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74ABT543APW,118 74ABT543APW,118 NXP USA Inc. 74ABT543A.pdf Description: IC TXRX NON-INVERT 5.5V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-TSSOP
Part Status: Obsolete
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
860+25.93 грн
Мінімальне замовлення: 860
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74ABT543APW,112 74ABT543APW,112 NXP USA Inc. 74ABT543A.pdf Description: IC TXRX NON-INVERT 5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-TSSOP
Part Status: Obsolete
на замовлення 3711 шт:
термін постачання 21-31 дні (днів)
860+25.93 грн
Мінімальне замовлення: 860
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LX2080XN72232B LX2080XN72232B NXP USA Inc. Description: SSL MATRIX CONTROLLER
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P5CD041XS/S1ANX25J NXP USA Inc. Description: P5CD041XS/S1ANX25J
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SPC5748GHK0AMMJ6 SPC5748GHK0AMMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 481 шт:
термін постачання 21-31 дні (днів)
8+2995.47 грн
Мінімальне замовлення: 8
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SPC5748GHK0AMKU6 SPC5748GHK0AMKU6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GGK0AVMJ6 SPC5748GGK0AVMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK1MMN6 SPC5748GK1MMN6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Bulk
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Discontinued at Digi-Key
Number of I/O: 246
DigiKey Programmable: Not Verified
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SPC5748GSK0AMKU6 SPC5748GSK0AMKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GK0AMMJ6R SPC5748GK0AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GTK0AVKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK0AMKU6 SPC5748GTK0AMKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK1MMJ6 SPC5748GTK1MMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GSK0AVMJ2 SPC5748GSK0AVMJ2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GBK0AVMJ6 SPC5748GBK0AVMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK0AMKU6 SPC5748GK0AMKU6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK0AMMJ6 SPC5748GTK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK1MKU6R SPC5748GK1MKU6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GK1MMJ6R SPC5748GK1MMJ6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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BGU7044,115 BGU7044,115 NXP USA Inc. BGU7044.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
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BGA7027,115 BGA7027,115 NXP USA Inc. BGA7027.pdf Description: IC AMP GPS 400MHZ-2.7GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 11dB
Current - Supply: 165mA
Noise Figure: 3.9dB
P1dB: 26dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
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BF909AR215 BF909AR215 NXP USA Inc. PHGLS15199-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: Dual Gate
Technology: MESFET
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Part Status: Active
Voltage - Rated: 7 V
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BF909A215 BF909A215 NXP USA Inc. PHGLS15199-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 2dB
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 7 V
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PEMI1QFN/WG,315 PEMI1QFN/WG,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
3806+5.73 грн
Мінімальне замовлення: 3806
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MC33880PEG MC33880PEG NXP USA Inc. MC33880.pdf Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
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MCIMX6DL-SDB MCIMX6DL-SDB NXP USA Inc. IMX6SRSFS.pdf Description: SABRE I.MX 6DUALLITE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6DualLite
Platform: SABRE
Part Status: Active
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LPC54605J512BD100K LPC54605J512BD100K NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 331 шт:
термін постачання 21-31 дні (днів)
1+613.86 грн
10+364.03 грн
90+353.52 грн
180+330.57 грн
270+329.67 грн
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MPC5748G-GW-CBL MPC5748G-GW-CBL NXP USA Inc. Description: CABLE FOR MPC5748G-GW-RDB
Packaging: Bulk
For Use With/Related Products: MPC5748G-GW-RDB
Accessory Type: Cable Assembly
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+2849.39 грн
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SP5748GGK0AVMJ6R SP5748GGK0AVMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GSK0AMKU6R SP5748GSK0AMKU6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5748GTK0AMMJ6R SP5748GTK0AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GSK0AMMJ6R SP5748GSK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
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SP5748GHK0AMMJ6R SP5748GHK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
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SP5748GSK0AVMJ2R SP5748GSK0AVMJ2R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GBK0AVMJ6R SP5748GBK0AVMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GBK0AMMN6R SP5748GBK0AMMN6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
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SP5748GTK0AMKU6R SP5748GTK0AMKU6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5748GHK0AMMN6R SP5748GHK0AMMN6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
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TEA2017DK1002 TEA2017DK1002 NXP USA Inc. UM11606.pdf Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+4072.44 грн
В кошику  од. на суму  грн.
PEMI1QFN/HP,315 PEMI1QFN/HP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/18.5PF SMD
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
4121+5.52 грн
Мінімальне замовлення: 4121
В кошику  од. на суму  грн.
PEMI8QFN/HP,132 PEMI8QFN/HP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
1567+14.08 грн
Мінімальне замовлення: 1567
В кошику  од. на суму  грн.
NT2H1611G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
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MC56F81866VLF MC56F81866VLF NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SCC2698BC1A84 SCC2698BC1A84 NXP USA Inc. PHGLS14345-1.pdf?t.download=true&u=5oefqw Description: OCTAL UART
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
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SPC5673KAVJM1R SPC5673KAVJM1R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5673KAVJM1 SPC5673KAVJM1 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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NT2H1311F0DTL125 NXP USA Inc. PHGL-S-A0001295466-1.pdf?t.download=true&u=5oefqw Description: NFC FORUM TYPE 2 TAG COMPLIANT I
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NT2H1311TTDUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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NT2H1311G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
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NT2H1311TTDUFZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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SPC5607BK0MLL6R SPC5607BK0MLL6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
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PEMI8QFN/WM,132 PEMI8QFN/WM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1567+14.16 грн
Мінімальне замовлення: 1567
В кошику  од. на суму  грн.
SPC5748CSK0AVMJ2 SPC5748CSK0AVMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5607BK0MLL6 SPC5607BK0MLL6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
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UJA1169ATK/FZ UJA1169ATK/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+154.02 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATK/FZ UJA1169ATK/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
на замовлення 6162 шт:
термін постачання 21-31 дні (днів)
2+284.39 грн
10+207.04 грн
25+190.39 грн
100+161.44 грн
250+153.24 грн
500+149.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
UJA1169ATKZ UJA1169ATKZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3000+131.98 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATKZ UJA1169ATKZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 11022 шт:
термін постачання 21-31 дні (днів)
2+247.10 грн
10+178.91 грн
25+164.17 грн
100+138.89 грн
250+131.66 грн
500+127.83 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
UJA1169ATK/F/3Z UJA1169ATK/F/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+154.02 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATK/F/3Z UJA1169ATK/F/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 3848 шт:
термін постачання 21-31 дні (днів)
2+284.39 грн
10+207.04 грн
25+190.39 грн
100+161.44 грн
250+153.24 грн
500+149.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
74ABT543APW,118 74ABT543A.pdf
74ABT543APW,118
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-TSSOP
Part Status: Obsolete
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
860+25.93 грн
Мінімальне замовлення: 860
В кошику  од. на суму  грн.
74ABT543APW,112 74ABT543A.pdf
74ABT543APW,112
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-TSSOP
Part Status: Obsolete
на замовлення 3711 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
860+25.93 грн
Мінімальне замовлення: 860
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LX2080XN72232B
LX2080XN72232B
Виробник: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
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P5CD041XS/S1ANX25J
Виробник: NXP USA Inc.
Description: P5CD041XS/S1ANX25J
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SPC5748GHK0AMMJ6
SPC5748GHK0AMMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 481 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+2995.47 грн
Мінімальне замовлення: 8
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SPC5748GHK0AMKU6
SPC5748GHK0AMKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GGK0AVMJ6 MPC5746C.pdf
SPC5748GGK0AVMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK1MMN6 MPC5748G.pdf
SPC5748GK1MMN6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Bulk
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Discontinued at Digi-Key
Number of I/O: 246
DigiKey Programmable: Not Verified
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SPC5748GSK0AMKU6 MPC5748G.pdf
SPC5748GSK0AMKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GK0AMMJ6R MPC5746C.pdf
SPC5748GK0AMMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GTK0AVKU6 MPC5748G.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK0AMKU6 MPC5748G.pdf
SPC5748GTK0AMKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK1MMJ6 MPC5748G.pdf
SPC5748GTK1MMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GSK0AVMJ2 MPC5746C.pdf
SPC5748GSK0AVMJ2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GBK0AVMJ6
SPC5748GBK0AVMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK0AMKU6
SPC5748GK0AMKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GTK0AMMJ6 MPC5746C.pdf
SPC5748GTK0AMMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748GK1MKU6R MPC5748G.pdf
SPC5748GK1MKU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5748GK1MMJ6R MPC5748G.pdf
SPC5748GK1MMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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BGU7044,115 BGU7044.pdf
BGU7044,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
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BGA7027,115 BGA7027.pdf
BGA7027,115
Виробник: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.7GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 11dB
Current - Supply: 165mA
Noise Figure: 3.9dB
P1dB: 26dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
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BF909AR215 PHGLS15199-1.pdf?t.download=true&u=5oefqw
BF909AR215
Виробник: NXP USA Inc.
Description: MOSFET N-CH SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: Dual Gate
Technology: MESFET
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Part Status: Active
Voltage - Rated: 7 V
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BF909A215 PHGLS15199-1.pdf?t.download=true&u=5oefqw
BF909A215
Виробник: NXP USA Inc.
Description: MOSFET N-CH SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 2dB
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 7 V
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PEMI1QFN/WG,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WG,315
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3806+5.73 грн
Мінімальне замовлення: 3806
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MC33880PEG MC33880.pdf
MC33880PEG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
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MCIMX6DL-SDB IMX6SRSFS.pdf
MCIMX6DL-SDB
Виробник: NXP USA Inc.
Description: SABRE I.MX 6DUALLITE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6DualLite
Platform: SABRE
Part Status: Active
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LPC54605J512BD100K LPC546XX.pdf
LPC54605J512BD100K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 331 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+613.86 грн
10+364.03 грн
90+353.52 грн
180+330.57 грн
270+329.67 грн
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MPC5748G-GW-CBL
MPC5748G-GW-CBL
Виробник: NXP USA Inc.
Description: CABLE FOR MPC5748G-GW-RDB
Packaging: Bulk
For Use With/Related Products: MPC5748G-GW-RDB
Accessory Type: Cable Assembly
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2849.39 грн
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SP5748GGK0AVMJ6R MPC5746C.pdf
SP5748GGK0AVMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GSK0AMKU6R MPC5646C.pdf
SP5748GSK0AMKU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5748GTK0AMMJ6R MPC5746C.pdf
SP5748GTK0AMMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GSK0AMMJ6R
SP5748GSK0AMMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
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SP5748GHK0AMMJ6R
SP5748GHK0AMMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
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SP5748GSK0AVMJ2R MPC5746C.pdf
SP5748GSK0AVMJ2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GBK0AVMJ6R
SP5748GBK0AVMJ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GBK0AMMN6R MPC5746C.pdf
SP5748GBK0AMMN6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
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SP5748GTK0AMKU6R MPC5748G.pdf
SP5748GTK0AMKU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5748GHK0AMMN6R MPC5646C.pdf
SP5748GHK0AMMN6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
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TEA2017DK1002 UM11606.pdf
TEA2017DK1002
Виробник: NXP USA Inc.
Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4072.44 грн
В кошику  од. на суму  грн.
PEMI1QFN/HP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/HP,315
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4121+5.52 грн
Мінімальне замовлення: 4121
В кошику  од. на суму  грн.
PEMI8QFN/HP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HP,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1567+14.08 грн
Мінімальне замовлення: 1567
В кошику  од. на суму  грн.
NT2H1611G0DUFV NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
товару немає в наявності
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MC56F81866VLF MC56F81XXX.pdf
MC56F81866VLF
Виробник: NXP USA Inc.
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SCC2698BC1A84 PHGLS14345-1.pdf?t.download=true&u=5oefqw
SCC2698BC1A84
Виробник: NXP USA Inc.
Description: OCTAL UART
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
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SPC5673KAVJM1R
SPC5673KAVJM1R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5673KAVJM1
SPC5673KAVJM1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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NT2H1311F0DTL125 PHGL-S-A0001295466-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
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NT2H1311TTDUDZ NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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NT2H1311G0DUFV NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
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NT2H1311TTDUFZ NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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SPC5607BK0MLL6R MPC560XBFAMFS.pdf
SPC5607BK0MLL6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
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PEMI8QFN/WM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WM,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1567+14.16 грн
Мінімальне замовлення: 1567
В кошику  од. на суму  грн.
SPC5748CSK0AVMJ2 MPC5748G.pdf
SPC5748CSK0AVMJ2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5607BK0MLL6 MPC560XBFAMFS.pdf
SPC5607BK0MLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
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UJA1169ATK/FZ UJA1169A.pdf
UJA1169ATK/FZ
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+154.02 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATK/FZ UJA1169A.pdf
UJA1169ATK/FZ
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
на замовлення 6162 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+284.39 грн
10+207.04 грн
25+190.39 грн
100+161.44 грн
250+153.24 грн
500+149.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
UJA1169ATKZ UJA1169A.pdf
UJA1169ATKZ
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+131.98 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATKZ UJA1169A.pdf
UJA1169ATKZ
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 11022 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+247.10 грн
10+178.91 грн
25+164.17 грн
100+138.89 грн
250+131.66 грн
500+127.83 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
UJA1169ATK/F/3Z UJA1169A.pdf
UJA1169ATK/F/3Z
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+154.02 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
UJA1169ATK/F/3Z UJA1169A.pdf
UJA1169ATK/F/3Z
Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
на замовлення 3848 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+284.39 грн
10+207.04 грн
25+190.39 грн
100+161.44 грн
250+153.24 грн
500+149.66 грн
Мінімальне замовлення: 2
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