10150096-3200RLF Amphenol Communications Solutions-FCI
Виробник: Amphenol Communications Solutions-FCIMinitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance.
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 239.47 грн |
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Технічний опис 10150096-3200RLF Amphenol Communications Solutions-FCI
Description: CONN MICROSPEED 1.00MM BOARD-, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 32, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Rectangular, Insulation Height: 0.266" (6.76mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.059" (1.50mm), Contact Length - Mating: 0.114" (2.90mm).
Інші пропозиції 10150096-3200RLF за ціною від 221.47 грн до 424.49 грн
| Фото | Назва | Виробник | Інформація |
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10150096-3200RLF | Виробник : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150096-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32 euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 2 Rastermaß: 1 SVHC: No SVHC (17-Jan-2023) |
на замовлення 1188 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Insulation Height: 0.266" (6.76mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : Amphenol FCI |
Board to Board & Mezzanine Connectors MICROSPEED RA MALE 32P-10150096-3200RLF |
на замовлення 1147 шт: термін постачання 21-30 дні (днів) |
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10150096-3200RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150096-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed Series productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 2Rows Rastermaß: 1mm |
на замовлення 400 шт: термін постачання 21-31 дні (днів) |
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| 10150096-3200RLF | Виробник : AMPHENOL |
Category: Signal connectors - Unclassified Description: Connector: wire-board Type of connector: wire-board |
на замовлення 2100 шт: термін постачання 21-30 дні (днів) |
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| 10150096-3200RLF | Виробник : FCI |
Conn Wire to Board M 32 POS 1mm Solder RA SMD T/R |
товар відсутній |
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10150096-3200RLF | Виробник : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
товар відсутній |
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10150096-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Insulation Height: 0.266" (6.76mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
товар відсутній |