10150096-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Виробник: AMPHENOL COMMUNICATIONS SOLUTIONS
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150096-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: N
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 32Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: FCI Minitek MicroSpeed Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, abgewinkelt
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (04-Feb-2026)
| Кількість | Ціна |
|---|---|
| 400+ | 260.87 грн |
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Технічний опис 10150096-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Description: CONN MICROSPEED 1.00MM BOARD-, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 32, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Rectangular, Insulation Height: 0.266" (6.76mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.059" (1.50mm), Contact Length - Mating: 0.114" (2.90mm).
Інші пропозиції 10150096-3200RLF за ціною від 62.90 грн до 517.70 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
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10150096-3200RLF | Виробник : Amphenol FCI |
Board to Board & Mezzanine Connectors MICROSPEED RA MALE 32P-10150096-3200RLF |
на замовлення 1113 шт: термін постачання 21-30 дні (днів) |
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10150096-3200RLF | Виробник : FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Insulation Height: 0.266" (6.76mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150096-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: FCI Minitek MicroSpeed Series productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 1002 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : AMPHENOL / PARTNER STOCK |
Description: AMPHENOL / PARTNER STOCK - 10150096-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: FCI Minitek MicroSpeed Series productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: To Be Advised |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| 10150096-3200RLF | Виробник : Burndy |
Conn Wire to Board M 32 POS 1mm Solder RA SMD T/R |
на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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| 10150096-3200RLF | Виробник : Burndy |
Conn Wire to Board M 32 POS 1mm Solder RA SMD T/R |
на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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10150096-3200RLF | Виробник : FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
товару немає в наявності |
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10150096-3200RLF | Виробник : FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
товару немає в наявності |
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10150096-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Insulation Height: 0.266" (6.76mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
товару немає в наявності |