Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36393) > Сторінка 428 з 607
| Фото | Назва | Виробник | Інформація |
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N74F10D,602 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14SONumber of Circuits: 3 Part Status: Obsolete Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-SO Number of Inputs: 3 Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
на замовлення 9686 шт: термін постачання 21-31 дні (днів) |
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MC56F83789AVLLA | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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OMPCA9959LEDEV | NXP USA Inc. |
Description: EVAL BOARD FOR PCA9959 Part Status: Active Outputs and Type: 24 Non-Isolated Outputs Supplied Contents: Board(s) Utilized IC / Part: PCA9959 Current - Output / Channel: 63mA Voltage - Input: 2.7V ~ 5.5V Voltage - Output: 5.5V Features: Dimmable Packaging: Bulk Contents: Board(s) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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S9S08QD2J1VSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOICDigiKey Programmable: Not Verified Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128 x 8 Program Memory Size: 2KB (2K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MF3DH2200DU75/02V | NXP USA Inc. | Description: MIFARE SMART CARD DESFIRE EV2 XL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| PHPT610035NK115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PTN38003AEWY | NXP USA Inc. |
Description: IC USB-C 3.2 / DP1.4 REDRIVER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PTN38003AEWY | NXP USA Inc. |
Description: IC USB-C 3.2 / DP1.4 REDRIVER |
на замовлення 6898 шт: термін постачання 21-31 дні (днів) |
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TJA1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 11079 шт: термін постачання 21-31 дні (днів) |
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| MK28FN2M0CAU15R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 210WLCSPData Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1M x 8 Program Memory Size: 2MB (2M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 210-UFBGA, WLCSP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 120 Part Status: Active Supplier Device Package: 210-WLCSP (6.94x6.94) Peripherals: DMA, I2S, PWM, WDT Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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BZX84-C4V7/LF1R | NXP USA Inc. |
Description: DIODE ZENER 4.7V 250MW SOT23Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V Grade: Automotive Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BZX84-C4V7/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 4.7V 250MW SOT23Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V Grade: Automotive Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PEMI1QFN/LT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/23PF SMDNumber of Channels: 1 ESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 23dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 23pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Package / Case: SC-101, SOT-883 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PEMI1QFN/LT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/23PF SMDESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 23dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 23pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Package / Case: SC-101, SOT-883 Packaging: Bulk Number of Channels: 1 |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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LPC4325JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 768KB (768K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC4322JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTM88H065T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTM88H065T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) Part Status: Obsolete |
на замовлення 1847 шт: термін постачання 21-31 дні (днів) |
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SPC5603BAMLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S9S12P64J0MFTR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 10x12b Core Processor: CPU12V1 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPC8314EVRAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 620HBGAPackaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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S912XEG384BMAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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FS32K142MAT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 58 Part Status: Obsolete Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5746CHK1AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| SAF3560EL/V1100Y | NXP USA Inc. | Description: IC DGTL HD RADIO PROCESSOR 170LB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MRFE6VP6600NR3,528 | NXP USA Inc. |
Description: WIDEBAND RF POWER LDMOS TRANSIST |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| BUK9K89-100E115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9K89-100E - POWEPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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K32W041AZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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K32W041AZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 1890 шт: термін постачання 21-31 дні (днів) |
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BZX84-C36/LF1R | NXP USA Inc. |
Description: DIODE ZENER 36V 250MW TO236ABTolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 36 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BZX84-C36/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 36V 250MW TO236ABTolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 36 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSMN7R6-60XSQ | NXP USA Inc. |
Description: MOSFET N-CH 60V 51.5A TO220F Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Full Pack, Isolated Tab Packaging: Tube Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V Drain to Source Voltage (Vdss): 60 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Obsolete Supplier Device Package: TO-220F Vgs(th) (Max) @ Id: 4.6V @ 1mA Power Dissipation (Max): 46W (Tc) Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc) FET Type: N-Channel |
на замовлення 685 шт: термін постачання 21-31 дні (днів) |
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MCZ33903DS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPart Status: Active Supplier Device Package: 32-SSOP-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NHS3100UK/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 25WLCSPPackage / Case: 25-UFBGA, WLCSP Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 25-WLCSP (2.51x2.51) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NHS3100UK/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 25WLCSPPart Status: Active Supplier Device Package: 25-WLCSP (2.51x2.51) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NHS3100UK/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 25WLCSPPart Status: Active Supplier Device Package: 25-WLCSP (2.51x2.51) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Bulk |
на замовлення 9835 шт: термін постачання 21-31 дні (днів) |
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BCW30235 | NXP USA Inc. |
Description: NOW NEXPERIA BCW30 - SMALL SIGNAPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| KITFS5600FRDMEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS5600Contents: Board(s), Cable(s) Outputs and Type: 2 Non-Isolated Outputs Main Purpose: DC/DC Converter Supplied Contents: Board(s), Cable(s) Utilized IC / Part: FS5600 Board Type: Fully Populated Regulator Topology: Buck Current - Output: 10A, 3A Voltage - Input: 36V Voltage - Output: 1.8V ~ 8V, 1.8V ~ 7.2V Packaging: Bulk |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| IP3348CX10,135 | NXP USA Inc. |
Description: FILTER LC(PI) 15NH/25PF ESD SMDAttenuation Value: 40dB @ 1GHz ~ 3GHz Height: 0.026" (0.65mm) Values: L = 15nH (Total), C = 25pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm) Package / Case: 10-UFBGA, WLCSP Packaging: Bulk Number of Channels: 4 Part Status: Obsolete ESD Protection: Yes Resistance - Channel (Ohms): 10 Center / Cutoff Frequency: 350MHz (Cutoff) Technology: LC (Pi) Current: 20 mA Applications: Data Lines for Mobile Devices Filter Order: 3rd |
на замовлення 351000 шт: термін постачання 21-31 дні (днів) |
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| MK28FN2M0ACAU15R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 210WLCSP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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FS32K144ULT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPCore Size: 32-Bit Single-Core Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) Number of I/O: 89 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: POR, PWM, WDT DigiKey Programmable: Not Verified Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MVR5510AVMAHEPR2 | NXP USA Inc. |
Description: IC PMIC VR5510 QMOperating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Qualification: AEC-Q100 Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| RDDRONE-CUPK64 | NXP USA Inc. |
Description: NXP CUP DRONE MAINBOARD Part Status: Active Platform: Mikroe NXP Cup Mainboard Utilized IC / Part: K64 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M4 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SPC5746CBK1AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGADigiKey Programmable: Not Verified Number of I/O: 178 Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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FS32K142HAT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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OT413127 | NXP USA Inc. |
Description: OT413 - TBC - TO 220AB Packaging: Bulk Part Status: Active |
на замовлення 671 шт: термін постачання 21-31 дні (днів) |
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OT418115 | NXP USA Inc. |
Description: NOW WEEN - OT418 - TBC - SC-73 Packaging: Bulk Part Status: Active |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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OT411127 | NXP USA Inc. |
Description: OT411 - TRIAC Packaging: Bulk Part Status: Active |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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OT412115 | NXP USA Inc. |
Description: NOW WEEN - OT412 - TBC - SC-73 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| LPC11E37HFBD64/401 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 6080 шт: термін постачання 21-31 дні (днів) |
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| LPC11E36FBD64/501 | NXP USA Inc. |
Description: IC MCU 32BIT FLASH Packaging: Bulk Mounting Type: Surface Mount Speed: 50MHz RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 4960 шт: термін постачання 21-31 дні (днів) |
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LPC54102J512BD64151 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MPXC2011DT1 | NXP USA Inc. |
Description: SENSOR 1.45PSID .025V CHIP PAKFeatures: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 4-SSIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Operating Temperature: 15°C ~ 40°C Termination Style: PC Pin Voltage - Supply: 3V ~ 10V Applications: Board Mount Port Style: Barbless Maximum Pressure: 10.88PSI (75kPa) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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LPC1224FBD64/121151 | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 64LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| PCU9669B/S911 | NXP USA Inc. | Description: NO DESCRIPTION |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||||
| BB156/DG/B2 | NXP USA Inc. | Description: NO DESCRIPTION |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| XC508262ZP25R2 | NXP USA Inc. | Description: NO DESCRIPTION |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| G9S12C32F1MFA2E | NXP USA Inc. | Description: NO DESCRIPTION |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SM912G634EV2APR2 | NXP USA Inc. | Description: NO DESCRIPTION |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| PWPR1516CALR | NXP USA Inc. |
Description: NO DESCRIPTION Packaging: Bulk Part Status: Not For New Designs DigiKey Programmable: Not Verified |
на замовлення 1100 шт: термін постачання 21-31 дні (днів) |
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| N74F10D,602 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
на замовлення 9686 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2623+ | 8.14 грн |
| MC56F83789AVLLA |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
на замовлення 88 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1726.32 грн |
| 10+ | 1328.08 грн |
| OMPCA9959LEDEV |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 43001.28 грн |
| S9S08QD2J1VSCR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
товару немає в наявності
В кошику
од. на суму грн.
| MF3DH2200DU75/02V |
Виробник: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Description: MIFARE SMART CARD DESFIRE EV2 XL
товару немає в наявності
В кошику
од. на суму грн.
| PHPT610035NK115 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| PTN38003AEWY |
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Виробник: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
Description: IC USB-C 3.2 / DP1.4 REDRIVER
товару немає в наявності
В кошику
од. на суму грн.
| PTN38003AEWY |
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Виробник: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
Description: IC USB-C 3.2 / DP1.4 REDRIVER
на замовлення 6898 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 424.06 грн |
| 10+ | 367.29 грн |
| 25+ | 347.20 грн |
| 100+ | 282.39 грн |
| 250+ | 267.91 грн |
| 500+ | 240.39 грн |
| 1000+ | 225.19 грн |
| TJA1441AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 11079 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 109.97 грн |
| 10+ | 77.02 грн |
| 25+ | 69.91 грн |
| 100+ | 58.31 грн |
| 250+ | 54.82 грн |
| 500+ | 52.72 грн |
| 1000+ | 51.46 грн |
| MK28FN2M0CAU15R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
товару немає в наявності
В кошику
од. на суму грн.
| BZX84-C4V7/LF1R |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
товару немає в наявності
В кошику
од. на суму грн.
| BZX84-C4V7/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
товару немає в наявності
В кошику
од. на суму грн.
| PEMI1QFN/LT,315 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| PEMI1QFN/LT,315 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3806+ | 6.33 грн |
| LPC4325JBD144551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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| LPC4322JBD144551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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| NTM88H065T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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| NTM88H065T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
на замовлення 1847 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 660.62 грн |
| 5+ | 561.64 грн |
| 10+ | 496.05 грн |
| 25+ | 377.68 грн |
| 50+ | 333.78 грн |
| 100+ | 324.99 грн |
| 500+ | 267.83 грн |
| 1000+ | 250.55 грн |
| SPC5603BAMLL4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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| S9S12P64J0MFTR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MPC8314EVRAFDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 3939.20 грн |
| S912XEG384BMAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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| FS32K142MAT0MLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| SPC5746CHK1AVKU6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
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| SAF3560EL/V1100Y |
Виробник: NXP USA Inc.
Description: IC DGTL HD RADIO PROCESSOR 170LB
Description: IC DGTL HD RADIO PROCESSOR 170LB
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| MRFE6VP6600NR3,528 |
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Виробник: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Description: WIDEBAND RF POWER LDMOS TRANSIST
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| K32W041AZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 235.97 грн |
| K32W041AZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 1890 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 443.84 грн |
| 10+ | 370.11 грн |
| 25+ | 350.24 грн |
| 100+ | 303.02 грн |
| 250+ | 287.64 грн |
| 500+ | 276.78 грн |
| BZX84-C36/LF1R |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
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| BZX84-C36/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
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| PSMN7R6-60XSQ |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 60V 51.5A TO220F
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Power Dissipation (Max): 46W (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
FET Type: N-Channel
Description: MOSFET N-CH 60V 51.5A TO220F
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Power Dissipation (Max): 46W (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
FET Type: N-Channel
на замовлення 685 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 685+ | 37.71 грн |
| MCZ33903DS5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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| NHS3100UK/A1Z |
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Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Description: IC RFID READER 13.56MHZ 25WLCSP
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
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| NHS3100UK/A1Z |
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Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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| NHS3100UK/A1Z |
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Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Bulk
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Bulk
на замовлення 9835 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 163+ | 140.11 грн |
| BCW30235 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| KITFS5600FRDMEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS5600
Contents: Board(s), Cable(s)
Outputs and Type: 2 Non-Isolated Outputs
Main Purpose: DC/DC Converter
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS5600
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 10A, 3A
Voltage - Input: 36V
Voltage - Output: 1.8V ~ 8V, 1.8V ~ 7.2V
Packaging: Bulk
Description: EVAL BOARD FOR FS5600
Contents: Board(s), Cable(s)
Outputs and Type: 2 Non-Isolated Outputs
Main Purpose: DC/DC Converter
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS5600
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 10A, 3A
Voltage - Input: 36V
Voltage - Output: 1.8V ~ 8V, 1.8V ~ 7.2V
Packaging: Bulk
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 33903.70 грн |
| IP3348CX10,135 |
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Виробник: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Height: 0.026" (0.65mm)
Values: L = 15nH (Total), C = 25pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Package / Case: 10-UFBGA, WLCSP
Packaging: Bulk
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 10
Center / Cutoff Frequency: 350MHz (Cutoff)
Technology: LC (Pi)
Current: 20 mA
Applications: Data Lines for Mobile Devices
Filter Order: 3rd
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Height: 0.026" (0.65mm)
Values: L = 15nH (Total), C = 25pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Package / Case: 10-UFBGA, WLCSP
Packaging: Bulk
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 10
Center / Cutoff Frequency: 350MHz (Cutoff)
Technology: LC (Pi)
Current: 20 mA
Applications: Data Lines for Mobile Devices
Filter Order: 3rd
на замовлення 351000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3806+ | 6.06 грн |
| MK28FN2M0ACAU15R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
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| FS32K144ULT0VLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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| MVR5510AVMAHEPR2 |
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Виробник: NXP USA Inc.
Description: IC PMIC VR5510 QM
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Qualification: AEC-Q100
Grade: Automotive
Description: IC PMIC VR5510 QM
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Qualification: AEC-Q100
Grade: Automotive
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| RDDRONE-CUPK64 |
Виробник: NXP USA Inc.
Description: NXP CUP DRONE MAINBOARD
Part Status: Active
Platform: Mikroe NXP Cup Mainboard
Utilized IC / Part: K64
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: NXP CUP DRONE MAINBOARD
Part Status: Active
Platform: Mikroe NXP Cup Mainboard
Utilized IC / Part: K64
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 10789.88 грн |
| SPC5746CBK1AMMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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| FS32K142HAT0MLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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| OT413127 |
на замовлення 671 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 671+ | 41.14 грн |
| OT418115 |
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2404+ | 9.49 грн |
| OT411127 |
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 614+ | 38.77 грн |
| LPC11E37HFBD64/401 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 6080 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 38+ | 1056.20 грн |
| LPC11E36FBD64/501 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT FLASH
Packaging: Bulk
Mounting Type: Surface Mount
Speed: 50MHz
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT FLASH
Packaging: Bulk
Mounting Type: Surface Mount
Speed: 50MHz
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 4960 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 35+ | 1148.77 грн |
| LPC54102J512BD64151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
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| MPXC2011DT1 |
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Виробник: NXP USA Inc.
Description: SENSOR 1.45PSID .025V CHIP PAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 10V
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Description: SENSOR 1.45PSID .025V CHIP PAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 10V
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
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| LPC1224FBD64/121151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Description: IC MCU 32BIT 48KB FLASH 64LQFP
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| PCU9669B/S911 |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Description: NO DESCRIPTION
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BB156/DG/B2 |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Description: NO DESCRIPTION
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| XC508262ZP25R2 |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Description: NO DESCRIPTION
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| G9S12C32F1MFA2E |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Description: NO DESCRIPTION
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| SM912G634EV2APR2 |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Description: NO DESCRIPTION
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| PWPR1516CALR |
Виробник: NXP USA Inc.
Description: NO DESCRIPTION
Packaging: Bulk
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Description: NO DESCRIPTION
Packaging: Bulk
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
на замовлення 1100 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 569+ | 69.62 грн |
























