08-2823-90 Aries Electronics
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 597.42 грн |
| 10+ | 530.37 грн |
| 25+ | 435.10 грн |
| 50+ | 423.36 грн |
| 100+ | 355.51 грн |
| 250+ | 336.60 грн |
| 500+ | 324.86 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
31-40 дні (днів)
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Технічний опис 08-2823-90 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 08-2823-90
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 08-2823-90 | Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
Мінімальне замовлення: 77 шт В кошику од. на суму грн. |
| 08-2823-90 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
Мінімальне замовлення: 77 шт
В кошику
од. на суму грн.