| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 114-87-324-41-134161 | Preci-Dip |
 Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 114-87-324-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 114-87-328-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
114-87-420-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
114-87-424-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
114-87-428-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
114-87-432-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
114-87-624-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 114-87-624-41-134161 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 114-87-628-41-134161 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 114-87-628-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 114-87-632-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
114-87-636-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
114-87-640-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 114-87-640-41-134161 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
114-87-642-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 114-87-642-41-134161 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
114-87-648-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-210-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 115-83-304-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-306-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-306-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-308-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-308-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-310-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-310-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-312-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-314-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-314-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-316-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-316-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-318-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-318-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-320-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 237 шт: термін постачання 21-31 дні (днів) |
|
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 |
115-83-320-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-322-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-322-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-324-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-324-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-328-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-328-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-420-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-420-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-422-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-422-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-424-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-424-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-428-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-428-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 115-83-432-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
115-83-610-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-624-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-624-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-628-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-628-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-632-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-632-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-636-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-636-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
115-83-640-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 114-87-324-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-324-41-134191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-328-41-134191 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-420-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-424-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-428-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-432-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-624-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-624-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-628-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-628-41-134191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-632-41-134191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-636-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-640-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-640-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-642-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-642-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 114-87-648-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-210-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-304-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-306-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-306-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-308-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-308-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-310-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-310-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-312-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-314-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-314-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-316-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-316-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-318-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-318-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-320-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 237 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 196.61 грн |
| 20+ | 164.55 грн |
| 100+ | 147.02 грн |
| 115-83-320-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-322-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-322-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-324-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-324-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-328-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-328-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-420-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-420-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-422-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-422-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-424-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-424-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-428-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-428-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-432-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-610-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-624-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-624-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-628-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-628-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-632-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-632-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-636-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-636-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 115-83-640-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.