0466220200 Molex
на замовлення 1856 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 501+ | 25.51 грн |
| 509+ | 25.11 грн |
| 517+ | 24.71 грн |
| 525+ | 23.44 грн |
| 534+ | 21.35 грн |
| 1000+ | 20.15 грн |
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Технічний опис 0466220200 Molex
Description: CONN HEADER SMD R/A 2POS 3MM, Packaging: Tape & Reel (TR), Features: Blind Mating, Board Guide, Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 2, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Інші пропозиції 0466220200 за ціною від 21.59 грн до 117.52 грн
| Фото | Назва | Виробник | Інформація |
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0466220200 | Виробник : Molex |
 Conn Wire to Board HDR 2 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI T/R |
на замовлення 1856 шт: термін постачання 21-31 дні (днів) |
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0466220200 | Виробник : Molex |
Description: CONN HEADER SMD R/A 2POS 3MM Packaging: Tape & Reel (TR) Features: Blind Mating, Board Guide Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 2 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
на замовлення 1840 шт: термін постачання 21-31 дні (днів) |
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0466220200 | Виробник : Molex |
Description: CONN HEADER SMD R/A 2POS 3MM Packaging: Cut Tape (CT) Features: Blind Mating, Board Guide Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 2 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
на замовлення 2027 шт: термін постачання 21-31 дні (днів) |
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0466220200 | Виробник : Molex |
Conn Wire to Board HDR 2 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI™ T/R |
товару немає в наявності |