0462071112 Molex
Виробник: Molex
Description: CONN HEADER VERT 12POS 4.2MM
Packaging: Tray
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 12
Number of Rows: 2
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.165" (4.20mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.176" (4.46mm)
Insulation Height: 0.535" (13.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.165" (4.20mm)
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Технічний опис 0462071112 Molex
Description: CONN HEADER VERT 12POS 4.2MM, Packaging: Tray, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 12, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.165" (4.20mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.176" (4.46mm), Insulation Height: 0.535" (13.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.165" (4.20mm).
Інші пропозиції 0462071112
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
0462071112 | Molex |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 2.36mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray |
товару немає в наявності |
Мінімальне замовлення: 2880 шт В кошику од. на суму грн. |
| 0462071112 |
|
Виробник: Molex
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 2.36mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 2.36mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
товару немає в наявності
Мінімальне замовлення: 2880 шт
В кошику
од. на суму грн.