0465575545 Molex
Виробник: MolexDescription: CONN HD ARRAY RCPT 200P SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.317" (8.05mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm
Number of Rows: 4
на замовлення 119 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2065.92 грн |
| 10+ | 1690.31 грн |
| 25+ | 1584.47 грн |
| 50+ | 1476.50 грн |
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Технічний опис 0465575545 Molex
Description: CONN HD ARRAY RCPT 200P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 200, Pitch: 0.050" (1.27mm), Height Above Board: 0.317" (8.05mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm, Number of Rows: 4.
Інші пропозиції 0465575545
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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0465575545 | Виробник : Molex |
Conn Board to Board RCP 200 POS 1.27mm Solder ST SMD SEARAY T/R |
товару немає в наявності |
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0465575545 | Виробник : Molex |
Description: CONN HD ARRAY RCPT 200P SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.317" (8.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 10.5mm, 11mm, 11.5mm, 12.5mm, 13mm, 15mm Number of Rows: 4 |
товару немає в наявності |