| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 680.37 грн |
| 10+ | 569.38 грн |
| 25+ | 464.45 грн |
| 50+ | 442.27 грн |
| 100+ | 421.40 грн |
| 250+ | 394.65 грн |
| 500+ | 375.74 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
31-40 дні (днів)
Відгуки про товар
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Технічний опис 10-2822-90 Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Інші пропозиції 10-2822-90 за ціною від 476.20 грн до 694.95 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
10-2822-90 | Aries Electronics |
 Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
|
| 10-2822-90 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 694.95 грн |
| 10+ | 568.50 грн |
| 25+ | 532.87 грн |
| 50+ | 476.20 грн |