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10-8335-610C

10-8335-610C Aries Electronics

13008-elevated-display-socket.pdf
Виробник: Aries Electronics
IC & Component Sockets ELEV. SCKT .3 CENTER COLLET 10 PINS
на замовлення 95 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
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Технічний опис 10-8335-610C Aries Electronics

Description: CONN IC DIP SOCKET 10POS GOLD, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Elevated, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).

Інші пропозиції 10-8335-610C

Фото Назва Виробник Інформація Доступність Ціна без ПДВ
10-8335-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
 Мінімальне замовлення: 64 шт
В кошику  од. на суму  грн.
10-8335-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику  од. на суму  грн.