Сторінка 13 з 1015

Обрати Сторінку: [ << Попередня Сторінка ] 1 8 9 10 11 12 13 14 15 16 17 18 101 202 303 404 505 606 707 808 909 1010 1015 [ Наступна Сторінка >> ]

Назва	Виробник	Інформація	Доступність	Ціна
114-83-306-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-306-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-308-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-308-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 8POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-308-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-310-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-310-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-310-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-312-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-312-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 12POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-314-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-314-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-314-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-316-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 16POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-316-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 16POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-316-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-318-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 18POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-318-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 18POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-318-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-320-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 20POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-320-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 20POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-320-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-322-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 22POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-324-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-324-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-324-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-328-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-328-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-328-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-420-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-422-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 22POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-424-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-428-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-432-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-624-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-624-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 24POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-628-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-628-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-83-628-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-632-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 32POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-632-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 32POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-632-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-83-636-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 36POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-640-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 40POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-640-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 40POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-642-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 42POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-642-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 42POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-83-648-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 48POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-87-210-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-87-304-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 4POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass	товару немає в наявності	В кошику од. на суму грн.
114-87-306-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 6POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-87-306-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 6POS GOLD	товару немає в наявності	В кошику од. на суму грн.
114-87-310-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-310-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-312-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-312-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-314-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-314-41-134161	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-314-41-134191	Preci-Dip	Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.
114-87-316-41-117101	Preci-Dip	Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active	товару немає в наявності	В кошику од. на суму грн.

114-83-306-41-134161

Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-306-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-83-308-41-117101

Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-308-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-308-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-310-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-310-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-83-310-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-83-312-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-312-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-314-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-314-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-83-314-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-83-316-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-316-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-316-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-318-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-318-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-83-318-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-320-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-320-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-320-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-322-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-324-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-324-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-83-324-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-83-328-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-328-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-328-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-420-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-422-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-424-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-428-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-432-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-624-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-624-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-628-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-83-628-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-83-628-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-83-632-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-632-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-632-41-134191

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-83-636-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-640-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-640-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-642-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-642-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-83-648-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-87-210-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-87-304-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

товару немає в наявності

В кошику од. на суму грн.

114-87-306-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-87-306-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD

товару немає в наявності

В кошику од. на суму грн.

114-87-310-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-87-310-41-134161

товару немає в наявності

В кошику од. на суму грн.

114-87-312-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-87-312-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-87-314-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-87-314-41-134161

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.

114-87-314-41-134191

товару немає в наявності

В кошику од. на суму грн.

114-87-316-41-117101

Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active

товару немає в наявності

В кошику од. на суму грн.