Технічний опис 11-0511-10 Aries Electronics
Description: CONN SOCKET SIP 11POS TIN, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 11 (1 x 11), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Інші пропозиції 11-0511-10
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 11-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS TINPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. |
| 11-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.



