Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35985) > Сторінка 514 з 600
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| SAF7770EL/101Z13AY | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7770EL/200Z13AK | NXP USA Inc. |
Description: SAF7770EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7770EL/101Z13AK | NXP USA Inc. |
Description: SAF7770EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7770EL/203Z13AY | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7770EL/203Z13AK | NXP USA Inc. |
Description: IC Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF4000EL/101Z13AY | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF4000EL/101Z13AK | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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MC34VR500V4ESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TOPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34VR500V7ESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TOPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 2A Supplier Device Package: 56-QFN-EP (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MCZ33905CD3EK | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3Packaging: Bulk |
на замовлення 676 шт: термін постачання 21-31 дні (днів) |
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NTP53321G0JTTZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-TSSOP Writable Memory: 16kb (User) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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NTP53321G0JTTZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-TSSOP Writable Memory: 16kb (User) |
на замовлення 7376 шт: термін постачання 21-31 дні (днів) |
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NTP53121G0JTTZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-TSSOP Writable Memory: 16kb (User) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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NTP53121G0JTTZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-TSSOP Writable Memory: 16kb (User) |
на замовлення 3390 шт: термін постачання 21-31 дні (днів) |
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NTP53321G0JTZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 8-SO Writable Memory: 16kb (User) |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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NTP53321G0JTZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 8-SO Writable Memory: 16kb (User) |
на замовлення 7069 шт: термін постачання 21-31 дні (днів) |
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NTP53121G0JTZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 8-SO Writable Memory: 16kb (User) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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NTP53121G0JTZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 8-SO Writable Memory: 16kb (User) |
на замовлення 4021 шт: термін постачання 21-31 дні (днів) |
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PMXB65UPE147 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta) Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V |
на замовлення 8951063 шт: термін постачання 21-31 дні (днів) |
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MC9S12B256MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MWCT1016SFVMHN | NXP USA Inc. |
Description: WCT1016 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: Wireless Power Transmitter Supplier Device Package: 100-MAPBGA (11x11) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC8641DTHX1333JE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGAPackaging: Tray Package / Case: 1023-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| FD32K116LFT0MFMT | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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S9S12G64F1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 2249 шт: термін постачання 21-31 дні (днів) |
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BFU530XRVL | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SOT143RPackaging: Tape & Reel (TR) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 16.5dB Power - Max: 450mW Current - Collector (Ic) (Max): 40mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz Supplier Device Package: SOT-143R |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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BFU530XRVL | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SOT143RPackaging: Cut Tape (CT) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 16.5dB Power - Max: 450mW Current - Collector (Ic) (Max): 40mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz Supplier Device Package: SOT-143R |
на замовлення 6815 шт: термін постачання 21-31 дні (днів) |
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MC33CD1020AESR2 | NXP USA Inc. |
Description: 22-CH MULTIPLE SWITCH DETECT INTPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: SPI Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V Applications: Multiple Switch Detection Supplier Device Package: 32-QFN-EP (5x5) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| MC33CD1020AES | NXP USA Inc. |
Description: 22-CH MULTIPLE SWITCH DETECT INTPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: SPI Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V Applications: Multiple Switch Detection Supplier Device Package: 32-QFN-EP (5x5) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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TJA1124BHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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TJA1124BHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFNPackaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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TJA1124CHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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TJA1124CHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFNPackaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 5300 шт: термін постачання 21-31 дні (днів) |
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SJA1124BHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 4/4 24DHVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SJA1124BHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 4/4 24DHVQFNPackaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1274 шт: термін постачання 21-31 дні (днів) |
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SJA1124AHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 4/4 24DHVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SJA1124AHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 4/4 24DHVQFNPackaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2635 шт: термін постачання 21-31 дні (днів) |
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IW416UK/A1CZ | NXP USA Inc. |
Description: IC RF TXRX 802.15.4 76WLCSPPackaging: Tape & Reel (TR) Package / Case: 76-UFBGA, WLCSP Sensitivity: -99dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: 0°C ~ 70°C Voltage - Supply: 1.05V, 1.8V, 2.2V Power - Output: 21dBm Protocol: 802.11a/b/g/n, Bluetooth Current - Receiving: 5µA ~ 72mA Data Rate (Max): 150Mbps Current - Transmitting: 240µA ~ 325mA Supplier Device Package: 76-WLCSP (3.95x3.565) Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MPC8347CZUAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGAPackaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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P1015NSE5DFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 667MHZ 561TEPBGAPackaging: Tray Package / Case: 561-FBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 561-TEPBGA I (23x23) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| SAF7751HV/N208W/UK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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MPC855TZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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S9S08AW16AE0VLD | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08Packaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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74LVC240APW,112 | NXP USA Inc. |
Description: IC BUFFER INVERT 3.6V 20TSSOPPackaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 20-TSSOP |
на замовлення 28939 шт: термін постачання 21-31 дні (днів) |
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| PTN36043BBXY | NXP USA Inc. |
Description: PTN36043BBXYPackaging: Tape & Reel (TR) Package / Case: 18-XFQFN Exposed Pad Delay Time: 500ps (Max) Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: USB Type C Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| LFTHNLT | NXP USA Inc. |
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK Packaging: Bulk Module/Board Type: Socket Module |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| LFDAA13C | NXP USA Inc. |
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE Packaging: Bulk Module/Board Type: Socket Module - QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
|
S9KEAZ64ACLHR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
S912ZVML31F1WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MC33PF8100EPESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PRPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MC33FS6600M1ESR2 | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCU Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Safety Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
FS32K146UIT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| FX32K142HAT0MLHT | NXP USA Inc. |
Description: S32K142 ARM CORTEX-M4F, 80 MHZ,Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
MCIMX27MJP4AR2 | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 473LFBGAPackaging: Tape & Reel (TR) Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 473-LFBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MCIMX27MJP4A | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 473LFBGAPackaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 473-LFBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MMA6827BKCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G SPI 16QFNPackaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±120g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4.096 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MCF52233CAL60 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 73 DigiKey Programmable: Not Verified |
на замовлення 292 шт: термін постачання 21-31 дні (днів) |
|
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|
MPC8315CVRADDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, PCI, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MC908QB8VDWE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16SOICPackaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
NX3P2902BUK012 | NXP USA Inc. |
Description: LOGIC CONTROLLED HIGH-SIDE POWERPackaging: Bulk |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
|
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|
LS1046AXE8T1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
|
| SAF7770EL/101Z13AY |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товару немає в наявності
В кошику
од. на суму грн.
| SAF7770EL/200Z13AK |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товару немає в наявності
В кошику
од. на суму грн.
| SAF7770EL/101Z13AK |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товару немає в наявності
В кошику
од. на суму грн.
| MC34VR500V4ESR2 |
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Виробник: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| MC34VR500V7ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| MCZ33905CD3EK |
![]() |
на замовлення 676 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 53+ | 440.49 грн |
| NTP53321G0JTTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 71.61 грн |
| 5000+ | 66.35 грн |
| NTP53321G0JTTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
на замовлення 7376 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 116.18 грн |
| 10+ | 96.18 грн |
| 25+ | 90.79 грн |
| 100+ | 78.18 грн |
| 250+ | 73.97 грн |
| 500+ | 70.99 грн |
| 1000+ | 67.07 грн |
| NTP53121G0JTTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
товару немає в наявності
В кошику
од. на суму грн.
| NTP53121G0JTTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
на замовлення 3390 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 106.98 грн |
| 10+ | 88.94 грн |
| 25+ | 83.90 грн |
| 100+ | 72.24 грн |
| 250+ | 68.34 грн |
| 500+ | 65.58 грн |
| 1000+ | 61.94 грн |
| NTP53321G0JTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 60.87 грн |
| NTP53321G0JTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
на замовлення 7069 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 116.18 грн |
| 10+ | 96.18 грн |
| 25+ | 90.79 грн |
| 100+ | 78.18 грн |
| 250+ | 73.97 грн |
| 500+ | 70.99 грн |
| 1000+ | 67.07 грн |
| NTP53121G0JTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
товару немає в наявності
В кошику
од. на суму грн.
| NTP53121G0JTZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
на замовлення 4021 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 106.98 грн |
| 10+ | 88.94 грн |
| 25+ | 83.90 грн |
| 100+ | 72.24 грн |
| 250+ | 68.34 грн |
| 500+ | 65.58 грн |
| 1000+ | 61.94 грн |
| PMXB65UPE147 |
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Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
на замовлення 8951063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5495+ | 3.82 грн |
| MC9S12B256MFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| MWCT1016SFVMHN |
Виробник: NXP USA Inc.
Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
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| MC8641DTHX1333JE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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| S9S12G64F1MLC |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 439.64 грн |
| 10+ | 324.84 грн |
| 25+ | 300.27 грн |
| 100+ | 256.37 грн |
| 250+ | 244.26 грн |
| 500+ | 236.96 грн |
| 1250+ | 225.50 грн |
| BFU530XRVL |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
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| BFU530XRVL |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
на замовлення 6815 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 28.42 грн |
| 18+ | 18.27 грн |
| 25+ | 15.97 грн |
| 100+ | 12.67 грн |
| 250+ | 11.55 грн |
| 500+ | 10.88 грн |
| 1000+ | 10.16 грн |
| 2500+ | 9.58 грн |
| 5000+ | 9.24 грн |
| MC33CD1020AESR2 |
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Виробник: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
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| MC33CD1020AES |
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Виробник: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
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од. на суму грн.
| TJA1124BHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 107.38 грн |
| TJA1124BHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 221.49 грн |
| 10+ | 160.00 грн |
| 25+ | 146.64 грн |
| 100+ | 123.78 грн |
| 250+ | 117.18 грн |
| 500+ | 113.20 грн |
| 1000+ | 108.13 грн |
| TJA1124CHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 120.41 грн |
| TJA1124CHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 227.34 грн |
| 10+ | 164.27 грн |
| 25+ | 150.54 грн |
| 100+ | 127.11 грн |
| 250+ | 120.37 грн |
| 500+ | 116.30 грн |
| 1000+ | 111.10 грн |
| SJA1124BHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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од. на суму грн.
| SJA1124BHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1274 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 244.89 грн |
| 10+ | 177.55 грн |
| 25+ | 171.37 грн |
| 100+ | 155.65 грн |
| 250+ | 151.13 грн |
| 500+ | 148.54 грн |
| 1000+ | 142.30 грн |
| SJA1124AHG/1Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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од. на суму грн.
| SJA1124AHG/1Z |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2635 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 258.26 грн |
| 10+ | 184.39 грн |
| 25+ | 178.23 грн |
| 100+ | 162.11 грн |
| 250+ | 156.29 грн |
| 500+ | 152.42 грн |
| 1000+ | 148.02 грн |
| IW416UK/A1CZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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| MPC8347CZUAJDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| P1015NSE5DFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| MPC855TZQ66D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 100+ | 11007.20 грн |
| S9S08AW16AE0VLD |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 85+ | 286.27 грн |
| 74LVC240APW,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
на замовлення 28939 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1603+ | 14.66 грн |
| PTN36043BBXY |
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Виробник: NXP USA Inc.
Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
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| LFTHNLT |
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
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| LFDAA13C |
Виробник: NXP USA Inc.
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
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| S9KEAZ64ACLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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| S912ZVML31F1WKHR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MC33PF8100EPESR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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| MC33FS6600M1ESR2 |
Виробник: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
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| FS32K146UIT0VLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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| MCIMX27MJP4AR2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
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| MCIMX27MJP4A |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
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| MMA6827BKCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
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| MCF52233CAL60 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 292 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2027.67 грн |
| 10+ | 1448.33 грн |
| 25+ | 1319.09 грн |
| 80+ | 1121.10 грн |
| MPC8315CVRADDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
товару немає в наявності
В кошику
од. на суму грн.
| MC908QB8VDWE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| NX3P2902BUK012 |
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на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 702+ | 32.77 грн |
| LS1046AXE8T1A |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 13212.47 грн |
| 10+ | 10828.01 грн |




























