Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 424 з 589
| Фото | Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||
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| 74HC259PW112 | NXP USA Inc. |  Description: NOW NEXPERIA 74HC259PW - D LATCH | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | PEMI4QFN/HK,132 | NXP USA Inc. |  Description: FILTER RC(PI) 45 OHM/13.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 13dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 | на замовлення 28000 шт:термін постачання 21-31 дні (днів) | 
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|   | ASC8851AETE | NXP USA Inc. |  Description: IC VIDEO PROCESSOR ADV 484TFBGA Packaging: Tray Package / Case: 484-TFBGA Mounting Type: Surface Mount Interface: EBI/EMI, Ethernet, I²S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9® Supplier Device Package: 484-TFBGA (15x15) Part Status: Obsolete DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | EM773FHN33,551 | NXP USA Inc. |  Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Obsolete Number of I/O: 25 DigiKey Programmable: Not Verified | на замовлення 5344 шт:термін постачання 21-31 дні (днів) | 
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|   | MMA3202KEG | NXP USA Inc. |  Description: ACCEL 112.5G/56.3G ANALOG 20SOIC | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| NTSX2102GU8125 | NXP USA Inc. |  Description: DUAL SUPPLY TRANSLATING TRANSCEI | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | 74HC132PW/S400118 | NXP USA Inc. |  Description: IC GATE NAND 4CH 2-INP 14TSSOP Features: Schmitt Trigger Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF Part Status: Active Number of Circuits: 4 Current - Quiescent (Max): 2 µA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BAP70-04W,115 | NXP USA Inc. |  Description: RF DIODE PIN 50V 260MW SC-70 Packaging: Bulk Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SC-70 Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 260 mW | на замовлення 586000 шт:термін постачання 21-31 дні (днів) | 
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|   | BAP70AM,115 | NXP USA Inc. |  Description: RF DIODE PIN 50V 300MW 6TSSOP | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BAP51LX,315 | NXP USA Inc. |  Description: RF DIODE PIN 60V 140MW SOD2 Packaging: Cut Tape (CT) Package / Case: 2-XDFN Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: DFN1006D-2 Current - Max: 100 mA Power Dissipation (Max): 140 mW | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MRF8P20165WHSR5 | NXP USA Inc. |  Description: FET RF 2CH 65V 2.01GHZ NI780S4 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MRF8P20165WHSR5 | NXP USA Inc. |  Description: FET RF 2CH 65V 2.01GHZ NI780S4 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BAT54CM315 | NXP USA Inc. |  Description: NOW NEXPERIA BAT54C - RECTIFIER Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: SOT-883 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | PEMI2STD/CP,115 | NXP USA Inc. |  Description: FILTER RC(PI) 20 OHM/18.5PF SMD | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | MRF6VP2600HR5 | NXP USA Inc. |  Description: RF MOSFET LDMOS 50V NI1230 Packaging: Bulk Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 125W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 2.6 A | на замовлення 414 шт:термін постачання 21-31 дні (днів) | 
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|  | 74HC3GU04DC,125 | NXP USA Inc. |  Description: IC INVERTER 3CH 3-INP 8VSSOP | на замовлення 2780 шт:термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| LX2162RC82029B | NXP USA Inc. | Description: IC MPU QORIQ LX 2GHZ 1150FBGA Packaging: Tray Package / Case: 1150-FBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: 5°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1150-FBGA (23x23) USB: USB 3.0 (1) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4, SDRAM Graphics Acceleration: No SATA: SATA 6Gbps (4) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | S9S08SG8E2CTJR | NXP USA Inc. |  Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified | на замовлення 5265 шт:термін постачання 21-31 дні (днів) | 
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| JN516X-EK005-120VZ | NXP USA Inc. |  Description: DEMO BOARD WIRELESS MCU | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| JN516X-EK005-230VZ | NXP USA Inc. |  Description: DEMO BOARD WIRELESS MCU | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| JN516X-EK006-120VZ | NXP USA Inc. |  Description: DEMO BOARD WIRELESS MCU | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| JN516X-EK006-230VZ | NXP USA Inc. |  Description: DEMO BOARD WIRELESS MCU | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| JN516X-UG001Z | NXP USA Inc. | Description: UPGRADE KIT JN516X | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | PMN34LN,135 | NXP USA Inc. |  Description: MOSFET N-CH 20V 5.7A 6TSOP Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc) Rds On (Max) @ Id, Vgs: 34mOhm @ 2.5A, 10V Power Dissipation (Max): 1.75W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SC-74 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±15V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 20 V | на замовлення 10173 шт:термін постачання 21-31 дні (днів) | 
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|   | PMN55LN,135 | NXP USA Inc. |  Description: MOSFET N-CH 20V 4.1A 6TSOP | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| FXPS7400DS4T1 | NXP USA Inc. |  Description: 20-400 KPA BAP DIG SPI | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | LPC1785FBD208,551 | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 165 DigiKey Programmable: Not Verified | на замовлення 8761 шт:термін постачання 21-31 дні (днів) | 
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|   | LPC1785FBD208557 | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 208LQFP | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | LPC2470FBD208,551 | NXP USA Inc. |  Description: IC MCU 16/32BIT ROMLESS 208LQFP Packaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 98K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 160 DigiKey Programmable: Not Verified | на замовлення 15810 шт:термін постачання 21-31 дні (днів) | 
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|   | LPC2939FBD208551 | NXP USA Inc. |  Description: IC MCU 16/32B 768KB FLSH 208LQFP Packaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 768KB (768K x 8) RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM9® Data Converters: A/D 24x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | LPC54607J256BD208551 | NXP USA Inc. |  Description: IC MCU 32BIT 256KB FLASH 208LQFP | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|  | LX2160SN71826B | NXP USA Inc. | Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BZX84-C18/LF1R | NXP USA Inc. |  Description: DIODE ZENER 18V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 18 V Impedance (Max) (Zzt): 45 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V Grade: Automotive Qualification: AEC-Q101 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BZX84-C18/LF1VL | NXP USA Inc. |  Description: DIODE ZENER 18V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 18 V Impedance (Max) (Zzt): 45 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V Grade: Automotive Qualification: AEC-Q101 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | 74ALVCH16374DL,118 | NXP USA Inc. |  Description: IC FF D-TYPE DUAL 8BIT 48SSOP | на замовлення 1000 шт:термін постачання 21-31 дні (днів) | 
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|   | 74ALVC574D,112 | NXP USA Inc. |  Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 10 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 8 | на замовлення 2790 шт:термін постачання 21-31 дні (днів) | 
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|   | NX3L1T53GT,115 | NXP USA Inc. |  Description: IC SWITCH SPDT X 1 750MOHM 8XSON Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Active Number of Circuits: 1 | на замовлення 579 шт:термін постачання 21-31 дні (днів) | 
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|   | NX3V1G66GM,132 | NXP USA Inc. |  Description: IC SW SPST-NOX1 450MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 24ns, 9ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | NX3V1G384GM,132 | NXP USA Inc. |  Description: IC SW SPST-NCX1 450MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 26ns, 10ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | NX3V1G384GM,132 | NXP USA Inc. |  Description: IC SW SPST-NCX1 450MOHM 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 26ns, 10ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 | на замовлення 5000 шт:термін постачання 21-31 дні (днів) | 
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|   | NX3V1G384GM,115 | NXP USA Inc. |  Description: IC SW SPST-NCX1 450MOHM 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 26ns, 10ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 | на замовлення 9299 шт:термін постачання 21-31 дні (днів) | 
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|   | NX3V1G66GM,115 | NXP USA Inc. |  Description: IC SW SPST-NOX1 450MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 24ns, 9ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 1 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | 74AUP1T45GS,132 | NXP USA Inc. |  Description: IC TXRX NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.1V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON, SOT1202 (1x1) Part Status: Active | на замовлення 102450 шт:термін постачання 21-31 дні (днів) | 
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|   | 74HC574PW-Q100118 | NXP USA Inc. |  Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 7.8mA, 7.8mA Trigger Type: Positive Edge Clock Frequency: 133 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Part Status: Active Number of Bits per Element: 8 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | FS32K148HAT0MLQT | NXP USA Inc. |  Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BZX84-C4V3/LF1VL | NXP USA Inc. |  Description: DIODE ZENER 4.3V 250MW TO236AB | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | BZX84-C4V3/LF1R | NXP USA Inc. |  Description: DIODE ZENER 4.3V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.3 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 1 V Grade: Automotive Qualification: AEC-Q101 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
|   | XC68C812A4PVE5-NXP | NXP USA Inc. |  Description: MICROCONTROLLER, 16 BIT, EEPROM, | на замовлення 138 шт:термін постачання 21-31 дні (днів) | 
 | ||||||||||||||
| LS1027ASN7HNA | NXP USA Inc. | Description: LS1027A-800 ST NO SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1017ASE7NQA | NXP USA Inc. | Description: LS1017A-1300 ST SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | LS1018AXN7HNA | NXP USA Inc. |  Description: IC MPU QORIQ 800MHZ 448FBGA Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active Additional Interfaces: CANbus, I2C, SPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| LS1018AXN7KQA | NXP USA Inc. | Description: IC MPU QORIQ LAYER 1GHZ 448FBGA Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1018AXN7NQA | NXP USA Inc. | Description: LS1018A-1300 XT NO SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1017ASN7HNA | NXP USA Inc. | Description: LS1017A-800 ST NO SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1018AXE7NQA | NXP USA Inc. | Description: LS1018A-1300 XT SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1027ASE7KQA | NXP USA Inc. | Description: LS1027A-1000 ST SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
|   | LS1018AXE7HNA | NXP USA Inc. | Description: IC MPU QORIQ 800MHZ 448FBGA Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active Additional Interfaces: CANbus, I2C, SPI, UART | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| LS1018ASN7NQA | NXP USA Inc. | Description: LS1018A-1300 ST NO SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1027AXE7KQA | NXP USA Inc. | Description: LS1027A-1000 XT SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | |||||||||||||||
| LS1017ASE7HNA | NXP USA Inc. | Description: LS1017A-800 ST SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
| 74HC259PW112 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HC259PW - D LATCH
    Description: NOW NEXPERIA 74HC259PW - D LATCH
товару немає в наявності
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| PEMI4QFN/HK,132 |  | 
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
    Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
на замовлення 28000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2959+ | 7.55 грн | 
| ASC8851AETE |  | 
Виробник: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I²S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
Part Status: Obsolete
DigiKey Programmable: Not Verified
    Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I²S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| EM773FHN33,551 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 5344 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 107+ | 207.70 грн | 
| MMA3202KEG |  | 
Виробник: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
    Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
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| NTSX2102GU8125 |  | 
Виробник: NXP USA Inc.
Description: DUAL SUPPLY TRANSLATING TRANSCEI
    Description: DUAL SUPPLY TRANSLATING TRANSCEI
товару немає в наявності
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| 74HC132PW/S400118 |  | 
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
    Description: IC GATE NAND 4CH 2-INP 14TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| BAP70-04W,115 |  | 
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
    Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
на замовлення 586000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1711+ | 14.23 грн | 
| BAP70AM,115 |  | 
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
    Description: RF DIODE PIN 50V 300MW 6TSSOP
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| BAP51LX,315 |  | 
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Cut Tape (CT)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
    Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Cut Tape (CT)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
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| MRF8P20165WHSR5 |  | 
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
    Description: FET RF 2CH 65V 2.01GHZ NI780S4
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| MRF8P20165WHSR5 |  | 
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
    Description: FET RF 2CH 65V 2.01GHZ NI780S4
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| BAT54CM315 |  | 
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT54C - RECTIFIER
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-883
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
    Description: NOW NEXPERIA BAT54C - RECTIFIER
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-883
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
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| PEMI2STD/CP,115 |  | 
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
    Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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| MRF6VP2600HR5 |  | 
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
    Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
на замовлення 414 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2+ | 21527.50 грн | 
| 74HC3GU04DC,125 |  | 
Виробник: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8VSSOP
    Description: IC INVERTER 3CH 3-INP 8VSSOP
на замовлення 2780 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| LX2162RC82029B | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Part Status: Active
    Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Part Status: Active
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| S9S08SG8E2CTJR |  | 
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
    Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 5265 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1+ | 360.18 грн | 
| 10+ | 231.25 грн | 
| 25+ | 201.13 грн | 
| 100+ | 157.01 грн | 
| 250+ | 141.61 грн | 
| 500+ | 132.21 грн | 
| 1000+ | 122.37 грн | 
| JN516X-EK005-120VZ |  | 
Виробник: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
    Description: DEMO BOARD WIRELESS MCU
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| JN516X-EK005-230VZ |  | 
Виробник: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
    Description: DEMO BOARD WIRELESS MCU
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| JN516X-EK006-120VZ |  | 
Виробник: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
    Description: DEMO BOARD WIRELESS MCU
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| JN516X-EK006-230VZ |  | 
Виробник: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
    Description: DEMO BOARD WIRELESS MCU
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| JN516X-UG001Z | 
Виробник: NXP USA Inc.
Description: UPGRADE KIT JN516X
    Description: UPGRADE KIT JN516X
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| PMN34LN,135 |  | 
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2.5A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 20 V
    Description: MOSFET N-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2.5A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 20 V
на замовлення 10173 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2219+ | 11.03 грн | 
| PMN55LN,135 |  | 
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 4.1A 6TSOP
    Description: MOSFET N-CH 20V 4.1A 6TSOP
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| FXPS7400DS4T1 |  | 
Виробник: NXP USA Inc.
Description: 20-400 KPA BAP DIG SPI
    Description: 20-400 KPA BAP DIG SPI
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| LPC1785FBD208,551 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 8761 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 22+ | 1077.63 грн | 
| LPC1785FBD208557 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
    Description: IC MCU 32BIT 256KB FLASH 208LQFP
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| LPC2470FBD208,551 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
    Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 15810 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 22+ | 1073.88 грн | 
| LPC2939FBD208551 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
    Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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| LPC54607J256BD208551 |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
    Description: IC MCU 32BIT 256KB FLASH 208LQFP
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| LX2160SN71826B | 
Виробник: NXP USA Inc.
Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
    Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
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| BZX84-C18/LF1R |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
    Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
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| BZX84-C18/LF1VL |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
    Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
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| 74ALVCH16374DL,118 |  | 
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48SSOP
    Description: IC FF D-TYPE DUAL 8BIT 48SSOP
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 466+ | 50.99 грн | 
| 74ALVC574D,112 |  | 
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
    Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 2790 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 1135+ | 21.48 грн | 
| NX3L1T53GT,115 |  | 
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
    Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
на замовлення 579 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 6+ | 63.61 грн | 
| 10+ | 54.73 грн | 
| 25+ | 51.93 грн | 
| 100+ | 40.03 грн | 
| 250+ | 37.42 грн | 
| 500+ | 33.07 грн | 
| NX3V1G66GM,132 |  | 
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
    Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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| NX3V1G384GM,132 |  | 
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
    Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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| NX3V1G384GM,132 |  | 
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
    Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2219+ | 11.03 грн | 
| NX3V1G384GM,115 |  | 
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
    Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 9299 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2219+ | 11.03 грн | 
| NX3V1G66GM,115 |  | 
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
    Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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| 74AUP1T45GS,132 |  | 
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
    Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
на замовлення 102450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 2671+ | 9.09 грн | 
| 74HC574PW-Q100118 |  | 
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
    Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
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| FS32K148HAT0MLQT |  | 
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
    Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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| BZX84-C4V3/LF1VL |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
    Description: DIODE ZENER 4.3V 250MW TO236AB
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| BZX84-C4V3/LF1R |  | 
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
    Description: DIODE ZENER 4.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
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| XC68C812A4PVE5-NXP |  | 
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, EEPROM,
    Description: MICROCONTROLLER, 16 BIT, EEPROM,
на замовлення 138 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна | 
|---|---|
| 9+ | 2799.07 грн | 
| LS1027ASN7HNA | 
Виробник: NXP USA Inc.
Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1017ASE7NQA | 
Виробник: NXP USA Inc.
Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1018AXN7HNA |  | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
    Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
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| LS1018AXN7KQA | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1018AXN7NQA | 
Виробник: NXP USA Inc.
Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1017ASN7HNA | 
Виробник: NXP USA Inc.
Description: LS1017A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1017A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1018AXE7NQA | 
Виробник: NXP USA Inc.
Description: LS1018A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1018A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1027ASE7KQA | 
Виробник: NXP USA Inc.
Description: LS1027A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1027A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1018AXE7HNA | 
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
    Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
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| LS1018ASN7NQA | 
Виробник: NXP USA Inc.
Description: LS1018A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1018A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1027AXE7KQA | 
Виробник: NXP USA Inc.
Description: LS1027A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1027A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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| LS1017ASE7HNA | 
Виробник: NXP USA Inc.
Description: LS1017A-800 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
    Description: LS1017A-800 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
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