110-93-316-41-001000 Mill-Max Manufacturing Corp.
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
| Кількість | Ціна |
|---|---|
| 2+ | 186.20 грн |
| 10+ | 152.40 грн |
| 25+ | 142.84 грн |
| 50+ | 127.63 грн |
| 100+ | 121.53 грн |
| 250+ | 113.92 грн |
| 500+ | 106.70 грн |
| 1000+ | 101.61 грн |
| 2500+ | 95.26 грн |
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Технічний опис 110-93-316-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 110-93-316-41-001000 за ціною від 102.22 грн до 195.53 грн
| Фото | Назва | Виробник | Інформація |
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110-93-316-41-001000 | Виробник : Mill-Max |
IC & Component Sockets 16P TIN PIN GLD CONT |
на замовлення 3887 шт: термін постачання 21-30 дні (днів) |
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