VPE084 |
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Виробник: NXP USA Inc.
Description: PMCM4401 SMALL SIGNAL FET
Description: PMCM4401 SMALL SIGNAL FET
на замовлення 279000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BUK664R8-75C,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 120A D2PAK
Description: MOSFET N-CH 75V 120A D2PAK
на замовлення 4672 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 74AUP1G132GF132 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 139950 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2533+ | 9.91 грн |
| TDA8350Q/N6,112 |
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Виробник: NXP USA Inc.
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| AFSC5G35D35T2 |
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Виробник: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
на замовлення 1451 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3144.93 грн |
| 10+ | 2468.98 грн |
| 25+ | 2329.18 грн |
| 100+ | 2041.78 грн |
| 250+ | 1973.12 грн |
| NTS0302JKZ |
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Виробник: NXP USA Inc.
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
на замовлення 5469 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 52.04 грн |
| 10+ | 35.80 грн |
| 25+ | 32.14 грн |
| 100+ | 26.42 грн |
| 250+ | 24.64 грн |
| 500+ | 23.56 грн |
| 1000+ | 22.88 грн |
| BC517,112 |
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Виробник: NXP USA Inc.
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
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| TDA1308TT/N2,118 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
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| TDA1308AUK,027 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
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| TDA1308T/N2,115 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
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| TDA1308T/N2,112 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
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| TDA1308AT/N2,115 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
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| TDA1308T/N1,112 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
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| TDA1308AT/N2,112 |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
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| TDA1308/N2,112 |
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
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| MIMXRT106FDVL6B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 235 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1064.83 грн |
| 10+ | 741.00 грн |
| 25+ | 667.87 грн |
| 80+ | 620.60 грн |
| MIMXRT1061CVL5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 614 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 752.57 грн |
| 10+ | 589.06 грн |
| MIMXRT1061CVJ5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 179 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1173.05 грн |
| 10+ | 892.86 грн |
| 25+ | 833.71 грн |
| MIMXRT106SDVL6B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 960 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1071.44 грн |
| 10+ | 734.80 грн |
| 25+ | 658.32 грн |
| 80+ | 548.60 грн |
| 240+ | 500.32 грн |
| 480+ | 476.42 грн |
| 960+ | 457.23 грн |
| MIMXRT106FCVL5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 3856 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1060.70 грн |
| 10+ | 811.40 грн |
| 25+ | 758.97 грн |
| 240+ | 697.62 грн |
| MIMXRT1064CVJ5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 201 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1160.66 грн |
| 10+ | 886.18 грн |
| 25+ | 828.40 грн |
| 189+ | 697.28 грн |
| MIMXRT1061DVL6B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 992.96 грн |
| 10+ | 751.98 грн |
| 25+ | 700.80 грн |
| 80+ | 612.10 грн |
| 240+ | 580.77 грн |
| MMA8225KEGR2 |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
товару немає в наявності
В кошику
од. на суму грн.
| MMA8205KEG |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MMA8205KEGR2 |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| A7001CMHN1/T1AGB39 |
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Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
товару немає в наявності
В кошику
од. на суму грн.
| A7002CMHN1/T1AGB39 |
Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
на замовлення 1098 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BZX84-B22/DG/B3215 |
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на замовлення 114000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15000+ | 1.57 грн |
| BFS540,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
товару немає в наявності
В кошику
од. на суму грн.
| BFS540,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
товару немає в наявності
В кошику
од. на суму грн.
| PMXB120EPE147 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
на замовлення 648598 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PMXB75UPE147 |
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Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
на замовлення 4088434 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4729+ | 4.53 грн |
| PMXB75UPE/M5147 |
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Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
на замовлення 45000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3328+ | 6.80 грн |
| PMZB200UNE315 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
на замовлення 156850 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4522+ | 5.47 грн |
| PMXB56EN147 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BF904215 |
Виробник: NXP USA Inc.
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
































