08-2823-90 Aries Electronics
на замовлення 79 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 640.01 грн |
| 10+ | 568.18 грн |
| 25+ | 466.12 грн |
| 50+ | 453.54 грн |
| 100+ | 380.86 грн |
| 250+ | 360.59 грн |
| 500+ | 348.01 грн |
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Технічний опис 08-2823-90 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 08-2823-90
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 08-2823-90 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |