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BTA201-800E,112 NXP USA Inc. bta201-800e.pdf Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-600E,126 NXP USA Inc. bta201-600b.pdf Description: TRIAC 3-QUADRANT 600V 1A TO-92
Packaging: Tape & Box (TB)
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74HC173D,653 74HC173D,653 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173D,652 74HC173D,652 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173PW,118 74HC173PW,118 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173DB,112 74HC173DB,112 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC161D,653 74HC161D,653 NXP USA Inc. 74HC161.pdf Description: IC SYNC 4BIT BINARY COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 48 MHz
Number of Bits per Element: 4
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74HC157D,653 74HC157D,653 NXP USA Inc. 74HC_HCT157.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC157D,652 74HC157D,652 NXP USA Inc. 74HC_HCT157.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC157DB,118 74HC157DB,118 NXP USA Inc. 74HC_HCT157.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74HC157DB,112 74HC157DB,112 NXP USA Inc. 74HC_HCT157.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74HC257D,653 74HC257D,653 NXP USA Inc. 74HC_HCT257.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC257D,652 74HC257D,652 NXP USA Inc. 74HC_HCT257.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC257PW,112 74HC257PW,112 NXP USA Inc. 74HC_HCT257.pdf Description: IC MULTIPLEXER 4 X 2:1 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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74HC257DB,112 74HC257DB,112 NXP USA Inc. 74HC_HCT257.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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BZV55-C33,115 BZV55-C33,115 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 33V 500MW LLDS
Packaging: Tape & Reel (TR)
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BT137-600E/L01,127 NXP USA Inc. bt137-600e.pdf Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BTA412Y-600B,127 BTA412Y-600B,127 NXP USA Inc. BTA412Y-600B-127.PDF Description: TRIAC 600V 12A TO220AB
Packaging: Tube
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BTA412Y-600C,127 NXP USA Inc. bta412y-600c.pdf Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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BTA416Y-600B,127 NXP USA Inc. bta416y-600b.pdf Description: TRIAC 600V 16A TO220AB
Packaging: Tube
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74HCT74D,653 74HCT74D,653 NXP USA Inc. 74HC_HCT74.pdf Description: IC FF D-TYPE DOUBLE 1-BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT74D,652 74HCT74D,652 NXP USA Inc. 74HC_HCT74.pdf Description: IC FF D-TYPE DOUBLE 1-BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74LVC1G19GV,125 74LVC1G19GV,125 NXP USA Inc. 74LVC1G19.pdf Description: IC DECODER/DEMUX 1-OF-2 6TSOP
Packaging: Tape & Reel (TR)
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BF820W,115 NXP USA Inc. BF820W.pdf Description: TRANS NPN 300V 50MA SOT323
Packaging: Tape & Reel (TR)
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BF820,215 NXP USA Inc. BF820.pdf Description: TRANS NPN 300V 50MA SOT23
Packaging: Tape & Reel (TR)
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MCXA145VMP NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 614 шт:
термін постачання 21-31 дні (днів)
1+383.57 грн
10+280.82 грн
25+258.67 грн
100+219.94 грн
250+209.07 грн
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BRKFXPS7XXX-PCB NXP USA Inc. BRKFXPS7XXX-PCB.pdf Description: BRKFXPS7XXX-PCB
Packaging: Bulk
Contents: Board(s)
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2N7002BKV,115 2N7002BKV,115 NXP USA Inc. 2N7002BKV.pdf Description: MOSFET 2N-CH 60V 0.34A SOT666
Packaging: Tape & Reel (TR)
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NTS0103GU10,115 NTS0103GU10,115 NXP USA Inc. NTS0103.pdf Description: IC XLTR VL BIDIR 10-XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
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NTS0103GU10,115 NTS0103GU10,115 NXP USA Inc. NTS0103.pdf Description: IC XLTR VL BIDIR 10-XQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 1796 шт:
термін постачання 21-31 дні (днів)
6+67.54 грн
10+46.27 грн
25+41.66 грн
100+34.32 грн
250+32.04 грн
500+30.67 грн
1000+29.05 грн
Мінімальне замовлення: 6
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BZT52H-C15,115 NXP USA Inc. BZT52H_SER.pdf Description: DIODE ZENER 15V 375MW SOD123F
Packaging: Tape & Reel (TR)
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S9S08SG32E1CTLR S9S08SG32E1CTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCIMX6D5EZK08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6Q5EZK08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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SI2304DS,215 SI2304DS,215 NXP USA Inc. SI2304DS_Aug17%2C2001.pdf Description: MOSFET N-CH 30V 1.7A SOT23
Packaging: Tape & Reel (TR)
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74HC14DB,112 74HC14DB,112 NXP USA Inc. 74HC_HCT14.pdf Description: IC HEX INVERT SCHM TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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74LVC3G17DP,125 74LVC3G17DP,125 NXP USA Inc. 74LVC3G17.pdf Description: IC BUFF NON-INVERT 5.5V 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
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T4160NSN7QTB T4160NSN7QTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4240NSE7QTB T4240NSE7QTB NXP USA Inc. T4240.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
на замовлення 3240 шт:
термін постачання 21-31 дні (днів)
1+102846.32 грн
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T4240NSE7QTB T4240NSE7QTB NXP USA Inc. T4240.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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1N4739A,113 1N4739A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 9.1V 1W DO41
Packaging: Tape & Reel (TR)
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74HC4017BQ,115 74HC4017BQ,115 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HCT4017BQ,115 74HCT4017BQ,115 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
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1N4741A,113 1N4741A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 11V 1W DO41
Packaging: Tape & Reel (TR)
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74HCT4053D,112 74HCT4053D,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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74HCT4053DB,112 74HCT4053DB,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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PCA9451A-EVK PCA9451A-EVK NXP USA Inc. UM11883.pdf Description: EVAL KIT FOR PCA9451
Packaging: Bulk
Contents: Board(s)
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термін постачання 21-31 дні (днів)
1+11359.93 грн
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RD33774PDSTEVB NXP USA Inc. getting-started-with-the-rd33774pdstevb-evaluation-board:GS-RD33774PDSTEVB Description: RD33774PDSTEVB
Packaging: Box
Contents: Board(s)
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MPC860SRZQ80D4 MPC860SRZQ80D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PDTA113ZT,215 PDTA113ZT,215 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 250MW TO236AB
Packaging: Tape & Reel (TR)
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PUMD13,135 PUMD13,135 NXP USA Inc. PEMD13_PUMD13.pdf Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PUMD18,115 PUMD18,115 NXP USA Inc. PEMD18_PUMD18.pdf Description: TRANS PREBIASED DUAL 6TSSOP
Packaging: Tape & Reel (TR)
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PUMD20,115 PUMD20,115 NXP USA Inc. PEMD20_PUMD20.pdf Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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MML09211HT1 MML09211HT1 NXP USA Inc. MML09211HT1.pdf Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
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74HC126N,652 74HC126N,652 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFFER NON-INVERT 6V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
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PCA9670D,512 PCA9670D,512 NXP USA Inc. PCA9670.pdf Description: IC XPNDR 1MHZ I2C 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PESD3V3U1BCSFYL PESD3V3U1BCSFYL NXP USA Inc. PESD3V3U1BCSF.pdf Description: TVS DIODE 3.3VWM 12VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 5.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5.4A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 4.5V
Voltage - Clamping (Max) @ Ipp: 12V
Power Line Protection: No
на замовлення 614872 шт:
термін постачання 21-31 дні (днів)
2224+9.55 грн
Мінімальне замовлення: 2224
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74HC374D,652 74HC374D,652 NXP USA Inc. PHGLS06009-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 28ns @ 6V, 50pF
Number of Bits per Element: 8
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MPC859DSLZP50A MPC859DSLZP50A NXP USA Inc. MPC866%2C859_Man.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PBLS6022D,115 PBLS6022D,115 NXP USA Inc. PBLS6022D.pdf Description: TRANS PNP PREBIAS/PNP 6TSOP
Packaging: Tape & Reel (TR)
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BTA201-800E,112 bta201-800e.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-600E,126 bta201-600b.pdf
Виробник: NXP USA Inc.
Description: TRIAC 3-QUADRANT 600V 1A TO-92
Packaging: Tape & Box (TB)
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74HC173D,653 74HC_HCT173.pdf
74HC173D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173D,652 74HC_HCT173.pdf
74HC173D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173PW,118 74HC_HCT173.pdf
74HC173PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173DB,112 74HC_HCT173.pdf
74HC173DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC161D,653 74HC161.pdf
74HC161D,653
Виробник: NXP USA Inc.
Description: IC SYNC 4BIT BINARY COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 48 MHz
Number of Bits per Element: 4
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74HC157D,653 74HC_HCT157.pdf
74HC157D,653
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC157D,652 74HC_HCT157.pdf
74HC157D,652
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC157DB,118 74HC_HCT157.pdf
74HC157DB,118
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74HC157DB,112 74HC_HCT157.pdf
74HC157DB,112
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74HC257D,653 74HC_HCT257.pdf
74HC257D,653
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC257D,652 74HC_HCT257.pdf
74HC257D,652
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC257PW,112 74HC_HCT257.pdf
74HC257PW,112
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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74HC257DB,112 74HC_HCT257.pdf
74HC257DB,112
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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BZV55-C33,115 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C33,115
Виробник: NXP USA Inc.
Description: DIODE ZENER 33V 500MW LLDS
Packaging: Tape & Reel (TR)
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BT137-600E/L01,127 bt137-600e.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BTA412Y-600B,127 BTA412Y-600B-127.PDF
BTA412Y-600B,127
Виробник: NXP USA Inc.
Description: TRIAC 600V 12A TO220AB
Packaging: Tube
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BTA412Y-600C,127 bta412y-600c.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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BTA416Y-600B,127 bta416y-600b.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 16A TO220AB
Packaging: Tube
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74HCT74D,653 74HC_HCT74.pdf
74HCT74D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DOUBLE 1-BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT74D,652 74HC_HCT74.pdf
74HCT74D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DOUBLE 1-BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74LVC1G19GV,125 74LVC1G19.pdf
74LVC1G19GV,125
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1-OF-2 6TSOP
Packaging: Tape & Reel (TR)
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BF820W,115 BF820W.pdf
Виробник: NXP USA Inc.
Description: TRANS NPN 300V 50MA SOT323
Packaging: Tape & Reel (TR)
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BF820,215 BF820.pdf
Виробник: NXP USA Inc.
Description: TRANS NPN 300V 50MA SOT23
Packaging: Tape & Reel (TR)
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MCXA145VMP MCXAP100M96FS6.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 614 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+383.57 грн
10+280.82 грн
25+258.67 грн
100+219.94 грн
250+209.07 грн
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BRKFXPS7XXX-PCB BRKFXPS7XXX-PCB.pdf
Виробник: NXP USA Inc.
Description: BRKFXPS7XXX-PCB
Packaging: Bulk
Contents: Board(s)
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2N7002BKV,115 2N7002BKV.pdf
2N7002BKV,115
Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 60V 0.34A SOT666
Packaging: Tape & Reel (TR)
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 10-XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 10-XQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 1796 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+67.54 грн
10+46.27 грн
25+41.66 грн
100+34.32 грн
250+32.04 грн
500+30.67 грн
1000+29.05 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
BZT52H-C15,115 BZT52H_SER.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 15V 375MW SOD123F
Packaging: Tape & Reel (TR)
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S9S08SG32E1CTLR MC9S08SG32.pdf
S9S08SG32E1CTLR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCIMX6D5EZK08AD IMX6DQAEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6Q5EZK08AD IMX6DQAEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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SI2304DS,215 SI2304DS_Aug17%2C2001.pdf
SI2304DS,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT23
Packaging: Tape & Reel (TR)
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74HC14DB,112 74HC_HCT14.pdf
74HC14DB,112
Виробник: NXP USA Inc.
Description: IC HEX INVERT SCHM TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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74LVC3G17DP,125 74LVC3G17.pdf
74LVC3G17DP,125
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
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T4160NSN7QTB T4240T4160FS.pdf
T4160NSN7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4240NSE7QTB T4240.pdf
T4240NSE7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
на замовлення 3240 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+102846.32 грн
В кошику  од. на суму  грн.
T4240NSE7QTB T4240.pdf
T4240NSE7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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1N4739A,113 1N4728A_SER.pdf
1N4739A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 1W DO41
Packaging: Tape & Reel (TR)
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74HC4017BQ,115 74HC_HCT4017.pdf
74HC4017BQ,115
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HCT4017BQ,115 74HC_HCT4017.pdf
74HCT4017BQ,115
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
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1N4741A,113 1N4728A_SER.pdf
1N4741A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 11V 1W DO41
Packaging: Tape & Reel (TR)
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74HCT4053D,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HCT4053D,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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74HCT4053DB,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HCT4053DB,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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PCA9451A-EVK UM11883.pdf
PCA9451A-EVK
Виробник: NXP USA Inc.
Description: EVAL KIT FOR PCA9451
Packaging: Bulk
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11359.93 грн
В кошику  од. на суму  грн.
RD33774PDSTEVB getting-started-with-the-rd33774pdstevb-evaluation-board:GS-RD33774PDSTEVB
Виробник: NXP USA Inc.
Description: RD33774PDSTEVB
Packaging: Box
Contents: Board(s)
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MPC860SRZQ80D4 MPC860EC.pdf
MPC860SRZQ80D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PDTA113ZT,215 PDTA113Z_SER.pdf
PDTA113ZT,215
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW TO236AB
Packaging: Tape & Reel (TR)
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PUMD13,135 PEMD13_PUMD13.pdf
PUMD13,135
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PUMD18,115 PEMD18_PUMD18.pdf
PUMD18,115
Виробник: NXP USA Inc.
Description: TRANS PREBIASED DUAL 6TSSOP
Packaging: Tape & Reel (TR)
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PUMD20,115 PEMD20_PUMD20.pdf
PUMD20,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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MML09211HT1 MML09211HT1.pdf
MML09211HT1
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
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74HC126N,652 74HC%28T%29126.pdf
74HC126N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
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PCA9670D,512 PCA9670.pdf
PCA9670D,512
Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PESD3V3U1BCSFYL PESD3V3U1BCSF.pdf
PESD3V3U1BCSFYL
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 12VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 5.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5.4A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 4.5V
Voltage - Clamping (Max) @ Ipp: 12V
Power Line Protection: No
на замовлення 614872 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2224+9.55 грн
Мінімальне замовлення: 2224
В кошику  од. на суму  грн.
74HC374D,652 PHGLS06009-1.pdf?t.download=true&u=5oefqw
74HC374D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 28ns @ 6V, 50pF
Number of Bits per Element: 8
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MPC859DSLZP50A MPC866%2C859_Man.pdf
MPC859DSLZP50A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PBLS6022D,115 PBLS6022D.pdf
PBLS6022D,115
Виробник: NXP USA Inc.
Description: TRANS PNP PREBIAS/PNP 6TSOP
Packaging: Tape & Reel (TR)
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