Технічний опис 0459713515 Molex
Description: CONN HD ARRAY RCPT 300P SMD GOLD, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 300, Pitch: 0.050" (1.27mm), Height Above Board: 0.317" (8.05mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm, Part Status: Active, Number of Rows: 10.
Інші пропозиції 0459713515
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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0459713515 | Виробник : Molex |
 Conn Board to Board RCP 300 POS 1.27mm Solder ST Top Entry SMD SEARAY T/R |
товару немає в наявності |
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0459713515 | Виробник : Molex |
Description: CONN HD ARRAY RCPT 300P SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 300 Pitch: 0.050" (1.27mm) Height Above Board: 0.317" (8.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm Part Status: Active Number of Rows: 10 |
товару немає в наявності |
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0459713515 | Виробник : Molex |
Description: CONN HD ARRAY RCPT 300P SMD GOLD Features: Board Guide Packaging: Cut Tape (CT) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 300 Pitch: 0.050" (1.27mm) Height Above Board: 0.317" (8.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm Part Status: Active Number of Rows: 10 |
товару немає в наявності |