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BAS20,215 BAS20,215 NXP USA Inc. BAS20.pdf Description: DIODE GEN-PURP 200V 200MA SOT-23
Packaging: Tape & Reel (TR)
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MC705JJ7CDWE MC705JJ7CDWE NXP USA Inc. MC68HC705JJ7.pdf Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MCHSC705C8ACPE MCHSC705C8ACPE NXP USA Inc. MC68HC705C8.pdf Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC68HC705K1CP MC68HC705K1CP NXP USA Inc. MC68HC705K1.pdf Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
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MC68HRC705J1ACPE MC68HRC705J1ACPE NXP USA Inc. MC68HC705J1A.pdf Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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P89LPC904FD,529 P89LPC904FD,529 NXP USA Inc. P89LPC904.pdf Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
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N74F244D,602 N74F244D,602 NXP USA Inc. 74F244%28B%29.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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N74F244DB,112 N74F244DB,112 NXP USA Inc. 74F244%28B%29.pdf Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
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N74F244D,623 N74F244D,623 NXP USA Inc. 74F244%28B%29.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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N74F245D,602 N74F245D,602 NXP USA Inc. 74F245.pdf Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
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N74F245N,602 N74F245N,602 NXP USA Inc. 74F245.pdf Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
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74ABT74DB,112 74ABT74DB,112 NXP USA Inc. 74ABT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
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74ABT74PW,112 74ABT74PW,112 NXP USA Inc. 74ABT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Tube
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74ABT74D,112 74ABT74D,112 NXP USA Inc. 74ABT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
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74ABT74D,118 74ABT74D,118 NXP USA Inc. 74ABT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
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BCX52,115 NXP USA Inc. BCP52_BCX52_BC52PA.pdf Description: TRANSISTOR PNP 60V 1A SOT89
Packaging: Tape & Reel (TR)
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74HCT4051PW,112 74HCT4051PW,112 NXP USA Inc. 74HC_HCT4051.pdf Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
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74HCT4051DB,112 74HCT4051DB,112 NXP USA Inc. 74HC_HCT4051.pdf Description: IC MUX/DEMUX 8X1 16SSOP
Packaging: Tube
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BZX79-C3V3,133 NXP USA Inc. BZX79.pdf Description: DIODE ZENER 3.3V 400MW ALF2
Packaging: Tape & Box (TB)
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NAFE33352B40BSMP NXP USA Inc. NAFE33352.pdf Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
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MPC8260ACZUMIBB MPC8260ACZUMIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MC9S08QE32CFM MC9S08QE32CFM NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
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BTA208S-600D,118 NXP USA Inc. bta208s-600d.pdf Description: TRIAC SENS GATE 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-600F,118 NXP USA Inc. bta208s-600f.pdf Description: TRIAC 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-800B,118 BTA208S-800B,118 NXP USA Inc. BTA208S-800B.pdf Description: TRIAC 800V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-600E,118 NXP USA Inc. bta208s-600e.pdf Description: TRIAC SENS GATE 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208X-800B,127 NXP USA Inc. bta208x-800b.pdf Description: TRIAC 800V 8A TO220F
Packaging: Tube
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BTA208X-600F,127 NXP USA Inc. bta208x-600f.pdf Description: TRIAC 600V 8A TO220-3
Packaging: Tube
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BTA208-600B,127 NXP USA Inc. bta208-600b.pdf Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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JN5139-XK006 JN5139-XK006 NXP USA Inc. JN5139_PB_021008_v1.22.pdf description Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
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BZV85-C27,113 NXP USA Inc. BZV85_SER.pdf PHGLS22780-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 1.3W DO41
Packaging: Tape & Reel (TR)
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74HC14DB,118 74HC14DB,118 NXP USA Inc. 74HC_HCT14.pdf Description: IC HEX INV SCHMITT TRIG 14SSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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MC68MH360AI33L MC68MH360AI33L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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BZV55-C43,115 NXP USA Inc. BZV55_SER.pdf Description: DIODE ZENER 43V 500MW LLDS
Packaging: Tape & Reel (TR)
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LD6816CX4/18H,315 LD6816CX4/18H,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.8V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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74LVC4066BQ,115 74LVC4066BQ,115 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14DHVQFN
Packaging: Tape & Reel (TR)
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BT134-600G,127 NXP USA Inc. BT134-600G.pdf Description: TRIAC 600V 4A SOT82-3
Packaging: Tube
Package / Case: SOT-82
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-82-3
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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Z0103MN,135 Z0103MN,135 NXP USA Inc. Z0103MN.pdf Description: TRIAC SENS GATE 600V 1A SC73
Packaging: Tape & Reel (TR)
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PMBT2222A,215 PMBT2222A,215 NXP USA Inc. PMBT2222.pdf Description: TRANS NPN SW 600MA 30V SOT23
Packaging: Tape & Reel (TR)
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PMBT2222A,235 PMBT2222A,235 NXP USA Inc. PMBT2222.pdf Description: TRANS NPN 40V 600MA SOT23
Packaging: Tape & Reel (TR)
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MWCT1200CFM MWCT1200CFM NXP USA Inc. MWCT1000DS.pdf Description: IC MULTI COIL 5W 5V 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 32-HVQFN (5x5)
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MPF5300AMBA0ES MPF5300AMBA0ES NXP USA Inc. PF5300.pdf Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MVR5510AVMALTS NXP USA Inc. VR5510.pdf Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S912XET256BVAG S912XET256BVAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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74LVC1G80GV,125 74LVC1G80GV,125 NXP USA Inc. PHGLS25117-1.pdf?t.download=true&u=5oefqw Description: IC D-TYPE POS TRG SNGL SC74A
Packaging: Tape & Reel (TR)
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PDTC144TE,115 PDTC144TE,115 NXP USA Inc. PDTC144T_SERIES.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
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BZV55-C18,135 BZV55-C18,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 500MW LLDS
Packaging: Tape & Reel (TR)
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UBA2024BT/N1,518 UBA2024BT/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
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HEF4011BT,653 HEF4011BT,653 NXP USA Inc. HEF4011B.pdf Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
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HEF4011BT,652 HEF4011BT,652 NXP USA Inc. HEF4011B.pdf Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
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HEF4081BT,653 HEF4081BT,653 NXP USA Inc. HEF4081B.pdf Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
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74HCT173DB,112 74HCT173DB,112 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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74HCT173D,653 74HCT173D,653 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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74HC390DB,112 74HC390DB,112 NXP USA Inc. 74HC_HCT390.pdf Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390D,652 74HC390D,652 NXP USA Inc. 74HC_HCT390.pdf Description: IC DUAL DECADE RIPP COUNT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390PW,112 74HC390PW,112 NXP USA Inc. 74HC_HCT390.pdf Description: IC DUAL DEC RIPPLE COUNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390D,653 74HC390D,653 NXP USA Inc. 74HC_HCT390.pdf Description: IC DUAL DEC RIPPLE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC4017DB,112 74HC4017DB,112 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HC4017D,653 74HC4017D,653 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HC4017D,652 74HC4017D,652 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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BAS20,215 BAS20.pdf
BAS20,215
Виробник: NXP USA Inc.
Description: DIODE GEN-PURP 200V 200MA SOT-23
Packaging: Tape & Reel (TR)
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MC705JJ7CDWE MC68HC705JJ7.pdf
MC705JJ7CDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MCHSC705C8ACPE MC68HC705C8.pdf
MCHSC705C8ACPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC68HC705K1CP MC68HC705K1.pdf
MC68HC705K1CP
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
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MC68HRC705J1ACPE MC68HC705J1A.pdf
MC68HRC705J1ACPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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P89LPC904FD,529 P89LPC904.pdf
P89LPC904FD,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
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N74F244D,602 74F244%28B%29.pdf
N74F244D,602
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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N74F244DB,112 74F244%28B%29.pdf
N74F244DB,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
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N74F244D,623 74F244%28B%29.pdf
N74F244D,623
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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N74F245D,602 74F245.pdf
N74F245D,602
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
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N74F245N,602 74F245.pdf
N74F245N,602
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
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74ABT74DB,112 74ABT74.pdf
74ABT74DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
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74ABT74PW,112 74ABT74.pdf
74ABT74PW,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Tube
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74ABT74D,112 74ABT74.pdf
74ABT74D,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
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74ABT74D,118 74ABT74.pdf
74ABT74D,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
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BCX52,115 BCP52_BCX52_BC52PA.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR PNP 60V 1A SOT89
Packaging: Tape & Reel (TR)
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74HCT4051PW,112 74HC_HCT4051.pdf
74HCT4051PW,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
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74HCT4051DB,112 74HC_HCT4051.pdf
74HCT4051DB,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 8X1 16SSOP
Packaging: Tube
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BZX79-C3V3,133 BZX79.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.3V 400MW ALF2
Packaging: Tape & Box (TB)
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NAFE33352B40BSMP NAFE33352.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
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MPC8260ACZUMIBB MPC8260A.pdf
MPC8260ACZUMIBB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MC9S08QE32CFM MC9S08QE128.pdf
MC9S08QE32CFM
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
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BTA208S-600D,118 bta208s-600d.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-600F,118 bta208s-600f.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-800B,118 BTA208S-800B.pdf
BTA208S-800B,118
Виробник: NXP USA Inc.
Description: TRIAC 800V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208S-600E,118 bta208s-600e.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 8A DPAK
Packaging: Tape & Reel (TR)
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BTA208X-800B,127 bta208x-800b.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 8A TO220F
Packaging: Tube
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BTA208X-600F,127 bta208x-600f.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A TO220-3
Packaging: Tube
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BTA208-600B,127 bta208-600b.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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JN5139-XK006 description JN5139_PB_021008_v1.22.pdf
JN5139-XK006
Виробник: NXP USA Inc.
Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
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BZV85-C27,113 BZV85_SER.pdf PHGLS22780-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: DIODE ZENER 27V 1.3W DO41
Packaging: Tape & Reel (TR)
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74HC14DB,118 74HC_HCT14.pdf
74HC14DB,118
Виробник: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14SSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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MC68MH360AI33L MC68MH360UM.pdf
MC68MH360AI33L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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BZV55-C43,115 BZV55_SER.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 43V 500MW LLDS
Packaging: Tape & Reel (TR)
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LD6816CX4/18H,315 LD6816.pdf
LD6816CX4/18H,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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74LVC4066BQ,115 74LVC4066.pdf
74LVC4066BQ,115
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14DHVQFN
Packaging: Tape & Reel (TR)
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BT134-600G,127 BT134-600G.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 4A SOT82-3
Packaging: Tube
Package / Case: SOT-82
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-82-3
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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Z0103MN,135 Z0103MN.pdf
Z0103MN,135
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A SC73
Packaging: Tape & Reel (TR)
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PMBT2222A,215 PMBT2222.pdf
PMBT2222A,215
Виробник: NXP USA Inc.
Description: TRANS NPN SW 600MA 30V SOT23
Packaging: Tape & Reel (TR)
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PMBT2222A,235 PMBT2222.pdf
PMBT2222A,235
Виробник: NXP USA Inc.
Description: TRANS NPN 40V 600MA SOT23
Packaging: Tape & Reel (TR)
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MWCT1200CFM MWCT1000DS.pdf
MWCT1200CFM
Виробник: NXP USA Inc.
Description: IC MULTI COIL 5W 5V 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 32-HVQFN (5x5)
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MPF5300AMBA0ES PF5300.pdf
MPF5300AMBA0ES
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MVR5510AVMALTS VR5510.pdf
Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S912XET256BVAG MC9S12XEP100RMV1.pdf
S912XET256BVAG
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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74LVC1G80GV,125 PHGLS25117-1.pdf?t.download=true&u=5oefqw
74LVC1G80GV,125
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL SC74A
Packaging: Tape & Reel (TR)
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PDTC144TE,115 PDTC144T_SERIES.pdf
PDTC144TE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
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BZV55-C18,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C18,135
Виробник: NXP USA Inc.
Description: DIODE ZENER 18V 500MW LLDS
Packaging: Tape & Reel (TR)
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UBA2024BT/N1,518 UBA2024.pdf
UBA2024BT/N1,518
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
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HEF4011BT,653 HEF4011B.pdf
HEF4011BT,653
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
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HEF4011BT,652 HEF4011B.pdf
HEF4011BT,652
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
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HEF4081BT,653 HEF4081B.pdf
HEF4081BT,653
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
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74HCT173DB,112 74HC_HCT173.pdf
74HCT173DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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74HCT173D,653 74HC_HCT173.pdf
74HCT173D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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74HC390DB,112 74HC_HCT390.pdf
74HC390DB,112
Виробник: NXP USA Inc.
Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390D,652 74HC_HCT390.pdf
74HC390D,652
Виробник: NXP USA Inc.
Description: IC DUAL DECADE RIPP COUNT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390PW,112 74HC_HCT390.pdf
74HC390PW,112
Виробник: NXP USA Inc.
Description: IC DUAL DEC RIPPLE COUNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC390D,653 74HC_HCT390.pdf
74HC390D,653
Виробник: NXP USA Inc.
Description: IC DUAL DEC RIPPLE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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74HC4017DB,112 74HC_HCT4017.pdf
74HC4017DB,112
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HC4017D,653 74HC_HCT4017.pdf
74HC4017D,653
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HC4017D,652 74HC_HCT4017.pdf
74HC4017D,652
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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