Технічний опис 08-6810-90C Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 08-6810-90C
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
08-6810-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 55 шт В кошику од. на суму грн. |
| 08-6810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 55 шт
В кошику
од. на суму грн.




