0466220300 Molex
на замовлення 2070 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 454+ | 27.32 грн |
| 461+ | 26.90 грн |
| 468+ | 26.48 грн |
| 475+ | 25.13 грн |
| 483+ | 22.89 грн |
| 500+ | 21.61 грн |
| 1000+ | 21.25 грн |
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Технічний опис 0466220300 Molex
Description: CONN HEADER SMD R/A 3POS 3MM, Features: Blind Mating, Board Guide, Packaging: Tape & Reel (TR), Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Інші пропозиції 0466220300 за ціною від 22.77 грн до 29.73 грн
| Фото | Назва | Виробник | Інформація |
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0466220300 | Виробник : Molex |
 Conn Wire to Board HDR 3 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI T/R |
на замовлення 2070 шт: термін постачання 21-31 дні (днів) |
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0466220300 | Виробник : Molex |
Conn Wire to Board HDR 3 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI™ T/R |
товару немає в наявності |
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0466220300 | Виробник : Molex |
Description: CONN HEADER SMD R/A 3POS 3MM Features: Blind Mating, Board Guide Packaging: Tape & Reel (TR) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
товару немає в наявності |
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0466220300 | Виробник : Molex |
Description: CONN HEADER SMD R/A 3POS 3MM Features: Blind Mating, Board Guide Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
товару немає в наявності |