10150095-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Виробник: AMPHENOL COMMUNICATIONS SOLUTIONSDescription: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150095-3200RLF - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Bronze
Steckverbindermontage: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Anzahl der Kontakte: 32Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: FCI Minitek MicroSpeed
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (17-Jan-2023)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 186.76 грн |
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Технічний опис 10150095-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Description: CONN MICROSPEED 1.00MM BOARD-, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 32, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.207" (5.25mm), Row Spacing - Mating: 0.059" (1.50mm), Number of Rows: 2.
Інші пропозиції 10150095-3200RLF за ціною від 142.48 грн до 419.97 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||
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10150095-3200RLF | Виробник : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 960 шт: термін постачання 21-31 дні (днів) |
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10150095-3200RLF | Виробник : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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10150095-3200RLF | Виробник : Amphenol FCI |
Board to Board & Mezzanine Connectors 1.00MM MINITEK BTB RA |
на замовлення 932 шт: термін постачання 21-30 дні (днів) |
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10150095-3200RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150095-3200RLF - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze Steckverbindermontage: Oberflächenmontage, abgewinkelt usEccn: EAR99 Anzahl der Kontakte: 32Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed productTraceability: No Anzahl der Reihen: 2Rows Rastermaß: 1mm |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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10150095-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.207" (5.25mm) Row Spacing - Mating: 0.059" (1.50mm) Number of Rows: 2 |
на замовлення 493 шт: термін постачання 21-31 дні (днів) |
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10150095-3200RLF | Виробник : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
товар відсутній |
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| 10150095-3200RLF | Виробник : FCI |
Conn Wire to Board F 32 POS 1mm Solder RA SMD T/R |
товар відсутній |
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10150095-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Receptacle Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.207" (5.25mm) Row Spacing - Mating: 0.059" (1.50mm) Number of Rows: 2 |
товар відсутній |