10061913-113FLF Amphenol Communications Solutions-FCI
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Технічний опис 10061913-113FLF Amphenol Communications Solutions-FCI
Description: CONN PCI EXP, Features: Board Guide, Locking Ramp, Solder Retention, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 164, Pitch: 0.039" (1.00mm), Operating Temperature: -55°C ~ 85°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 15.0µin (0.38µm), Contact Material: Copper Alloy, Part Status: Active, Number of Rows: 2.
Інші пропозиції 10061913-113FLF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 10061913-113FLF | Виробник : Amphenol ICC (FCI) |
Description: CONN PCI EXP Features: Board Guide, Locking Ramp, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 164 Pitch: 0.039" (1.00mm) Operating Temperature: -55°C ~ 85°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 15.0µin (0.38µm) Contact Material: Copper Alloy Part Status: Active Number of Rows: 2 |
товару немає в наявності |