| Кількість | Ціна |
|---|---|
| 2+ | 206.88 грн |
| 10+ | 161.54 грн |
| 30+ | 129.35 грн |
| 100+ | 118.91 грн |
| 1120+ | 109.87 грн |
| 2800+ | 101.53 грн |
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Технічний опис 110-99-640-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 40POS TINLEAD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції 110-99-640-41-001000 за ціною від 137.00 грн до 209.67 грн
| Фото | Назва | Виробник | Інформація |
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110-99-640-41-001000 | Виробник : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS TINLEADPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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