110-87-320-41-105101 Preci-dip
Виробник: Preci-dip
IC & Component Sockets 2.54mm, 20P, Surface mount, Gold Flash, 25.3x7.62x10.1x12.26
| Кількість | Ціна |
|---|---|
| 2+ | 268.02 грн |
| 10+ | 240.10 грн |
| 20+ | 177.36 грн |
| 100+ | 136.16 грн |
| 260+ | 124.99 грн |
| 1000+ | 124.29 грн |
| 1800+ | 118.01 грн |
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Технічний опис 110-87-320-41-105101 Preci-dip
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame.
Інші пропозиції 110-87-320-41-105101
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
110-87-320-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame |
товару немає в наявності |
Мінімальне замовлення: 1800 шт В кошику од. на суму грн. |
| 110-87-320-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
товару немає в наявності
Мінімальне замовлення: 1800 шт
В кошику
од. на суму грн.