0430451819 Molex
Виробник: Molex
Description: CONN HEADER SMD 18POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 18
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
| Кількість | Ціна без ПДВ |
|---|---|
| 200+ | 374.54 грн |
| 400+ | 343.47 грн |
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Технічний опис 0430451819 Molex
Description: CONN HEADER SMD 18POS 3MM, Row Spacing - Mating: 0.118" (3.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.390" (9.91mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.118" (3.00mm), Insulation Color: Black, Contact Material: Brass, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 18, Mounting Type: Surface Mount, Current Rating (Amps): 8A, Voltage Rating: 600V, Connector Type: Header, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції 0430451819 за ціною від 330.57 грн до 475.30 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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0430451819 | Molex |
Conn Wire to Board HDR 18 POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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0430451819 | Molex |
Description: CONN HEADER SMD 18POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 18 Mounting Type: Surface Mount Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) |
на замовлення 566 шт: термін постачання 21-31 дні (днів) |
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| 0430451819 |
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Виробник: Molex
Conn Wire to Board HDR 18 POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 18 POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 441.22 грн |
| 2000+ | 425.44 грн |
| 0430451819 |
|
Виробник: Molex
Description: CONN HEADER SMD 18POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 18
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: CONN HEADER SMD 18POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 18
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
на замовлення 566 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 475.30 грн |
| 10+ | 388.97 грн |
| 100+ | 330.57 грн |