0466220400 Molex
на замовлення 1519 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 417+ | 29.70 грн |
| 424+ | 29.24 грн |
| 431+ | 28.78 грн |
| 438+ | 27.31 грн |
| 445+ | 24.88 грн |
| 500+ | 23.49 грн |
| 1000+ | 23.10 грн |
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Технічний опис 0466220400 Molex
Description: CONN HEADER SMD R/A 4POS 3MM, Features: Blind Mating, Board Guide, Packaging: Tape & Reel (TR), Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Інші пропозиції 0466220400 за ціною від 24.75 грн до 129.84 грн
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0466220400 | Виробник : Molex |
 Conn Wire to Board HDR 4 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI T/R |
на замовлення 1519 шт: термін постачання 21-31 дні (днів) |
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0466220400 | Виробник : Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Features: Blind Mating, Board Guide Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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0466220400 | Виробник : Molex |
Conn Wire to Board HDR 4 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI™ T/R |
товару немає в наявності |
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0466220400 | Виробник : Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Features: Blind Mating, Board Guide Packaging: Tape & Reel (TR) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
товару немає в наявності |