Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36847) > Сторінка 423 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
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| 74AHCT2G126DP-Q100125 | NXP USA Inc. |
Description: BUS DRIVERPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SC16C554DBIA68512 | NXP USA Inc. | Description: IC UART QUAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SPC5675KFF0VJM2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SPC5675KFF0VJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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BUK661R8-30C,118 | NXP USA Inc. |
Description: MOSFET N-CH 30V 120A D2PAKInput Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±16V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Active Supplier Device Package: D2PAK Vgs(th) (Max) @ Id: 2.8V @ 1mA Power Dissipation (Max): 263W (Tc) Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Packaging: Bulk |
на замовлення 1473 шт: термін постачання 21-31 дні (днів) |
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BUK764R2-80E,118 | NXP USA Inc. |
Description: MOSFET N-CH 80V 120A D2PAK |
на замовлення 338 шт: термін постачання 21-31 дні (днів) |
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S912XEP100BVALR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||||
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MC9S12DJ128CFUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, FLASH, |
на замовлення 240 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | ||||||||||||||||
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QN9020/D518 | NXP USA Inc. |
Description: ULTRA LOW POWER BLUETOOTH LE SYS |
на замовлення 44903 шт: термін постачання 21-31 дні (днів) |
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| QN9020DK | NXP USA Inc. |
Description: QN9020 DEVELOPMENT KIT Packaging: Bulk For Use With/Related Products: QN902x Frequency: 2.4GHz Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) Supplied Contents: Board(s) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| QN9020DKUL | NXP USA Inc. |
Description: QN9020 DEVELOPMENT KIT Packaging: Bulk For Use With/Related Products: QN902x Frequency: 2.4GHz Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) Contents: Board(s) Utilized IC / Part: QN902x Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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QN9020/EY | NXP USA Inc. |
Description: ULTRA LOW POWER BLUETOOTH LE SYS |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | ||||||||||||||||
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QN9020/DY | NXP USA Inc. |
Description: IC RF TXRX BLE 48HVQFNPackaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 48-HVQFN (6x6) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PCA8575D,118 | NXP USA Inc. |
Description: REMOTE 16-BIT I/O EXPANDER FOR IFeatures: POR Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| TEA19051BAMTK/1J | NXP USA Inc. |
Description: SMARTCHARG PROTOC CONTR QC4Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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| SPC5746CSK1MMJ6,557 | NXP USA Inc. |
Description: MPC574XP MICROCONTROLLER POWER A Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Number of I/O: 178 Part Status: Active Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5744PFK1AMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||||
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BZB84-C3V9215 | NXP USA Inc. |
Description: NOW NEXPERIA ZENER DIODE, 3.9V,Power - Max: 300 mW Grade: Automotive Supplier Device Package: TO-236AB Impedance (Max) (Zzt): 90 Ohms Voltage - Zener (Nom) (Vz): 3.9 V Operating Temperature: 150°C (TJ) Configuration: 1 Pair Common Anode Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Bulk Qualification: AEC-Q101 Current - Reverse Leakage @ Vr: 3 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA |
на замовлення 39472 шт: термін постачання 21-31 дні (днів) |
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BZX84-C30/LF1R | NXP USA Inc. |
Description: DIODE ZENER 30V 250MW TO236ABTolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 30 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S908AZ60AH3CFUE | NXP USA Inc. | Description: IC MCU 8BIT 60KB FLASH 64QFP |
на замовлення 452 шт: термін постачання 21-31 дні (днів) |
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S908EY16AE0CFJER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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S908EY16AE0CFJER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFPPackaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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G1120B0MIPI | NXP USA Inc. |
Description: LCD 1.2" MIPI 390X390Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-M33 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT595 Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| FRDM-K32W042 | NXP USA Inc. |
Description: EVAL BOARD FOR K32W042 Packaging: Bulk Function: USB Type: Interface Contents: Board(s) Utilized IC / Part: K32W042 Supplied Contents: Board(s) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MPC574XG324DSC2 | NXP USA Inc. | Description: MPC574XB/C/G EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74HCT244BQ-Q100 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 20DHVQFNPackaging: Bulk Package / Case: 20-VFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-DHVQFN (4.5x2.5) Part Status: Active |
на замовлення 2971 шт: термін постачання 21-31 дні (днів) |
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PCAL6408A-ARD | NXP USA Inc. |
Description: 8-BIT GPIO EXPAND EVAL BOARDPackaging: Box Function: GPIO Type: Interface Contents: Board(s) Utilized IC / Part: PCAL6408A Platform: Arduino Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PCAL6416AEV-ARD | NXP USA Inc. |
Description: 16-BIT GPIO EXPAND EVAL BOARDPackaging: Box Function: GPIO Type: Interface Contents: Board(s) Utilized IC / Part: PCAL6416A Platform: Arduino Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| BZB84-C51,215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C51 - ZENER DCurrent - Reverse Leakage @ Vr: 50 nA @ 35.7 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 300 mW Part Status: Active Supplier Device Package: TO-236AB Impedance (Max) (Zzt): 180 Ohms Voltage - Zener (Nom) (Vz): 51 V Configuration: 1 Pair Common Anode Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PUMB19,115 | NXP USA Inc. |
Description: NOW NEXPERIA PUMB19 - SMALL SIGN |
товару немає в наявності |
Мінімальне замовлення: 2850 шт В кошику од. на суму грн. | ||||||||||||||||
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N74F534D,623 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SOClock Frequency: 165 MHz Trigger Type: Positive Edge Current - Output High, Low: 3mA, 24mA Current - Quiescent (Iq): 86 mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Inverted Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk Number of Bits per Element: 8 Part Status: Obsolete Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF Supplier Device Package: 20-SO |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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N74F109D,623 | NXP USA Inc. |
Description: IC FF JK TYPE DUAL 1BIT 16SONumber of Bits per Element: 1 Part Status: Obsolete Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF Supplier Device Package: 16-SO Clock Frequency: 125 MHz Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Current - Quiescent (Iq): 17 mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Type: JK Type Function: Set(Preset) and Reset Number of Elements: 2 Mounting Type: Surface Mount Output Type: Complementary Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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N74F10D,602 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14SONumber of Circuits: 3 Part Status: Obsolete Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-SO Number of Inputs: 3 Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
на замовлення 9686 шт: термін постачання 21-31 дні (днів) |
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MC56F83789AVLLA | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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| OMPCA9959LEDEV | NXP USA Inc. |
Description: EVAL BOARD FOR PCA9959 Part Status: Active Outputs and Type: 24 Non-Isolated Outputs Supplied Contents: Board(s) Utilized IC / Part: PCA9959 Current - Output / Channel: 63mA Voltage - Input: 2.7V ~ 5.5V Voltage - Output: 5.5V Features: Dimmable Packaging: Bulk Contents: Board(s) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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S9S08QD2J1VSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOICDigiKey Programmable: Not Verified Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128 x 8 Program Memory Size: 2KB (2K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
| MF3DH2200DU75/02V | NXP USA Inc. | Description: MIFARE SMART CARD DESFIRE EV2 XL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| PHPT610035NK115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PTN38003AEWY | NXP USA Inc. |
Description: IC USB-C 3.2 / DP1.4 REDRIVER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1441AT/0Z | NXP USA Inc. |
Description: IC TXRX 8-SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 8174 шт: термін постачання 21-31 дні (днів) |
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| MK28FN2M0CAU15R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 210WLCSPData Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1M x 8 Program Memory Size: 2MB (2M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 210-UFBGA, WLCSP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 120 Part Status: Active Supplier Device Package: 210-WLCSP (6.94x6.94) Peripherals: DMA, I2S, PWM, WDT Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |||||||||||||||||
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BZX84-C4V7/LF1R | NXP USA Inc. |
Description: DIODE ZENER 4.7V 250MW SOT23Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V Grade: Automotive Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BZX84-C4V7/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 4.7V 250MW SOT23Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V Grade: Automotive Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PEMI1QFN/LT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/23PF SMDNumber of Channels: 1 ESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 23dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 23pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Package / Case: SC-101, SOT-883 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PEMI1QFN/LT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/23PF SMDESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 23dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 23pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Package / Case: SC-101, SOT-883 Packaging: Bulk Number of Channels: 1 |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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LPC4325JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 768KB (768K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC4322JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTM88H065T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTM88H065T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) Part Status: Obsolete |
на замовлення 1847 шт: термін постачання 21-31 дні (днів) |
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SPC5603BAMLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||
| S9S12P64J0MFTR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 10x12b Core Processor: CPU12V1 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
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MPC8314EVRAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 620HBGAPackaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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S912XEG384BMAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||||
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FS32K142MAT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 58 Part Status: Obsolete Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5746CHK1AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||||
| SAF3560EL/V1100Y | NXP USA Inc. | Description: IC DGTL HD RADIO PROCESSOR 170LB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MRFE6VP6600NR3,528 | NXP USA Inc. |
Description: WIDEBAND RF POWER LDMOS TRANSIST |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||||||||||||||||
| BUK9K89-100E115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9K89-100E - POWEPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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K32W041AZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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K32W041AZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1890 шт: термін постачання 21-31 дні (днів) |
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| SC16C554DBIA68512 |
Виробник: NXP USA Inc.
Description: IC UART QUAD
Description: IC UART QUAD
товару немає в наявності
В кошику
од. на суму грн.
| SPC5675KFF0VJM2R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
товару немає в наявності
В кошику
од. на суму грн.
| SPC5675KFF0VJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| BUK661R8-30C,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 263W (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Description: MOSFET N-CH 30V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 263W (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
на замовлення 1473 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 245+ | 97.31 грн |
| BUK764R2-80E,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 80V 120A D2PAK
Description: MOSFET N-CH 80V 120A D2PAK
на замовлення 338 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 202+ | 113.70 грн |
| S912XEP100BVALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| MC9S12DJ128CFUE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Description: MICROCONTROLLER, 16-BIT, FLASH,
на замовлення 240 шт:
термін постачання 21-31 дні (днів)
| QN9020/D518 |
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Виробник: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Description: ULTRA LOW POWER BLUETOOTH LE SYS
на замовлення 44903 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 105+ | 212.54 грн |
| QN9020DK |
Виробник: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| QN9020DKUL |
Виробник: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
| QN9020/EY |
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Виробник: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Description: ULTRA LOW POWER BLUETOOTH LE SYS
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| QN9020/DY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| PCA8575D,118 |
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Виробник: NXP USA Inc.
Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| TEA19051BAMTK/1J |
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Виробник: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 190+ | 106.02 грн |
| SPC5746CSK1MMJ6,557 |
Виробник: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
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| SPC5744PFK1AMLQ8 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 300 шт
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| BZB84-C3V9215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
на замовлення 39472 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 11632+ | 2.16 грн |
| BZX84-C30/LF1R |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
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| S908AZ60AH3CFUE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Description: IC MCU 8BIT 60KB FLASH 64QFP
на замовлення 452 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1382.38 грн |
| S908EY16AE0CFJER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 2000 шт
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| S908EY16AE0CFJER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 47+ | 444.48 грн |
| G1120B0MIPI |
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Виробник: NXP USA Inc.
Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6766.02 грн |
| FRDM-K32W042 |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
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| MPC574XG324DSC2 |
Виробник: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Description: MPC574XB/C/G EVAL BRD
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| 74HCT244BQ-Q100 |
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Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
на замовлення 2971 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1282+ | 16.76 грн |
| PCAL6408A-ARD |
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Виробник: NXP USA Inc.
Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9084.92 грн |
| PCAL6416AEV-ARD |
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Виробник: NXP USA Inc.
Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
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| BZB84-C51,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
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| PUMB19,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PUMB19 - SMALL SIGN
Description: NOW NEXPERIA PUMB19 - SMALL SIGN
товару немає в наявності
Мінімальне замовлення: 2850 шт
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| N74F534D,623 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1031+ | 21.46 грн |
| N74F109D,623 |
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Виробник: NXP USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2049+ | 11.11 грн |
| N74F10D,602 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
на замовлення 9686 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2623+ | 8.14 грн |
| MC56F83789AVLLA |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1726.32 грн |
| 10+ | 1328.08 грн |
| OMPCA9959LEDEV |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 50726.19 грн |
| S9S08QD2J1VSCR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
товару немає в наявності
Мінімальне замовлення: 2500 шт
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| MF3DH2200DU75/02V |
Виробник: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Description: MIFARE SMART CARD DESFIRE EV2 XL
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| PHPT610035NK115 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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| PTN38003AEWY |
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Виробник: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
Description: IC USB-C 3.2 / DP1.4 REDRIVER
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| TJA1441AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 8174 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 129.75 грн |
| 10+ | 91.73 грн |
| 25+ | 83.47 грн |
| 100+ | 69.81 грн |
| 250+ | 65.75 грн |
| 500+ | 63.31 грн |
| 1000+ | 62.21 грн |
| MK28FN2M0CAU15R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
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Мінімальне замовлення: 3000 шт
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| BZX84-C4V7/LF1R |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
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| BZX84-C4V7/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
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| PEMI1QFN/LT,315 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
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| PEMI1QFN/LT,315 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3806+ | 6.33 грн |
| LPC4325JBD144551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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| LPC4322JBD144551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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| NTM88H065T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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| NTM88H065T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
на замовлення 1847 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 660.62 грн |
| 5+ | 561.64 грн |
| 10+ | 496.05 грн |
| 25+ | 377.68 грн |
| 50+ | 333.78 грн |
| 100+ | 324.99 грн |
| 500+ | 267.83 грн |
| 1000+ | 250.55 грн |
| SPC5603BAMLL4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 1000 шт
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| S9S12P64J0MFTR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
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| MPC8314EVRAFDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 4634.24 грн |
| S912XEG384BMAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 300 шт
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| FS32K142MAT0MLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 800 шт
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| SPC5746CHK1AVKU6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
товару немає в наявності
Мінімальне замовлення: 200 шт
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| SAF3560EL/V1100Y |
Виробник: NXP USA Inc.
Description: IC DGTL HD RADIO PROCESSOR 170LB
Description: IC DGTL HD RADIO PROCESSOR 170LB
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| MRFE6VP6600NR3,528 |
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Виробник: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Description: WIDEBAND RF POWER LDMOS TRANSIST
товару немає в наявності
Мінімальне замовлення: 3 шт
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| K32W041AZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 308.31 грн |
| K32W041AZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1890 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 463.62 грн |
| 10+ | 386.87 грн |
| 25+ | 366.09 грн |
| 100+ | 316.74 грн |
| 250+ | 300.66 грн |
| 500+ | 289.31 грн |


































