Технічний опис 08-2823-90 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 08-2823-90
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 08-2823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 77 шт В кошику од. на суму грн. |
| 08-2823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 77 шт
В кошику
од. на суму грн.



