| Фото | Назва | Виробник | Інформація | Доступність | Ціна | 
|---|---|---|---|---|---|
|   | 116-87-420-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-007101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-008101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-009101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-011101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-012101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-013101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-420-41-018101 | Preci-Dip |  Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-001101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-002101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-007101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-008101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-009101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-011101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-012101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-422-41-013101 | Preci-Dip |  Description: CONN IC DIP SOCKET 22POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-001101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-002101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-003101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-007101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-008101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-009101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-011101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-012101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-013101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-424-41-018101 | Preci-Dip |  Description: CONN IC DIP SOCKET 24POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-001101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-002101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-003101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-007101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-008101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-009101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-011101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-012101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-013101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-428-41-018101 | Preci-Dip |  Description: CONN IC DIP SOCKET 28POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-001101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-002101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-003101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-007101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-008101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-009101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-011101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-012101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-013101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-432-41-018101 | Preci-Dip |  Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-610-41-001101 | Preci-Dip |  Description: CONN IC DIP SOCKET 10POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-610-41-002101 | Preci-Dip |  Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-610-41-003101 | Preci-Dip |  Description: CONN IC DIP SOCKET 10POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-610-41-004101 | Preci-Dip |  Description: CONN IC DIP SOCKET 10POS GOLD | товару немає в наявності | В кошику од. на суму грн. | 
|   | 116-87-610-41-006101 | Preci-Dip |  Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | товару немає в наявності | В кошику од. на суму грн. | 
| 116-87-420-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-007101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-008101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-009101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-011101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-012101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-013101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-420-41-018101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-001101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-002101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-007101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-008101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-009101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-011101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-012101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-422-41-013101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
    Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-001101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-002101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-003101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-007101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-008101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-009101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-011101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-012101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-013101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-424-41-018101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
    Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-001101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-002101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-003101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-007101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-008101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-009101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-011101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-012101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-013101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-428-41-018101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
    Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-001101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-002101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-003101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-007101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-008101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-009101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-011101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-012101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-013101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-432-41-018101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-610-41-001101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
    Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-610-41-002101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-610-41-003101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
    Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-610-41-004101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
    Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
    В кошику
     од. на суму     грн.
| 116-87-610-41-006101 |  | 
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
    Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
    В кошику
     од. на суму     грн.