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0430452018

0430452018 Molex


PS-43045.pdf Виробник: Molex
Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
на замовлення 4800 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
200+294.37 грн
1000+ 233.44 грн
2000+ 228.44 грн
Мінімальне замовлення: 200
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Технічний опис 0430452018 Molex

Description: CONN HEADER SMD 20POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).

Інші пропозиції 0430452018 за ціною від 283.47 грн до 415.17 грн

Фото Назва Виробник Інформація Доступність
Ціна без ПДВ
0430452018 0430452018 Виробник : Molex PS-43045.pdf Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
на замовлення 5013 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+415.17 грн
10+ 350.16 грн
100+ 283.47 грн
0430452018 0430452018 Виробник : Molex 0430452018_pcb_headers.pdf Conn Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0™ T/R
на замовлення 700 шт:
термін постачання 21-31 дні (днів)