0430450606 Molex
| Кількість | Ціна без ПДВ |
|---|---|
| 1800+ | 122.94 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
21-31 дні (днів)
Мінімальна партія:
1800 шт
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Технічний опис 0430450606 Molex
Description: CONN HEADER SMD R/A 6POS 3MM, Features: Board Lock, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): 8A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 6, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Інші пропозиції 0430450606 за ціною від 106.43 грн до 245.67 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
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0430450606 | Molex |
 Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
на замовлення 737 шт: термін постачання 21-31 дні (днів) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
на замовлення 737 шт: термін постачання 21-31 дні (днів) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
на замовлення 3600 шт: термін постачання 21-31 дні (днів) |
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 |
0430450606 | Molex |
Description: CONN HEADER SMD R/A 6POS 3MM Features: Board Lock Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 6 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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0430450606 | Molex |
Description: CONN HEADER SMD R/A 6POS 3MM Features: Board Lock Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 6 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 8074 шт: термін постачання 21-31 дні (днів) |
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|
0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
на замовлення 1800 шт: термін постачання 21-31 дні (днів) |
|
| 0430450606 |
|
Виробник: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
на замовлення 737 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 115+ | 127.40 грн |
| 116+ | 126.59 грн |
| 117+ | 121.29 грн |
| 250+ | 111.59 грн |
| 500+ | 106.43 грн |
| 0430450606 |
|
Виробник: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
на замовлення 737 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 128.20 грн |
| 10+ | 127.40 грн |
| 25+ | 126.59 грн |
| 100+ | 121.29 грн |
| 250+ | 111.59 грн |
| 500+ | 106.43 грн |
| 0430450606 |
|
Виробник: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
на замовлення 3600 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3600+ | 150.01 грн |
| 0430450606 |
|
Виробник: Molex
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 200+ | 158.10 грн |
| 400+ | 144.98 грн |
| 600+ | 140.89 грн |
| 1000+ | 127.54 грн |
| 1400+ | 124.55 грн |
| 2000+ | 121.46 грн |
| 0430450606 |
|
Виробник: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 800+ | 196.69 грн |
| 0430450606 |
|
Виробник: Molex
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
на замовлення 8074 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 206.31 грн |
| 10+ | 168.79 грн |
| 25+ | 158.20 грн |
| 50+ | 141.37 грн |
| 100+ | 134.62 грн |
| 0430450606 |
|
Виробник: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
на замовлення 1800 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1800+ | 245.67 грн |