Технічний опис 09-0503-30 Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 9 (1 x 9), Type: SIP, Mounting Type: Through Hole, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm).
Інші пропозиції 09-0503-30
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 09-0503-30 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLDContact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 9 (1 x 9) Type: SIP Mounting Type: Through Hole Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) |
товару немає в наявності |
Мінімальне замовлення: 123 шт В кошику од. на суму грн. |
| 09-0503-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Description: CONN SOCKET SIP 9POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
товару немає в наявності
Мінімальне замовлення: 123 шт
В кошику
од. на суму грн.



