| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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813-SS-008-30-001191 | Preci-Dip |
Description: CONN SPRING PISTON 8POS SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount Material: Brass Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 19.7µin (0.50µm) Number of Contacts: 8 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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813-SS-008-30-003191 | Preci-Dip |
 Description: CONN SPRING PISTON 8POS SMDPackaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount Material: Brass Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 19.7µin (0.50µm) Number of Contacts: 8 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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813-SS-020-30-003191 | Preci-Dip |
Description: CONN SPRING PISTON 20POS SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount Material: Brass Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 19.7µin (0.50µm) Number of Contacts: 20 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 831-87-009-30-001191 | Preci-Dip | Description: SOCKET 4.2 MM SOLDER TAIL SINGLE |
на замовлення 4480 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||||
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832-10-004-30-001191 | Preci-Dip |
Description: CONN HEADER SMD 4POS 2MM Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 4 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Insulation Height: 0.110" (2.79mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.079" (2.00mm) Contact Length - Mating: 0.141" (3.60mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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832-10-014-30-001191 | Preci-Dip | Description: CONN HDR 14POS 2MM SMD |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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851-87-003-30-001191 | Preci-Dip | Description: CONN SOCKET 3POS 0.05 GOLD SMD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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851-87-004-30-001191 | Preci-Dip |
Description: CONN SOCKET 4POS 0.05 GOLD SMD Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Socket Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Insulation Height: 0.203" (5.16mm) Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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851-87-008-30-001191 | Preci-Dip | Description: SOCKET SOLDER TAIL SINGLE ROW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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851-87-010-30-001191 | Preci-Dip |
Description: CONN SOCKET 10POS 0.05 GOLD SMD Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Socket Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Insulation Height: 0.203" (5.16mm) Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 851-87-011-30-001191 | Preci-Dip | Description: SOCKET SOLDER TAIL SINGLE ROW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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8FM-78-0002-02-278191 | Preci-Dip |
Description: CONN SOCKET 2P 0.1 GOLD SMD R/A Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Insulation Height: 0.096" (2.44mm) Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8FM-78-0003-02-278191 | Preci-Dip |
Description: CONN SOCKET 3P 0.1 GOLD SMD R/A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8FM-78-0004-02-278191 | Preci-Dip |
Description: CONN SOCKET 4P 0.1 GOLD SMD R/A Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.096" (2.44mm) Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8MM-11-0002-02-279191 | Preci-Dip |
Description: CONN HEADER SMD R/A 2POS 2.54MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header Voltage Rating: 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 2 Number of Rows: 1 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Insulation Height: 0.096" (2.44mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Contact Length - Mating: 0.157" (4.00mm) |
на замовлення 2076 шт: термін постачання 21-31 дні (днів) |
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8MM-11-0003-02-279191 | Preci-Dip |
Description: CONN HEADER SMD R/A 3POS 2.54MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header Voltage Rating: 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 3 Number of Rows: 1 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Circular Insulation Height: 0.096" (2.44mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Contact Length - Mating: 0.157" (4.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8MM-11-0004-02-279191 | Preci-Dip |
Description: CONN HEADER SMD R/A 4POS 2.54MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header Voltage Rating: 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Circular Insulation Height: 0.096" (2.44mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Contact Length - Mating: 0.157" (4.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8PM-11-0002-02-131191 | Preci-Dip |
Description: CONN SPRING PISTON 2POS R/A SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Material: Brass Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 2 Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8PM-11-0003-02-131191 | Preci-Dip |
Description: CONN SPRING PISTON 3POS R/A SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Material: Brass Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 3 Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8PM-11-0004-02-131191 | Preci-Dip |
Description: CONN SPRING PISTON 4POS R/A SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Material: Brass Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 4 Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8PM-11-0007-02-131191 | Preci-Dip |
Description: CONN SPRING PISTON 7POS R/A SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Material: Brass Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 7 Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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8PM-11-0008-02-131191 | Preci-Dip |
Description: CONN SPRING PISTON 8POS R/A SMD Packaging: Cut Tape (CT) Connector Type: Piston Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Material: Brass Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 8 Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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802-80-016-30-001191 | Preci-Dip | Description: CONN HDR 16POS 0.100 SMD |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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811-S1-002-30-017191 | Preci-Dip | Description: CONN SPRING LOAD 2POS SNGL SMD |
на замовлення 519 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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811-S1-004-30-015191 | Preci-Dip | Description: CONN SPRING LOAD 4POS SNGL SMD |
на замовлення 533 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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811-SS-002-30-001191 | Preci-Dip | Description: CONN SPRING LOAD 2POS SNGL SMD |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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811-SS-002-30-002191 | Preci-Dip | Description: CONN SPRING LOAD 2POS SNGL SMD |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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811-SS-004-30-002191 | Preci-Dip | Description: CONN SPRING LOAD 4POS SNGL SMD |
на замовлення 131 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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813-S1-008-30-016191 | Preci-Dip | Description: CONN SPRING LOAD 8POS DUAL SMD |
на замовлення 581 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
| 831-87-009-30-001191 | Preci-Dip | Description: SOCKET 4.2 MM SOLDER TAIL SINGLE |
на замовлення 4480 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||||
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832-10-014-30-001191 | Preci-Dip | Description: CONN HDR 14POS 2MM SMD |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
| 851-87-011-30-001191 | Preci-Dip | Description: SOCKET SOLDER TAIL SINGLE ROW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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110-83-064-01-505101 | Preci-Dip |
Description: CONN IC DIP SOCKET 64POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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110-83-210-01-742101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5), 6 Loaded Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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110-83-210-01-839101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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110-83-210-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 110-83-210-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-210-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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110-83-304-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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110-83-304-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 110-83-304-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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110-83-306-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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110-83-306-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 110-83-306-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-306-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-306-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
110-83-306-41-605101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
110-83-308-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
110-83-308-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 110-83-308-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 4657 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
| 110-83-308-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-308-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
110-83-308-41-605101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
110-83-310-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
110-83-310-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 110-83-310-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-310-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 110-83-310-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
110-83-312-01-680101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6), 6 Loaded Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
110-83-312-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 813-SS-008-30-001191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 8POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 8
Number of Rows: 2
Description: CONN SPRING PISTON 8POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 8
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 813-SS-008-30-003191 |
|
Виробник: Preci-Dip
Description: CONN SPRING PISTON 8POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 8
Number of Rows: 2
Description: CONN SPRING PISTON 8POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 8
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 813-SS-020-30-003191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 20POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 20
Number of Rows: 2
Description: CONN SPRING PISTON 20POS SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount
Material: Brass
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 19.7µin (0.50µm)
Number of Contacts: 20
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 831-87-009-30-001191 |
Виробник: Preci-Dip
Description: SOCKET 4.2 MM SOLDER TAIL SINGLE
Description: SOCKET 4.2 MM SOLDER TAIL SINGLE
на замовлення 4480 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 832-10-004-30-001191 |
Виробник: Preci-Dip
Description: CONN HEADER SMD 4POS 2MM
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.110" (2.79mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.141" (3.60mm)
Description: CONN HEADER SMD 4POS 2MM
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.110" (2.79mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.141" (3.60mm)
товару немає в наявності
В кошику
од. на суму грн.
| 832-10-014-30-001191 |
Виробник: Preci-Dip
Description: CONN HDR 14POS 2MM SMD
Description: CONN HDR 14POS 2MM SMD
на замовлення 600 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 851-87-003-30-001191 |
Виробник: Preci-Dip
Description: CONN SOCKET 3POS 0.05 GOLD SMD
Description: CONN SOCKET 3POS 0.05 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
| 851-87-004-30-001191 |
Виробник: Preci-Dip
Description: CONN SOCKET 4POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.203" (5.16mm)
Number of Rows: 1
Description: CONN SOCKET 4POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.203" (5.16mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 851-87-008-30-001191 |
Виробник: Preci-Dip
Description: SOCKET SOLDER TAIL SINGLE ROW
Description: SOCKET SOLDER TAIL SINGLE ROW
товару немає в наявності
В кошику
од. на суму грн.
| 851-87-010-30-001191 |
Виробник: Preci-Dip
Description: CONN SOCKET 10POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.203" (5.16mm)
Number of Rows: 1
Description: CONN SOCKET 10POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.203" (5.16mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 851-87-011-30-001191 |
Виробник: Preci-Dip
Description: SOCKET SOLDER TAIL SINGLE ROW
Description: SOCKET SOLDER TAIL SINGLE ROW
товару немає в наявності
В кошику
од. на суму грн.
| 8FM-78-0002-02-278191 |
|
Виробник: Preci-Dip
Description: CONN SOCKET 2P 0.1 GOLD SMD R/A
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.096" (2.44mm)
Number of Rows: 1
Description: CONN SOCKET 2P 0.1 GOLD SMD R/A
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.096" (2.44mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8FM-78-0003-02-278191 |
|
Виробник: Preci-Dip
Description: CONN SOCKET 3P 0.1 GOLD SMD R/A
Description: CONN SOCKET 3P 0.1 GOLD SMD R/A
товару немає в наявності
В кошику
од. на суму грн.
| 8FM-78-0004-02-278191 |
|
Виробник: Preci-Dip
Description: CONN SOCKET 4P 0.1 GOLD SMD R/A
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.096" (2.44mm)
Number of Rows: 1
Description: CONN SOCKET 4P 0.1 GOLD SMD R/A
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.096" (2.44mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8MM-11-0002-02-279191 |
|
Виробник: Preci-Dip
Description: CONN HEADER SMD R/A 2POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 2
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER SMD R/A 2POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 2
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 2076 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 146.43 грн |
| 10+ | 107.82 грн |
| 25+ | 96.99 грн |
| 50+ | 84.13 грн |
| 100+ | 77.87 грн |
| 250+ | 70.46 грн |
| 500+ | 64.38 грн |
| 1000+ | 59.92 грн |
| 8MM-11-0003-02-279191 |
|
Виробник: Preci-Dip
Description: CONN HEADER SMD R/A 3POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER SMD R/A 3POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| 8MM-11-0004-02-279191 |
|
Виробник: Preci-Dip
Description: CONN HEADER SMD R/A 4POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER SMD R/A 4POS 2.54MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Insulation Height: 0.096" (2.44mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Length - Mating: 0.157" (4.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| 8PM-11-0002-02-131191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 2POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 2
Number of Rows: 1
Description: CONN SPRING PISTON 2POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 2
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8PM-11-0003-02-131191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 3POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 3
Number of Rows: 1
Description: CONN SPRING PISTON 3POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 3
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8PM-11-0004-02-131191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 4POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 4
Number of Rows: 1
Description: CONN SPRING PISTON 4POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 4
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8PM-11-0007-02-131191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 7POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 7
Number of Rows: 1
Description: CONN SPRING PISTON 7POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 7
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 8PM-11-0008-02-131191 |
Виробник: Preci-Dip
Description: CONN SPRING PISTON 8POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 8
Number of Rows: 1
Description: CONN SPRING PISTON 8POS R/A SMD
Packaging: Cut Tape (CT)
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Material: Brass
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 8
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 802-80-016-30-001191 |
Виробник: Preci-Dip
Description: CONN HDR 16POS 0.100 SMD
Description: CONN HDR 16POS 0.100 SMD
на замовлення 15 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 811-S1-002-30-017191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 2POS SNGL SMD
Description: CONN SPRING LOAD 2POS SNGL SMD
на замовлення 519 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 811-S1-004-30-015191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 4POS SNGL SMD
Description: CONN SPRING LOAD 4POS SNGL SMD
на замовлення 533 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 811-SS-002-30-001191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 2POS SNGL SMD
Description: CONN SPRING LOAD 2POS SNGL SMD
на замовлення 19 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 811-SS-002-30-002191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 2POS SNGL SMD
Description: CONN SPRING LOAD 2POS SNGL SMD
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 811-SS-004-30-002191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 4POS SNGL SMD
Description: CONN SPRING LOAD 4POS SNGL SMD
на замовлення 131 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 813-S1-008-30-016191 |
Виробник: Preci-Dip
Description: CONN SPRING LOAD 8POS DUAL SMD
Description: CONN SPRING LOAD 8POS DUAL SMD
на замовлення 581 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 831-87-009-30-001191 |
Виробник: Preci-Dip
Description: SOCKET 4.2 MM SOLDER TAIL SINGLE
Description: SOCKET 4.2 MM SOLDER TAIL SINGLE
на замовлення 4480 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 832-10-014-30-001191 |
Виробник: Preci-Dip
Description: CONN HDR 14POS 2MM SMD
Description: CONN HDR 14POS 2MM SMD
на замовлення 600 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 851-87-011-30-001191 |
Виробник: Preci-Dip
Description: SOCKET SOLDER TAIL SINGLE ROW
Description: SOCKET SOLDER TAIL SINGLE ROW
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-064-01-505101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-210-01-742101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5), 6 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5), 6 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-210-01-839101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-210-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-210-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-210-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-304-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-304-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-304-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-105161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-306-41-605101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-308-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-308-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-308-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 4657 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 99.48 грн |
| 52+ | 72.86 грн |
| 104+ | 69.39 грн |
| 520+ | 58.12 грн |
| 1040+ | 55.35 грн |
| 110-83-308-41-105161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-308-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-308-41-605101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-310-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-310-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-310-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-310-41-105161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-310-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-312-01-680101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6), 6 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6), 6 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 110-83-312-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.