10146153-2600RLF Amphenol ICC (FCI)
Виробник: Amphenol ICC (FCI)
Description: MINITEK MICROSPEED 1.00MM, BOARD
Features: Board Guide, Shielded
Packaging: Tape & Reel (TR)
Connector Type: Header
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 26
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.94µin (0.100µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.254" (6.45mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.059" (1.50mm)
| Кількість | Ціна |
|---|---|
| 520+ | 139.54 грн |
| 1040+ | 127.96 грн |
| 1560+ | 124.36 грн |
| 2600+ | 112.57 грн |
| 3640+ | 109.94 грн |
| 5200+ | 107.21 грн |
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Технічний опис 10146153-2600RLF Amphenol ICC (FCI)
Description: MINITEK MICROSPEED 1.00MM, BOARD, Features: Board Guide, Shielded, Packaging: Tape & Reel (TR), Connector Type: Header, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 26, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.254" (6.45mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.059" (1.50mm).
Інші пропозиції 10146153-2600RLF за ціною від 130.68 грн до 238.07 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||||||||
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10146153-2600RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10146153-2600RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Gold über Palladium-Nickel-Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 26Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Minitek MicroSpeed Series productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 520 шт: термін постачання 21-31 дні (днів) |
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10146153-2600RLF | Виробник : Amphenol ICC (FCI) |
Description: MINITEK MICROSPEED 1.00MM, BOARD Features: Board Guide, Shielded Packaging: Cut Tape (CT) Connector Type: Header Current Rating (Amps): 1A Mounting Type: Surface Mount, Right Angle Number of Positions: 26 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.254" (6.45mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) |
на замовлення 8121 шт: термін постачання 21-31 дні (днів) |
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10146153-2600RLF | Виробник : Amphenol FCI |
Board to Board & Mezzanine Connectors MINITEK |
на замовлення 161 шт: термін постачання 21-30 дні (днів) |
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