08-2511-11 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 580.37 грн |
| 10+ | 517.60 грн |
| 25+ | 359.51 грн |
| 50+ | 331.64 грн |
| 100+ | 312.83 грн |
| 250+ | 305.17 грн |
| 500+ | 296.80 грн |
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Технічний опис 08-2511-11 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled.
Інші пропозиції 08-2511-11
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 08-2511-11 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDTermination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled |
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